公开(公告)号：US07965169B2

公开(公告)日：2011-06-21

申请号：US12035472

申请日：2008-02-22

Applicant: Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

Inventor： Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

IPC: H01C7/10

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract translation: 具有第一和第二相对端的芯片电阻器包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘和第二导电终端焊盘，刚性绝缘基板的顶表面上的两个端接焊盘 ，在第一和第二导电终端焊盘之间的电阻材料层，以及每个由具有焊料增强涂层的导电金属制成的第一和第二柔性引线。 第一柔性引线附接并电连接到第一导电终端焊盘和第二柔性引线，并且电连接到第二导电终端焊盘。 每个柔性引线具有多个引线部分，便于围绕芯片电阻器的端部弯曲。

公开(公告)号：US07161282B2

公开(公告)日：2007-01-09

申请号：US10735704

申请日：2003-12-16

Applicant: Masato Koike ,  Katsumi Fujimoto

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: H01L41/053

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的引脚连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US07158372B2

公开(公告)日：2007-01-02

申请号：US10893904

申请日：2004-07-20

Applicant: Satoshi Sanada ,  Takao Tsunooka ,  Matsuhisa Tsuruta

Inventor： Satoshi Sanada ,  Takao Tsunooka ,  Matsuhisa Tsuruta

IPC: G06F1/16 ,  B60T15/18

CPC classification number: H05K5/0247 ,  B60T8/3675 ,  H01R13/24 ,  H05K1/0263 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10848 ,  Y10T137/8326 ,  Y10T137/87885

Abstract: In an electronic control unit, a chassis is provided with a plate portion, and a circuit board is secured to a board-side attaching surface of the plate portion with a predetermined space secured relative to the plate portion. The chassis is further provided with a side wall protruding from the circumferential portion of the other surface of the plate portion and is mounted on a surface of a housing incorporating a device therein, with an end surface of the side wall being seated on the surface of the housing. A bus bar is fixed at a fixing portion thereof to the board-side attaching surface between the plate portion and the circuit board and is connected to a terminal of the device which is taken out from the housing. The bus bar is provided at plural free ends thereof with branch portions at which lead portions extend to be joined at end portions thereof to the circuit board. Elastic portions for reducing stresses which are developed at juncture portions of the lead portions to the circuit board as the temperature changes are formed between the base portion and the branch portions alongside the board-side attaching surface.

Abstract translation: 在电子控制单元中，机架设有板部，电路板以相对于板部固定的预定空间固定在板部的板侧安装面上。 底盘还设置有从板部分的另一表面的圆周部分突出的侧壁，并且安装在其中包括装置的壳体的表面上，侧壁的端表面位于 住房。 母线固定在其固定部分到板部分和电路板之间的板侧安装表面，并连接到从壳体中取出的装置的端子。 汇流条在其多个自由端处设置有分支部分，引导部分在端部处延伸以连接到电路板。 弹性部分，用于在基板侧和基板侧安装面之间的分支部分之间形成用于减小随着温度变化而在引线部分到电路板的接合部分处产生的应力的应力。

公开(公告)号：US20040072455A1

公开(公告)日：2004-04-15

申请号：US10626262

申请日：2003-07-24

Inventor： Harehide Sasaki ,  Yoshiaki Kato ,  Keiichi Ito ,  Masato Minakata ,  Atsushi Nishida

IPC: H01R012/00

CPC classification number: H01R12/58 ,  H01R4/02 ,  H01R12/712 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/1081 ,  H05K2201/10848

Abstract: A connector has terminals, each having a tip end portion. A wiring board has through holes. A land is provided on the wiring board about each through hole. When the connector is mounted on the wiring board, each terminal is connected to one of the lands with a part of the tip end portion being located in the corresponding through hole. The ratio of the cross-sectional area of each tip end portion to the cross-sectional area of each through hole is at least 0.11 and no more than 0.89. This improves the reliability of the joint portions between the terminals and the wiring board.

