公开(公告)号：GB2453283B

公开(公告)日：2012-01-11

申请号：GB0822743

申请日：2007-06-26

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN ,  RAO VALLURI R

IPC: H01L45/00 ,  B81B3/00 ,  G11C16/02 ,  H01L21/8247 ,  H01L27/108 ,  H01L27/115 ,  H01L27/24

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

公开(公告)号：DE60332351D1

公开(公告)日：2010-06-10

申请号：DE60332351

申请日：2003-08-13

Applicant: INTEL CORP

Inventor： MA QING

IPC: B81B3/00 ,  H01H61/00 ,  H01H1/00 ,  H01H37/54 ,  H01H61/01

Abstract: A microelectromechanical system (MEMS) that includes a first electro-thermal actuator, a second electro-thermal actuator and a beam having a first side and a second side. The first electro-thermal actuator applies a force to the first side of the beam as current passes through the first electro-thermal actuator and the second electro-thermal actuator applies a force to the second side of the beam as current passes through the second electro-thermal actuator.

公开(公告)号：AT467221T

公开(公告)日：2010-05-15

申请号：AT01908665

申请日：2001-01-22

Applicant: INTEL CORP

Inventor： CHENG PENG ,  MA QING

IPC: H01G5/16

Abstract: The invention relates to a variable capacitor and method of making it. The variable capacitor comprises a fixed charge plate disposed in a substrate, a movable charge plate disposed above the fixed charge plate, and a stiffener affixed to the movable charge plate. The movable charge plate may be patterned to form a movable actuator plate where the fixed charge plate is elevated above a fixed actuator plate.

公开(公告)号：DE60138416D1

公开(公告)日：2009-05-28

申请号：DE60138416

申请日：2001-08-10

Applicant: INTEL CORP

Inventor： MU XIAO-CHUN ,  MA QING ,  FUJIMOTO HARRY

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46

公开(公告)号：AT422103T

公开(公告)日：2009-02-15

申请号：AT05853644

申请日：2005-12-09

Applicant: INTEL CORP

Inventor： MA QING ,  LIN XINTIAN ,  BETTNER ALLEN

IPC: H01Q13/10

公开(公告)号：MY137043A

公开(公告)日：2008-12-31

申请号：MYPI20032608

申请日：2003-07-11

Applicant: INTEL CORP

Inventor： WANG LI-PENG ,  BAR-SADEH EYAL ,  RAO VALLURI R ,  HECK JOHN ,  MA QING ,  TRAN QUAN ,  TALALAYEVSKY ALEXANDER ,  GINSBURG EYAL

IPC: H03H9/24 ,  H03H3/02 ,  H03H9/56

Abstract: A FILM BULK ACOUSTIC RESONATOR FILTER (10) MAY BE FORMED WITH A PLURALITY OF INTERCONNECTED SERIES AND SHUNT FILM BULK ACOUSTIC RESONATORS (38) FORMED ON THE SAME MEMBRANE (35). EACH OF THE FILM BULK ACOUSTIC RESONATORS (38) MAY BE FORMED FROM A COMMON LOWER CONDUCTIVE LAYER WHICH IS DEFINED TO FORM THE BOTTOM ELECTRODE (32) OF EACH FILM BULK ACOUSTIC RESONATOR (38). A COMMON TOP CONDUCTIVE LAYER MAY BE DEFINED TO FORM EACH TOP ELECTRODE (36) OF EACH FILM BULK ACOUSTIC RESONATOR (38). A COMMON PIEZOELECTRIC FILM LAYER (34), THAT MAYOR MAY NOT BE PATTERNED, FORMS A CONTINUOUS OR DISCONTINUOUS FILM. FIG 1 & 9.

公开(公告)号：MY134508A

公开(公告)日：2007-12-31

申请号：MYPI20032216

申请日：2003-06-13

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01P5/12 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04

Abstract: A CONDUCTIVE BRIDGE (16) IN A SECOND CONDUCTIVE LAYER MAY BE UTILIZED TO JOIN A PAIR OF SPACED APART CONDUCTIVE STRIPS (12) IN A FIRST CONDUCTIVE LAYER. A GAP (44) BETWEEN THE FIRST AND SECOND STRIPS (12) MAY BE BRIDGED BY THE BRIDGE (16) WHILE ISOLATING BOTH THE FIRST AND SECOND STRIPS (12) AND THE BRIDGE (16) ITSELF FROM ANOTHER CONDUCTOR (18) WHICH EXTENDS THROUGH THE GAP (44) BETWEEN THE FIRST AND SECOND STRIPS (12).(FIG 1)

公开(公告)号：DE60311125T2

公开(公告)日：2007-10-25

申请号：DE60311125

申请日：2003-07-11

Applicant: INTEL CORP

Inventor： MA QING ,  SHIM DONG

IPC: B81B3/00 ,  H03H9/05 ,  H03H9/02 ,  H03H9/25

Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.

公开(公告)号：DE60123659T2

公开(公告)日：2007-08-16

申请号：DE60123659

申请日：2001-11-26

Applicant: INTEL CORP

Inventor： MA QING ,  RAO R ,  CHENG PENG

IPC: H01G5/16 ,  H01G5/38 ,  B81B3/00 ,  H01G5/00 ,  H01L21/20

Abstract: The present invention relates to a stepped micro electromechanical structure (MEMS) capacitor that is actuated by a plurality of MEMS switches. The MEMS switches may be within the stepped capacitor circuit, or they may be actuated by an independent circuit. The stepped capacitor may also be varied with intermediate steps of capacitance by providing at least one variable capacitor in the stepped MEMS capacitor structure.

公开(公告)号：GB2422720B

公开(公告)日：2006-12-20

申请号：GB0518966

申请日：2003-06-18

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01L23/522 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).