公开(公告)号：EP1460688A2

公开(公告)日：2004-09-22

申请号：EP04006380.2

申请日：2004-03-17

Applicant: Hitachi, Ltd.

Inventor： Ishi, Toshiaki, c/o Hitachi, Ltd., Int. Prop. Gr. ,  Tsuyuno, Nobutake, c/o Hitachi, Ltd., Int. Prop. G ,  Masuda, Mitsuhiro, c/o Hitachi, Ltd., Int. Prop. G ,  Urushiwara, Noriyoshi, c/o Hitachi, Ltd., Int. Pr. ,  Matsushita, Akira, c/o Hitachi, Ltd., Int. Prop.

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/043 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards (12, 13) on which electronic components are mounted. The wiring circuit boards (12, 13) are fixed to a heat sink (14) having a high heat conductivity via an adhesive (9, 10). The entirety of the wiring circuit boards (12, 13) and heat sink (14), as well as a part of an external connection terminal (8) are hermetically sealed and integrally molded by a thermosetting resin composition (7). The electronic circuit apparatus is small and highly reliable and can be provided at low cost.

公开(公告)号：WO2008116106A8

公开(公告)日：2009-06-11

申请号：PCT/US2008057725

申请日：2008-03-20

Applicant: VIASAT INC ,  SCHUTZ ROBERT LEE ,  SCHWARTZ HOWELL B ,  GIRKINS GREGORY SCOTT ,  GRELL CONRAD CLAIRE ,  NG ANGIE SHEELAN

Inventor： SCHUTZ ROBERT LEE ,  SCHWARTZ HOWELL B ,  GIRKINS GREGORY SCOTT ,  GRELL CONRAD CLAIRE ,  NG ANGIE SHEELAN

IPC: H05K1/14

CPC classification number: H05K1/144 ,  G01R31/2801 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/142 ,  H05K3/303 ,  H05K3/323 ,  H05K3/4602 ,  H05K3/4617 ,  H05K2201/041 ,  H05K2201/043 ,  H05K2201/09027 ,  H05K2201/10378 ,  H05K2203/162 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method for assembling a circuit card assembly (100) includes populating a plurality of components (110) on a top side of a component layer (105), performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer (115) to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer (120) and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer.

Abstract translation: 一种用于组装电路卡组件（100）的方法，包括在组件层（105）的顶侧上填充多个组件（110），对组装层（105）上的多个组件的至少一个组件进行组件级测试 将结合层（115）粘合到所述部件层的底侧，所述接合层以便于将所述部件层粘合到互连层（120）并且提供所述多个部件和所述互连层之间的连接性，以及 通过将互连层粘附到接合层来形成单面电路卡组件，所述互连层具有顶侧和底侧，所述接合层粘附到互连层的顶侧。

公开(公告)号：WO2003085851A1

公开(公告)日：2003-10-16

申请号：PCT/JP2003/004238

申请日：2003-04-02

Applicant: ソニー株式会社 ,  川上 悟 ,  今井 正志

Inventor： 川上 悟 ,  今井 正志

IPC: H04B1/08

CPC classification number: H05K9/006 ,  H04B1/005 ,  H04B1/08 ,  H04B1/18 ,  H04N5/50 ,  H04N5/64 ,  H04N21/4263 ,  H04N21/6143 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/043 ,  H05K2201/0715 ,  H05K2201/0723

Abstract: 衛星放送等の放送を受信する複数のチューナを備える受信装置であり、映像信号及び／又は音声信号を所定形式で変調した放送波が入力される入力端子（１１）と、放送波から所定の周波数帯域に含まれる映像信号及び／又は音声信号を選択するためのメイン回路（１２）が配置されたマウント層（１３）とを有するチューナ回路（１）におけるマウント層（１３）のメイン回路（１２）が配設される面の反対面に第１の誘電体層（１４）を介して第１のグランド層（１５）を備え、さらに第２の誘電体層を介して第２のグランド層（１７）を備えることにより、複数のチューナ間の相互干渉を抑える。