Abstract translation: 连接器具有端子，每个端子具有尖端部分。 接线板有通孔。 在每个通孔上的布线板上设置一个焊盘。 当连接器安装在布线板上时，每个端子连接到其中一个焊盘，其顶端部分的一部分位于相应的通孔中。 每个末端部分的横截面积与每个通孔的横截面面积之比至少为0.11且不大于0.89。 这提高了端子和布线板之间的接合部的可靠性。

公开(公告)号：US06490173B2

公开(公告)日：2002-12-03

申请号：US09740115

申请日：2000-12-19

Applicant: Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

Inventor： Russell Wayne Perkins ,  Mark Alan Yoder ,  Christopher Day States ,  Theodore Paul Corbin

IPC: H05K900

CPC classification number: H05K9/0028 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y10S174/34

Abstract: An apparatus and method for shielding electrical components mounted on a printed circuit board (PCB) from electromagnetic and radio frequency interference by reducing the dissipation of heat away from solder joints. In an embodiment of the invention a radio frequency (RF) shield for a printed circuit board comprises a shield for RF shielding a portion of the PCB having electronic components mounted thereon. The shield has a first portion and a second portion, wherein the first portion has a reduced cross sectional area, for reducing heat conduction between the first and the second portion when the first portion of the shield is inserted into a first plurality of holes in the PCB, for soldering the first portion of the shield to a copper foil of the PCB.

公开(公告)号：US5690270A

公开(公告)日：1997-11-25

申请号：US745782

申请日：1996-11-08

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.

Abstract translation: 用于将表面贴装封装安装到印刷电路板上的装置和方法包括将引脚插入穿过印刷电路板馈通以提供销在馈通内的运动。 引脚的一端焊接到印刷电路板底部的导电表面，而引脚ID的另一端焊接到表面贴装封装焊盘。 封装以与印刷电路板顶表面间隔的关系安装。 使用高温焊料将引脚焊接到板导电表面，用于形成焊接接头，在使用诸如铅锡焊料类型的低温焊料的后续焊接期间保持固体。 然后使用低温铅锡焊料将引脚焊接到表面贴装封装的焊盘，以在焊盘和引脚之间形成焊接接头。 该销的尺寸适于松动地配合在馈通内，并且因此由焊盘，销和印刷电路板的材料之间的热膨胀失配系数引起的移动被引脚内的引脚的移动所吸收。 因此，为焊点提供了应力消除。

公开(公告)号：US4531044A

公开(公告)日：1985-07-23

申请号：US474650

申请日：1983-01-24

Applicant: Dale U. Chang

Inventor： Dale U. Chang

IPC: B23K1/005 ,  H05K1/03 ,  H05K3/34 ,  B23K15/00 ,  H01C1/14 ,  H01C1/144

CPC classification number: H05K3/3421 ,  B23K1/0056 ,  B23K2201/40 ,  H05K1/0306 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method of soldering electrical lead strands (of a width at least 0.3 inch) to a printed electrical path is disclosed. The path is planted on an alumina ceramic substrate and a solder pad is attached to a portion of the path. A flat surface portion of each lead strand is forced into full interengagement with a pad, a CO.sub.2 defocused laser beam is directed onto the soldering assembly with the beam controlled to have a beam power of at least 100 watts, a beam spot diameter no less than the width of the lead strand and no greater than the width of the pad, and a beam on-time effective to exert a controlled thermal radius on the soldering assembly to reflow only a preselected portion of the pad and effect a solder joint between the pad and strand portion, the joint having a strength of at least 400 grams. The parameters of the beam power, beam spot diameter, and beam on-time are optimally correlated by the following equation: ##EQU1## where: C is the critical thermal radius, a is the Gaussian radius at 1/e.sup.2, ln is logarithm, Tm is the melting temperature of the solder minus the specimen temperature, P is the laser beam power in watts, A is the surface absorptivity of the solder at 10.6 microns, R is the terminal resistance per unit area of the system, tc is the critical time to bring the solder to the Tm temperature, c is the heat capacity of the system.

Abstract translation: 公开了将电引线（宽度至少为0.3英寸）焊接到印刷电路上的方法。 将路径种植在氧化铝陶瓷基板上，并且将焊盘附接到路径的一部分。 每个引线的平坦表面部分被迫与焊盘完全相互接合，二氧化碳散焦的激光束被引导到焊接组件上，光束被控制为具有至少100瓦特的光束功率，光束点直径不小于 引线的宽度并且不大于焊盘的宽度，并且导通时间有效地在焊接组件上施加受控的热半径以仅回流焊盘的预选部分并且实现焊盘之间的焊接接头 和股线部分，该接头具有至少400克的强度。 光束功率，光束直径和光束导通时间的参数通过以下公式进行最佳相关：其中：C是临界热半径，a是1 / e2处的高斯半径，ln是对数， Tm是焊料的熔化温度减去样品温度，P是以瓦特为单位的激光束功率，A是焊料在10.6微米处的表面吸收率，R是系统每单位面积的端电阻，tc是临界值 时间使焊料达到Tm温度，c是系统的热容量。

