公开(公告)号：US09967975B2

公开(公告)日：2018-05-08

申请号：US15143354

申请日：2016-04-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H05K1/09 ,  H05K1/02

CPC classification number: H05K1/09 ,  H05K1/0298 ,  H05K1/144 ,  H05K3/4614 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09472

Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.

公开(公告)号：US09370110B2

公开(公告)日：2016-06-14

申请号：US14225682

申请日：2014-03-26

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/4611 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/421 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/06 ,  H05K2203/0723 ,  H05K2203/143

Abstract: A method of manufacturing a multilayer substrate structure includes the steps of pre-treatment, pressing and post-treatment. A carrier plate provided with a circuit pattern layer is pressed against a plastic sheet. An interlayer connection pad is formed by drilling and filling the lower surface of the plastic sheet. The carrier plate, the plastic sheet, another plastic sheet and another carrier plate with a circuit pattern layer are pressed together, and then drilled/filled to form a multilayer stacked structure such that the two circuit pattern layers are indirectly and electrically connected to the interlayer connection pad, respectively. Therefore, it is possible to overcome the problem due to alignment tolerance by using the interlayer connection pad wider than alignment tolerance, and stacking the circuit layers, each having much finer line and smaller pitch.

Abstract translation: 制造多层基板结构的方法包括预处理，压制和后处理的步骤。 设置有电路图案层的承载板被压靠在塑料片上。 通过钻孔和填充塑料片的下表面形成夹层连接垫。 将载板，塑料片，另一塑料片和具有电路图案层的另一载体板压在一起，然后钻孔/填充以形成多层堆叠结构，使得两个电路图案层间接地并电连接到中间层 连接垫。 因此，可以通过使用比对准公差宽的层间连接焊盘来克服由于对准公差引起的问题，并且堆叠各个具有更细的线和更小间距的电路层。

公开(公告)号：US20150282333A1

公开(公告)日：2015-10-01

申请号：US14225682

申请日：2014-03-26

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu

IPC: H05K3/46 ,  H05K3/34 ,  H05K3/28 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K3/4611 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/421 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/06 ,  H05K2203/0723 ,  H05K2203/143

Abstract: A method of manufacturing a multilayer substrate structure includes the steps of pre-treatment, pressing and post-treatment. A carrier plate provided with a circuit pattern layer is pressed against a plastic sheet. An interlayer connection pad is formed by drilling and filling the lower surface of the plastic sheet. The carrier plate, the plastic sheet, another plastic sheet and another carrier plate with a circuit pattern layer are pressed together, and then drilled/filled to form a multilayer stacked structure such that the two circuit pattern layers are indirectly and electrically connected to the interlayer connection pad, respectively. Therefore, it is possible to overcome the problem due to alignment tolerance by using the interlayer connection pad wider than alignment tolerance, and stacking the circuit layers, each having much finer line and smaller pitch.

Abstract translation: 制造多层基板结构的方法包括预处理，压制和后处理的步骤。 设置有电路图案层的承载板被压靠在塑料片上。 通过钻孔和填充塑料片的下表面形成夹层连接垫。 将载板，塑料片，另一塑料片和具有电路图案层的另一载体板压在一起，然后钻孔/填充以形成多层堆叠结构，使得两个电路图案层间接地并电连接到中间层 连接垫。 因此，可以通过使用比对准公差宽的层间连接焊盘来克服由于对准公差引起的问题，并且堆叠各个具有更细的线和更小间距的电路层。

公开(公告)号：US20150041205A1

公开(公告)日：2015-02-12

申请号：US13960159

申请日：2013-08-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Hsueh-Ping Chien ,  Jun-Chung Hsu

IPC: H05K1/11

CPC classification number: H05K1/0268 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/09472

Abstract: A thin package structure with enhanced strength includes a support carrier plate and a thin circuit board. The thin circuit board is formed on the support carrier plate and includes a first circuit layer, a dielectric layer and a second circuit layer. The first circuit layer includes the first circuit patterns and the first connection pads. The dielectric layer covers the first circuit layer. The second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes the second circuit patterns and the second connection pads. Connection plugs are formed in the dielectric layer to connect the first and second connection pads. The support carrier plate provides mechanical strength to avoid warping or deforming. It is feasible to direct test the package structure without disassembling so as to improve the convenience in testing.

Abstract translation: 具有增强强度的薄封装结构包括支撑载板和薄电路板。 薄板电路板形成在支承载板上，包括第一电路层，电介质层和第二电路层。 第一电路层包括第一电路图案和第一连接焊盘。 电介质层覆盖第一电路层。 第二电路层形成在电介质层的上表面上或嵌入在电介质层的上表面中，并且包括第二电路图案和第二连接焊盘。 在电介质层中形成连接插头以连接第一和第二连接焊盘。 支撑载体板提供机械强度以避免翘曲或变形。 在不拆卸的情况下直接测试包装结构是可行的，以提高测试的便利性。

公开(公告)号：US20140290983A1

公开(公告)日：2014-10-02

申请号：US13853303

申请日：2013-03-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K3/4647 ,  H05K1/0366 ,  H05K3/38

Abstract: Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed. The adhesion between plastic film and the second circuit layer is greatly improved because the glass fiber layer of the plastic film filling up the space among the bumps is not deformed and exposed outwards. Therefore, the yield and reliability of the stacked multilayer structure is increased.