Abstract translation: 一种接收装置，包括用于接收诸如卫星广播的广播的多个调谐器。 调谐器电路（1）包括输入端子（11），其中输入了以预定格式调制的视频信号和/或音频信号的广播波，以及具有用于选择视频信号的主电路的安装层（13） /或包含在来自广播波的预定频带中的音频信号。 第一接地层（15）经由不具有主电路（12）的安装层（13）的表面上的第一介电层（14）提供，并且第二接地层（17）经由第二介电层 从而抑制多个调谐器之间的干扰。

公开(公告)号：WO03026009A3

公开(公告)日：2003-08-14

申请号：PCT/DE0203178

申请日：2002-08-29

Applicant: SIEMENS AG ,  LUCKE OLAF ,  THYZEL BERND

Inventor： LUCKE OLAF ,  THYZEL BERND

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373 ,  H01L25/07 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H01L23/3735 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2203/1572 ,  H01L2924/014

Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face conductor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part (9) of a housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

Abstract translation: 本发明涉及一种具有平面陶瓷基板2a Leistungselektroni单元，对用于在电路7的陶瓷基片2位于电功率组件的同样电连接厚膜技术印制导体6的一侧布置。 所述蝼miksubstrat 2施加在作为与通过钎焊其另一侧的金属基芯部件1的散热器。 载体元件1热与支撑部件1阴壳体的热传导壳体部件9连接。 在背离支承元件1此陶瓷基片2 4的陶瓷基片2的一侧大致的尺寸与电路承载陶瓷基片2相同的是大致相反通过钎焊来施加第二陶瓷衬底。

公开(公告)号：EP2184959A3

公开(公告)日：2013-01-09

申请号：EP09013776.1

申请日：2009-11-03

Applicant: Neuschäfer Elektronik GmbH

Inventor： Neuschafer, Wilfried

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/326 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/0397 ,  H05K2201/043 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2203/085 ,  H05K2203/1184 ,  Y02P70/613

Abstract: Eine Leiterplatte 10 zur Bestückung mit oberflächenmontierbaren (SMD) und mit drahtgebundenen Bauteilen 80, 70 ist mit einer ersten Substratschicht, die auf ihrer Bestückungsseite O eine Leiterbahnen 21 aufweisende Leitschicht 22 trägt und mit Durchgangsbohrungen 24 versehen ist, mit einer zweiten Substratschicht 30, die eine Bestückungsseite U aufweist und die mit Durchgangsbohrungen 34 versehen ist, wobei die Durchgangsbohrungen 24, 34 eine Metallisierung 50 aufweisen, und mit einer Zwischenschicht 40, die zwischen den Substratschichten 20, 30 angeordnet ist, ausgebildet, wobei die Durchgangsbohrungen 24, 34 in den Bestückungsseiten O, U der Substratschichten ausgebildet sind und kongruent übereinander liegen, wobei die metallisierten Durchgangsbohrungen 24, 34 elektrisch leitend mit den Leiterbahnen 21 der Leitschicht 22 der ersten Substratschicht verbunden sind, und wobei die Zwischenschicht 40 zumindest abschnittsweise in die Durchgangsbohrungen 24, 34 hineinragt. Die Zwischenschicht 40 ist im Bereich der Durchgangsbohrungen 24, 34 der Substratschichten 20, 30 mit Durchbrüchen 44 versehen, wobei die Lichte Weite d der Durchgangsbohrungen 44 in der Zwischenschicht 40 kleiner ist als der Durchmesser D der Durchgangsbohrungen 24, 34 in den Substratschichten 20, 30. Günstigerweise sind dabei die drahtgebundenen Bauteile 70 in der Zwischenschicht 40 kraft- oder reibschlüssig gehalten.

公开(公告)号：EP2220678A2

公开(公告)日：2010-08-25

申请号：EP08756454.8

申请日：2008-05-29

Applicant: Occam Portfolio LLC

Inventor： FJELSTAD, Joseph C.

