Abstract:
A method of writing a pattern on the surface of a substrate (13), for example a circuit on a resist-coated wafer, by an electron beam comprises the steps of exposing the substrate surface to an electron beam (12) which is controlled to progressively describe the pattern by stepped movement of a focused spot of the beam over the surface. The exposure of the surface to the beam is varied by selectably modulating the beam, such as through deflection by deflecting plates (17) to and from a blanking element (16), in the periods between successive movement steps so as to reduce the electron dose in predetermined positions of the beam spot on the surface.
Abstract:
Charged particle source (14) delivers beam (20) which is collimated onto first aperture plate having first aperture (28). The beam passing therethrough is deflected by deflection plates (32, 34, 38 and 40) with respect to second aperture (46) in second aperture plate (44). The image (50) of the second aperture (46) is focused on the target plane (16) and the virtual image of the footprint (58) of the deflected beam is focused on the target plane (16). When these images overlap, a shaped beam (56) passes through. Scanning of the beam across the target plane by deflection plates (52 and 54) permits exposure of sharp-edged features (62) by positioning the image (60a) inside the margin (64) and then scanning the image (50b) thereacross to expose the sharp edge and thereupon picking up the image (60) so that they both scan across the feature to be exposed.
Abstract:
An exposure pattern is computed which is used for exposing a desired pattern on a target in a charged-particle multi-beam processing apparatus so as to match a reference writing tool, possible of different type and/or for compensating a deviation of the imaging from a pattern definition device onto the target from a desired value of critical dimension along at least one direction in the image area on the target: The desired pattern (160) is provided as a graphical representation suitable for the reference tool, such as a raster graphics (161), on the image area on the target. A convolution kernel (162) is used which describes a mapping from an element of the graphical representation to a group of pixels which is centered around a nominal position of said element. A nominal exposure pattern is calculated by convolution of the graphical representation with the convolution kernel, said nominal exposure pattern being suitable to create a nominal dose distribution on the target when exposed with the processing apparatus.
Abstract:
An improved method and apparatus for shutting down and restoring an ion beam in an ion beam system. Preferred embodiments provide a system for improved power control of a focused ion beam source, which utilizes an automatic detection of when a charged particle beam system is idle (the beam itself is not in use) and then automatically reducing the beam current to a degree where little or no ion milling occurs at any aperture plane in the ion column. Preferred embodiments include a controller operable to modify voltage to an extractor electrode and/or to reduce voltage to a source electrode when idle state of an ion source of the charged particle beam system is detected.
Abstract:
A method of operating a particle beam system comprises determining a deflection amount and a deflection time of a beam deflection module connected to a data network; determining an un-blank time of a beam blanking module connected to the data network; determining a blank time of the beam blanking module connected to the data network; generating a data structure comprising plural data records, wherein each data record includes a command representing an instruction for at least one of the modules, and a command time representing a time at which the instruction is to be sent to the data network; sorting the records of the data structure by command time; generating a set of digital commands based on the data structure; and sending the digital commands of the set to the network in an order corresponding to an order of the sorted records.
Abstract:
A method of writing a pattern on the surface of a substrate (13), for example a circuit on a resist-coated wafer, by an electron beam comprises the steps of exposing the substrate surface to an electron beam (12) which is controlled to progressively describe the pattern by stepped movement of a focused spot of the beam over the surface. The exposure of the surface to the beam is varied by selectably modulating the beam, such as through deflection by deflecting plates (17) to and from a blanking element (16), in the periods between successive movement steps so as to reduce the electron dose in predetermined positions of the beam spot on the surface.
Abstract:
A scanned image to be observed or to be recorded is formed by a plurality of two-dimensional scanning times (N times), an irradiating charged particle beam or a light beam is blanked in a two-dimensional scanning unit, and the averaged irradiation intensity is adjusted by thinning a plurality (
Abstract:
Various embodiments of the present invention relate to a plasma electron source apparatus. The apparatus comprises a cathode discharge chamber in which a plasma is generated, an exit hole provided in said cathode discharge chamber from which electrons from the plasma are extracted by an accelerating field provided between said cathode discharge chamber and an anode, at least one plasma confinement device, and a switching mechanism for switching the at least one plasma confinement device between a first value allowing for electron extraction from the plasma and a second value prohibiting electron extraction from the plasma. Associated methods are also provided.