Abstract translation: 公开了一种堆叠的多层结构，包括具有凸起的第一电路层，堆叠在第一电路层上以填充凸块之间的空间以形成共面的塑料膜，以及形成在共面上的第二电路层 平面并连接到第一电路层。 该塑料膜包括嵌入并不暴露的玻璃纤维层。 由于填充凸块之间的空间的塑料膜的玻璃纤维层不会变形并向外露出，所以塑料膜与第二电路层之间的粘合性大大提高。 因此，层叠多层结构的成品率和可靠性提高。

公开(公告)号：US20130224513A1

公开(公告)日：2013-08-29

申请号：US13663141

申请日：2012-10-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Chi-Ming Lin ,  Tso-Hung Yeh ,  Ya-Hsiang Chen

IPC: H05K1/03

CPC classification number: H05K3/28 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0347

Abstract: A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface overlaps the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.

Abstract translation: 公开了一种具有多层电路结构的叠层电路板，其包括基板，第一电路金属层，第二电路金属层，第一纳米镀层，第二纳米镀层和覆盖层。 第一电路金属层嵌入衬底中或形成在衬底的平滑的至少一个表面上。 具有平滑表面的第一纳米镀层与第一电路金属层重叠。 第二纳米镀层形成在基板的另一个表面上，并填满覆盖层中的开口以电连接第一电路金属层。 通过纳米电镀层和覆盖层/基板之间的化学键合来改善连接粘附。 因此，电路金属层不需要粗糙化，电路密度增加。

公开(公告)号：US08083954B2

公开(公告)日：2011-12-27

申请号：US12131932

申请日：2008-06-03

Applicant: Chien-Wei Chang ,  Ting-Hao Lin ,  Yu-Te Lu

Inventor： Chien-Wei Chang ,  Ting-Hao Lin ,  Yu-Te Lu

IPC: H01B13/00

CPC classification number: B32B37/226 ,  B32B38/06 ,  B32B2305/342 ,  B32B2457/08 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/83005 ,  H01L2224/83132 ,  H05K1/023 ,  H05K1/185 ,  H05K1/188 ,  H05K3/025 ,  H05K2201/0355 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611

Abstract: A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal layer having the electronic component disposed thereon and the carrier plate by a dielectric film; removing the carrier plate and exposing the plating metal layer; and patterning at least one of the metal layer and the plating metal layer to be a circuit layer.

Abstract translation: 一种用于制造部件嵌入式PCB的方法包括：提供其上镀有电镀金属层的载体板; 将电子部件设置在载体板的电镀金属层上; 通过电介质膜将金属层层叠在其上设置有电子部件的电镀金属层和载体板上; 移除载体板并暴露电镀金属层; 并且将金属层和电镀金属层中的至少一个图案化为电路层。

公开(公告)号：US07875809B2

公开(公告)日：2011-01-25

申请号：US11766194

申请日：2007-06-21

Applicant: Chien-Wei Chang ,  Ting-Hao Lin ,  Jen-Fang Chang ,  Yu-Te Lu ,  Chia-Chi Lo

Inventor： Chien-Wei Chang ,  Ting-Hao Lin ,  Jen-Fang Chang ,  Yu-Te Lu ,  Chia-Chi Lo

IPC: H05K1/00

CPC classification number: H05K3/4602 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: A circuit board includes a core layer substrate having a plated through hole filled with a dielectric material. The plated through hole has a sidewall coated with an inner electroless copper layer, and an electroplated metal layer plated on the inner electroless copper layer before the plated through hole is filled with the dielectric material. The outer portion of the filled plated through hole is thicker than the center portion and tapered toward the center portion to form a depressed surface on the filled plated through hole. The core layer substrate is covered with a patterned electroless copper layer and a patterned electroplated copper layer that connect with the inner electroless copper layer and electroplated metal layer of the plated through hole. The patterned electroplated copper layer forms a flat copper pad above the plated through hole.

Abstract translation: 电路板包括具有填充有介电材料的电镀通孔的芯层基板。 电镀通孔具有涂覆有内部化学镀铜层的侧壁和在电镀通孔填充有电介质材料之前镀在内部化学镀铜层上的电镀金属层。 填充电镀通孔的外部比中心部分厚，并且朝向中心部分逐渐变细，以在填充的电镀通孔上形成凹陷表面。 芯层衬底被覆有图案化的无电铜层和与电镀通孔的内部化学镀铜层和电镀金属层连接的图案化电镀铜层。 图案化的电镀铜层在电镀通孔上方形成平坦的铜焊盘。

公开(公告)号：US07353591B2

公开(公告)日：2008-04-08

申请号：US11379059

申请日：2006-04-18

Applicant: Tso-Hung Yeh

Inventor： Tso-Hung Yeh

IPC: H05K3/36

CPC classification number: H05K3/0097 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/025 ,  H05K3/4644 ,  H05K2203/0169 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-pad side or ball side wiring layers required by the coreless substrate simultaneously. The two metal layers along with their respective wiring layers are then separated from the base into two independent semi-products of the coreless substrate. The method then develops from the other sides of the two semi-products the laminate side wiring layers required by the coreless substrate.

Abstract translation: 本发明提供一种无芯基板的制造方法。 该方法首先提供了一个基部，其底面和底面分别由与基座分离的金属层覆盖。 从两个金属层开始，该方法同时开发无芯基板所需的凸块焊盘侧或球侧布线层。 然后将两个金属层及其各自的布线层从基底分离成无芯基板的两个独立的半成品。 然后，该方法从两个半成品的另一侧发展成无芯基板所需的层压板侧布线层。

公开(公告)号：US11495390B2

公开(公告)日：2022-11-08

申请号：US16285138

申请日：2019-02-25

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F27/28 ,  H05K1/03 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46

Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.