IPC: H01L23/48 ,  H05K3/32

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

公开(公告)号：EP1667501A1

公开(公告)日：2006-06-07

申请号：EP04773247.4

申请日：2004-09-10

Applicant: UNITIKA LTD. ,  NIPPON KAYAKU KABUSHIKI KAISHA

Inventor： ECHIGO, Yoshiaki c/o Unitika Ltd ,  EGUCHI, Jusirou c/o Unitika Ltd ,  SHIGETA, Akira c/o Unitika Ltd ,  UCHIDA, Makoto ,  MOTEKI, Shigeru

IPC: H05K1/03

CPC classification number: H05K1/036 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0195 ,  H05K2201/043 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 µm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Abstract translation: 本发明提供了一种柔性印刷布线板的基板，其包括含有环氧树脂组合物的粘合剂层，分别层叠在粘合剂层两侧的绝缘层，并分别形成有一对含有非热塑性聚酰亚胺树脂的膜和导体层 设置在膜的外表面上。 分别堆叠在粘合剂层两侧的绝缘层的总厚度为粘合剂层的厚度的10至100μm和2至10倍。 通过粘合剂层中间的绝缘层之间的相互粘附强度为7.0N / cm以上。

公开(公告)号：EP1421618A2

公开(公告)日：2004-05-26

申请号：EP02798678.5

申请日：2002-08-29

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： LUCKE, Olaf ,  THYZEL, Bernd

IPC: H01L23/373

CPC classification number: H01L23/3735 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2203/1572 ,  H01L2924/014

Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face conductor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part (9) of a housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

公开(公告)号：EP0312631A1

公开(公告)日：1989-04-26

申请号：EP87115411.8

申请日：1987-10-21

Applicant: PRESSKONTAKT Ing. grad. Hartmuth Thaler KG

Inventor： Thaler, Hartmuth F., Ing. (grad) ,  Mueller, Ulrich H.A., Dipl.-Phys. Ing.

IPC: H05K3/36 ,  H05K7/06 ,  H05K1/18

CPC classification number: H05K1/148 ,  H05K3/061 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/043 ,  H05K2201/055 ,  H05K2201/0723 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K2203/1469

Abstract: Zum Herstellen elektrisch leitender Verbindungen zwischen flachen Leiterbahnen (3, 4), die durch einen Isolier­träger voneinander getrennt sind, werden zwei Metall­folien (1, 2), die mit Heißkleberschichten (5, 6) be­schichtet sind, nebeneinandergelegt. An den Stellen der später herzustellenden und miteinander zu verbindenden Leiterbahnen (3, 4) sind Kontaktpunkte (7, 10) vorgesehen, an welche Drähte (8, 9, 10) angeschweißt werden, die, soweit sie auf der Ebene der Metallfolien (1, 2) verlaufen, durch Wärmezufuhr in die Schichten (5, 6) eingebettet werden. Anschließend werden die Metallfolien (1, 2) mit ihren Heißkleberschichten (5, 6) unter Zwischenlage des Isolierträgers gegeneinandergeklappt und durch Wärme­zufuhr mit diesem verbunden. Nunmehr werden von den Metall­folien (1, 2) die Zwischenräume (13, 14) zur Bildung der Leiterbahnen (3, 4) abgeätzt.

Abstract translation: 为了制造扁平导体轨道之间的导电连接（3,4），它们彼此通过在绝缘性的载体，两个金属箔分离的（1，2），涂有热粘接层（5,6） 被放置并排侧。 在导电轨迹的点被提供接触点（7，10）（3,4），其随后被制造并彼此连接，向其中接触点（7，10）有焊接导线（8,9 10）被嵌入在所述层（5,6）通过施加热，以thatthey在金属箔的面（1运行的范围内，2）。 随后，将金属箔（1，2）在它们的热粘合剂层（5,6）被折叠抵靠彼此，在它们之间放置了绝缘性的载体，向其中通过施加热而被连接。 用于形成导体轨道的中间空间（13，14）（3,4）现在从金属箔蚀刻掉（1，2）。

公开(公告)号：EP2559327B1

公开(公告)日：2018-05-16

申请号：EP11730863.5

申请日：2011-04-11

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Johannes ,  LEITGEB, Markus

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144