Abstract:
양방향 화학기상증착 시스템 및 이를 이용한 펄스형 공정 진행 방법이 개시된다. 본 발명에 따른 양방향 화학기상증착 시스템은, 제 1 및 제 2 프로세스 챔버들, 하나 이상의 반응 소스들, 및 상기 반응 소스들에 대응되는 반응 소스 공급기들을 포함한다. 반응 소스 공급기들은 상기 반응 소스 각각과 연결되는 제 1 배관부, 일단은 상기 제 1 배관부와 연결되고 다른 단은 상기 제 1 프로세스 챔버와 연결되는 제 2 배관부, 및 일단은 상기 제 1 배관부와 연결되고 다른 단은 상기 제 2 프로세스 챔버와 연결되는 제 3 배관부를 포함한다.
Abstract:
반도체 장치의 커패시터, 이를 포함하는 메모리 소자 및 커패시터 제조방법에 관해 개시되어 있다. 개시된 본 발명은 귀금속 합금 또는 그 산화물로된 단층의 하부전극, 상기 하부전극 상에 구비된 유전막 및 상기 유전막 상에 구비된 상부전극을 포함하는 것을 특징으로 하는 커패시터 및 그 제조 방법을 제공하고, 커패시터를 포함하는 메모리 소자도 제공한다.
Abstract:
PURPOSE: A V-shaped groove structure of a silica hybrid platform is provided to remove an undercut phenomenon which obstructs an optical fiber packaging by separating an etching mask based on a minimum line width between the V-shaped groove and an auxiliary V-shaped groove. CONSTITUTION: A hybrid platform(10) includes a V-shaped groove(20) for connecting an optical waveguide(11) to an optical fiber. The V-shaped groove corresponds to the optical waveguide. An auxiliary V-shaped grooves(30,31) are formed in a predetermined interval on both sides of the V-shaped groove. An etching mask is easily separated in a final process by a minimum line width between the V-shaped groove and the auxiliary V-shaped grooves. A depth and a line width of the auxiliary V-shaped grooves are smaller than a depth and a line width of the V-shaped groove.
Abstract:
PURPOSE: A flame hydrolysis deposition apparatus for silicon wafer fabrication is provided to form uniformly a silica layer on the surface of a silicon wafer by using two or more torches for performing an oxidation process and a hydrolysis process. CONSTITUTION: A flame hydrolysis deposition apparatus for fabricating a silicon wafer includes a turntable(23a), a plurality of torches(25a,25b), and a plurality of absorption and exhaust units(27a,27b). The turntable is used for loading and rotating a plurality of silicon wafers. The torches are used for generating silica particles by using an oxidation process and a hydrolysis process for flame material gases and chemical reaction gases. The absorption and exhaust units are used for absorbing or exhausting the silica particles which are not deposited on the silicon wafer. The torches are arranged in an interval of the same angle.
Abstract:
PURPOSE: A non-volatile memory device and a method of operating the same are provided to implement random access to memory cells by appropriately selecting a bit line and a word line. CONSTITUTION: A plurality of variable resistance members(R) are capable of being stacked in one layer and storing data. At least one bit line for selecting layers is combined with a first end of a plurality of variable resistance member. A plurality of bit line(BL1,BL2,BL3) are combined with a second end(a2) of a plurality of variable resistance member. A plurality of select transistors(Ts) are combined between a plurality of bit lines and plurality of variable resistance member. A plurality of word line(WL1,WL2,WL3) are combined with a plurality of select transistors in order to control the on-off of a plurality of select transistors.
Abstract:
PURPOSE: A non-volatile memory device and method of fabricating the same are provided to improve the degree of integration. CONSTITUTION: The stack structure of the second control gate electrode(120b) and the first control gate electrode(120a) is offered with a plurality of lines. The stack structure of first control gate electrodes and stack structure of second control gate electrodes are by turns arranged. First control gate electrodes and second control gate electrodes are arranged two-dimensionally in on the plane. A plurality of interlayer dielectric layer(110) is offered between interval and the second semiconductor layer(160b) of the semiconductor layer(160a).
Abstract:
PURPOSE: A non-volatile memory device and method of fabricating the same are provided to improve the degree of integration. CONSTITUTION: A plurality of semiconductor layers(120a) is laminated in a plurality of layers. A plurality of second semiconductor layers(120b) is laminated in a plurality of layers. A plurality of interlayer dielectric layer(110) is offered between interval and second semiconductor layers of semiconductor layers. The first control gate electrode(160a) is extended through semiconductor layers. Each first blocking insulating layer(150a) is extended through semiconductor layers.
Abstract:
A non-volatile memory device and an operation method thereof are provided to suppress the damage of outermost memory cell transistors by performing the programming and read out operation without using the channel boosting. A non-volatile memory device comprises one or more main strings(MS1,MS2) and a charge supply line(CSL). The main string comprises the first sub string(TM1_1~TMn_1) and the second sub string(TM1_2~TMn_2). Each substring comprises a plurality of memory cell transistors. The charge sourcing line supplies or blocks the electric charge to the first and second sub strings of the main string. The main string comprises the first and second ground-selection transistors(TGS1,TGS3,TGS2,TGS4) and the first and second sub string selection transistors(TSI1,TSI3,TSI2,TSI4). The first and second ground-selection transistors are connected to the first and second sub strings. The first and second sub string selection transistors are connected to the first and second ground-selection transistors.