양방향 화학기상증착 시스템 및 이를 이용한 펄스형 공정진행 방법
    31.
    发明公开
    양방향 화학기상증착 시스템 및 이를 이용한 펄스형 공정진행 방법 失效
    双重化学气相沉积系统及其使用的脉冲加工方法

    公开(公告)号:KR1020060037550A

    公开(公告)日:2006-05-03

    申请号:KR1020040086540

    申请日:2004-10-28

    CPC classification number: C23C16/409 C23C16/44

    Abstract: 양방향 화학기상증착 시스템 및 이를 이용한 펄스형 공정 진행 방법이 개시된다. 본 발명에 따른 양방향 화학기상증착 시스템은, 제 1 및 제 2 프로세스 챔버들, 하나 이상의 반응 소스들, 및 상기 반응 소스들에 대응되는 반응 소스 공급기들을 포함한다. 반응 소스 공급기들은 상기 반응 소스 각각과 연결되는 제 1 배관부, 일단은 상기 제 1 배관부와 연결되고 다른 단은 상기 제 1 프로세스 챔버와 연결되는 제 2 배관부, 및 일단은 상기 제 1 배관부와 연결되고 다른 단은 상기 제 2 프로세스 챔버와 연결되는 제 3 배관부를 포함한다.

    실리카 하이브리드 플랫폼용 브이 그루브 구조
    33.
    发明公开
    실리카 하이브리드 플랫폼용 브이 그루브 구조 失效
    用于通过形成具有V形沟槽和辅助V形沟槽之间的最小线宽度的蚀刻掩模来防止下切割原子的产生的二氧化硅混合平台的V形槽结构

    公开(公告)号:KR1020050015517A

    公开(公告)日:2005-02-21

    申请号:KR1020030054373

    申请日:2003-08-06

    Inventor: 정선태 구준모

    Abstract: PURPOSE: A V-shaped groove structure of a silica hybrid platform is provided to remove an undercut phenomenon which obstructs an optical fiber packaging by separating an etching mask based on a minimum line width between the V-shaped groove and an auxiliary V-shaped groove. CONSTITUTION: A hybrid platform(10) includes a V-shaped groove(20) for connecting an optical waveguide(11) to an optical fiber. The V-shaped groove corresponds to the optical waveguide. An auxiliary V-shaped grooves(30,31) are formed in a predetermined interval on both sides of the V-shaped groove. An etching mask is easily separated in a final process by a minimum line width between the V-shaped groove and the auxiliary V-shaped grooves. A depth and a line width of the auxiliary V-shaped grooves are smaller than a depth and a line width of the V-shaped groove.

    Abstract translation: 目的:提供二氧化硅混合平台的V形槽结构,通过基于V形槽和辅助V形槽之间的最小线宽分离蚀刻掩模来消除阻碍光纤包装的底切现象 。 构成:混合平台(10)包括用于将光波导(11)连接到光纤的V形槽(20)。 V形槽对应于光波导。 在V形槽的两侧以预定间隔形成辅助V形槽(30,31)。 蚀刻掩模在最终工艺中容易地在V形槽和辅助V形槽之间的最小线宽分离。 辅助V形槽的深度和线宽小于V形槽的深度和线宽。

    실리콘 웨이퍼 제조용 화염가수분해 증착 장치
    34.
    发明授权
    실리콘 웨이퍼 제조용 화염가수분해 증착 장치 失效
    실리콘웨이퍼제조용화염가수분해증착장치

    公开(公告)号:KR100446517B1

    公开(公告)日:2004-09-04

    申请号:KR1020020005393

    申请日:2002-01-30

    Inventor: 구준모

    Abstract: PURPOSE: A flame hydrolysis deposition apparatus for silicon wafer fabrication is provided to form uniformly a silica layer on the surface of a silicon wafer by using two or more torches for performing an oxidation process and a hydrolysis process. CONSTITUTION: A flame hydrolysis deposition apparatus for fabricating a silicon wafer includes a turntable(23a), a plurality of torches(25a,25b), and a plurality of absorption and exhaust units(27a,27b). The turntable is used for loading and rotating a plurality of silicon wafers. The torches are used for generating silica particles by using an oxidation process and a hydrolysis process for flame material gases and chemical reaction gases. The absorption and exhaust units are used for absorbing or exhausting the silica particles which are not deposited on the silicon wafer. The torches are arranged in an interval of the same angle.

    Abstract translation: 目的:提供一种用于硅晶片制造的火焰水解沉积设备,以通过使用两个或更多个炬进行氧化处理和水解处理,在硅晶片的表面上均匀地形成二氧化硅层。 构成:用于制造硅晶片的火焰水解沉积设备包括转盘(23a),多个喷灯(25a,25b)以及多个吸收和排气单元(27a,27b)。 转盘用于装载和旋转多个硅晶片。 炬用于通过使用火焰材料气体和化学反应气体的氧化过程和水解过程来产生二氧化硅颗粒。 吸收和排气单元用于吸收或排出未沉积在硅晶片上的二氧化硅颗粒。 火炬以相同角度的间隔排列。

    비휘발성 메모리 소자 및 그 동작 방법
    37.
    发明公开
    비휘발성 메모리 소자 및 그 동작 방법 有权
    非易失性存储器件及其操作方法

    公开(公告)号:KR1020100013886A

    公开(公告)日:2010-02-10

    申请号:KR1020080075619

    申请日:2008-08-01

    CPC classification number: G11C8/14 G11C5/02 G11C5/025 H01L27/2436 H01L27/2463

    Abstract: PURPOSE: A non-volatile memory device and a method of operating the same are provided to implement random access to memory cells by appropriately selecting a bit line and a word line. CONSTITUTION: A plurality of variable resistance members(R) are capable of being stacked in one layer and storing data. At least one bit line for selecting layers is combined with a first end of a plurality of variable resistance member. A plurality of bit line(BL1,BL2,BL3) are combined with a second end(a2) of a plurality of variable resistance member. A plurality of select transistors(Ts) are combined between a plurality of bit lines and plurality of variable resistance member. A plurality of word line(WL1,WL2,WL3) are combined with a plurality of select transistors in order to control the on-off of a plurality of select transistors.