公开(公告)号：JP2011103251A

公开(公告)日：2011-05-26

申请号：JP2009258249

申请日：2009-11-11

Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

Inventor： GOTO HIDENORI

IPC: H01R12/55 ,  H01R12/51 ,  H01R13/04 ,  H01R24/00

CPC classification number: H01R13/03 ,  H01R12/585 ,  H01R43/16 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10848 ,  H05K2201/10863

Abstract: PROBLEM TO BE SOLVED: To provide a board terminal with a new structure, which is formed of a metal wire rod and can be inserted into a through-hole of a small diameter and can demonstrate sufficient solder wettability without requiring post-plating. SOLUTION: A cutting wire rod 12 in which a square metal wire rod of a rectangular cross-section, on the whole surface of which a plating layer 20 is formed, is cut into a prescribed length is used, and in an insertion portion 16 which is inserted into and soldered to the through-hole 32 of a printed circuit board 30, only one of the edge portions in a width direction which face each other in a long side direction is cut to reduce the dimension in a long side direction. Thus, the plating layer 20 of the square metal wire rod is left in three side faces 18a, 18b, 18c of the insertion portion 16. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种由金属线材形成的新结构的电路板端子，并且可以插入到小直径的通孔中，并且可以显示出足够的焊料润湿性，而不需要电镀 。 解决方案：使用切割线材12，其切割具有矩形横截面的方形金属线材，其整个表面形成有镀层20，其被切割成规定长度，并且在插入 插入并焊接到印刷电路板30的通孔32中的部分16被切割成沿长边方向彼此面对的宽度方向上的边缘部分中的一个，以减小长边的尺寸 方向。 因此，方形金属线材的镀层20留在插入部分16的三个侧面18a，18b，18c中。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP4458137B2

公开(公告)日：2010-04-28

申请号：JP2007234549

申请日：2007-09-10

Applicant: 株式会社デンソー

Inventor： 隆芳 本多 ,  稔 穂塚

IPC: H05K1/18

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

公开(公告)号：KR1020010039831A

公开(公告)日：2001-05-15

申请号：KR1020000047932

申请日：2000-08-18

Applicant: 신꼬오덴기 고교 가부시키가이샤

Inventor： 히가시미쓰토시 ,  무라야마케이 ,  사까구찌히데아끼 ,  코이께히로꼬

IPC: H01L21/60

CPC classification number: H01L24/11 ,  H01L21/4889 ,  H01L24/13 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/351 ,  H05K3/3426 ,  H05K3/3484 ,  H05K2201/10287 ,  H05K2201/10848 ,  H05K2201/10984 ,  H05K2203/0338 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: PURPOSE: To align a semiconductor device, having an external connection terminal which is formed by a wire to a mounting substrate for sure and easy mounting. CONSTITUTION: A manufacturing method is used to manufacture a semiconductor device, where a wire 14 with conductivity is connected electrically to an electrode terminal 12 formed on the electrode terminal formation surface of a semiconductor element 10 for erecting, and a solder bump 38 is formed at the tip part of the wire 14. In the manufacturing method, on the surface of a substrate 30, consisting of a base material having interior wetting property to solder as compared with the wire 14, a solder paste 32 is arranged in dots corresponding to the position of the tip part of the wire 14, the each solder paste 32 and the tip part of the wire 14 are aligned for heating, and the solder bump 38 is formed at the tip part of the wire 14.

Abstract translation: 目的：将具有由导线形成的外部连接端子固定到安装基板上的半导体器件对准以确定且容易安装。 构成：制造半导体装置的制造方法，其中具有导电性的导线14电连接到形成在用于竖立的半导体元件10的电极端子形成表面上的电极端子12，并且焊料凸块38形成在 在制造方法中，在与导线14相比，由与焊料14相比具有内部润湿性的基材的基材30的表面上形成焊锡膏32，其点对应于 导线14的尖端部分的位置，每个焊膏32和导线14的末端部分被对准以进行加热，并且焊料凸起38形成在导线14的尖端部分。