    Abstract translation: 目的:提供非易失性存储器件及其操作方法,通过适当地选择位线和字线来实现对存储器单元的随机存取。 构成:多个可变电阻构件(R)能够堆叠在一层中并存储数据。 用于选择层的至少一个位线与多个可变电阻构件的第一端组合。 多个位线(BL1,BL2,BL3)与多个可变电阻部件的第二端(a2)组合。 多个选择晶体管(Ts)组合在多个位线和多个可变电阻部件之间。 多个字线(WL1,WL2,WL3)与多个选择晶体管组合,以便控制多个选择晶体管的导通。

    비휘발성 메모리 소자 및 그 제조 방법
    38.
    发明公开
    비휘발성 메모리 소자 및 그 제조 방법 无效
    非易失性存储器件及其制造方法

    公开(公告)号:KR1020100007254A

    公开(公告)日:2010-01-22

    申请号:KR1020080067812

    申请日:2008-07-11

    Abstract: PURPOSE: A non-volatile memory device and method of fabricating the same are provided to improve the degree of integration. CONSTITUTION: The stack structure of the second control gate electrode(120b) and the first control gate electrode(120a) is offered with a plurality of lines. The stack structure of first control gate electrodes and stack structure of second control gate electrodes are by turns arranged. First control gate electrodes and second control gate electrodes are arranged two-dimensionally in on the plane. A plurality of interlayer dielectric layer(110) is offered between interval and the second semiconductor layer(160b) of the semiconductor layer(160a).

    Abstract translation: 目的:提供非易失性存储器件及其制造方法以提高积分度。 构成:第二控制栅电极(120b)和第一控制栅电极(120a)的堆叠结构具有多条线。 第一控制栅极的堆叠结构和第二控制栅电极的堆叠结构依次排列。 第一控制栅电极和第二控制栅极电极在二维平面上排列。 在半导体层(160a)的间隔和第二半导体层(160b)之间提供多个层间电介质层(110)。

    비휘발성 메모리 소자 및 그 제조 방법
    39.
    发明公开
    비휘발성 메모리 소자 및 그 제조 방법 无效
    非易失性存储器件及其制造方法

    公开(公告)号:KR1020100007229A

    公开(公告)日:2010-01-22

    申请号:KR1020080067766

    申请日:2008-07-11

    Abstract: PURPOSE: A non-volatile memory device and method of fabricating the same are provided to improve the degree of integration. CONSTITUTION: A plurality of semiconductor layers(120a) is laminated in a plurality of layers. A plurality of second semiconductor layers(120b) is laminated in a plurality of layers. A plurality of interlayer dielectric layer(110) is offered between interval and second semiconductor layers of semiconductor layers. The first control gate electrode(160a) is extended through semiconductor layers. Each first blocking insulating layer(150a) is extended through semiconductor layers.

    Abstract translation: 目的:提供非易失性存储器件及其制造方法以提高积分度。 构成:将多个半导体层(120a)层叠成多层。 多个第二半导体层(120b)层叠成多层。 在半导体层的间隔和第二半导体层之间提供多个层间介质层(110)。 第一控制栅电极(160a)延伸穿过半导体层。 每个第一阻挡绝缘层(150a)延伸穿过半导体层。

    비휘발성 메모리 장치 및 그 동작 방법
    40.
    发明公开
    비휘발성 메모리 장치 및 그 동작 방법 无效
    非易失性存储器件及其操作方法

    公开(公告)号:KR1020090035203A

    公开(公告)日:2009-04-09

    申请号:KR1020070100344

    申请日:2007-10-05

    CPC classification number: G11C16/0483 H01L27/11521 H01L27/11568

    Abstract: A non-volatile memory device and an operation method thereof are provided to suppress the damage of outermost memory cell transistors by performing the programming and read out operation without using the channel boosting. A non-volatile memory device comprises one or more main strings(MS1,MS2) and a charge supply line(CSL). The main string comprises the first sub string(TM1_1~TMn_1) and the second sub string(TM1_2~TMn_2). Each substring comprises a plurality of memory cell transistors. The charge sourcing line supplies or blocks the electric charge to the first and second sub strings of the main string. The main string comprises the first and second ground-selection transistors(TGS1,TGS3,TGS2,TGS4) and the first and second sub string selection transistors(TSI1,TSI3,TSI2,TSI4). The first and second ground-selection transistors are connected to the first and second sub strings. The first and second sub string selection transistors are connected to the first and second ground-selection transistors.

    Abstract translation: 提供一种非易失性存储器件及其操作方法,以通过在不使用通道升压的情况下执行编程和读出操作来抑制最外存储单元晶体管的损坏。 非易失性存储器件包括一个或多个主串(MS1,MS2)和充电电源线(CSL)。 主串包括第一子串(TM1_1〜TMn_1)和第二子串(TM1_2〜TMn_2)。 每个子串包括多个存储单元晶体管。 电荷源线向主串的第一和第二子串提供或阻断电荷。 主串包括第一和第二接地选择晶体管(TGS1,TGS3,TGS2,TGS4)和第一和第二子串选择晶体管(TSI1,TSI3,TSI2,TSI4)。 第一和第二接地选择晶体管连接到第一和第二子串。 第一和第二子串选择晶体管连接到第一和第二接地选择晶体管。

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