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公开(公告)号：KR1020110032601A
公开(公告)日：2011-03-30
申请号：KR1020090090166
申请日：2009-09-23
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: The printed circuit board equipped with the electromagnetic band gap structure easily reduces the various frequency bands of noises. In that way the power consumption can be reduced. CONSTITUTION: The first and the second electric conductor part are arranged on the each other different plane. The third electric conductor part is arranged on the second electric conductor part and the different plane. The first stitching via part(90) interlinks the first conductor part and the third electric conductor part via the plane in which the second electric conductor part is arranged.
Abstract translation: 目的：配备电磁带隙结构的印刷电路板可以轻松减少各种频段的噪音。 这样可以降低功耗。 构成：第一和第二导电体部分布置在彼此不同的平面上。 第三导体部分布置在第二导电体部分和不同的平面上。 第一缝合通孔部（90）经由配置有第二导电体部的平面将第一导体部和第三导电体部互相连接。
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公开(公告)号：KR1020110029814A
公开(公告)日：2011-03-23
申请号：KR1020090087645
申请日：2009-09-16
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0233 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0236 , H05K1/112 , H05K2201/086 , H05K2201/1003 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board including an electromagnetic bandgap structure is provided to reduce power consumption and manufacturing costs by easily reducing the noises of various frequency bands. CONSTITUTION: A bandgap structure comprises a first conductive plate(10), a second conductive plate(20), a third conductive plate(30), and a first stitching via unit(90). The second conductive plate is arranged on the plane different from the first conductive plate. The third conductive plate is arranged on the plane different from the second conductive plate. The first stitching via unit connects the first conductive plate and the third conductive plate via the second conductive plate. The stitching via unit includes a wiring line unit, a first via, and a second via.
Abstract translation: 目的：提供包括电磁带隙结构的印刷电路板，通过容易地减少各种频带的噪声来降低功耗和制造成本。 构成：带隙结构包括第一导电板（10），第二导电板（20），第三导电板（30）和第一缝合通孔单元（90）。 第二导电板布置在与第一导电板不同的平面上。 第三导电板设置在与第二导电板不同的平面上。 第一缝合通孔单元经由第二导电板连接第一导电板和第三导电板。 缝合通孔单元包括布线单元，第一通孔和第二通孔。
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公开(公告)号：KR101023541B1
公开(公告)日：2011-03-21
申请号：KR1020090089799
申请日：2009-09-22
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board for reducing an EMI noise is provided to shield a radiation noise by inserting an electromagnetic bandgap structure into the substrate. CONSTITUTION: A ground layer and a power layer are formed on a first region(100). A second region is positioned on the side of the first region and includes an electromagnetic bandgap structure to shield an EMI noise emitted to the outside through the side of the first region. A first conductive plate(220a) and a second conductive plate(220b) are formed on the same plane along the side of the first region. A stitching via part(250) electrically connects the first and second conductive plates.
Abstract translation: 目的：提供用于降低EMI噪声的印刷电路板，通过将电磁带隙结构插入基板来屏蔽辐射噪声。 构成：在第一区域（100）上形成接地层和功率层。 第二区域位于第一区域的侧面，并且包括电磁带隙结构，以屏蔽通过第一区域的一侧发射到外部的EMI噪声。 第一导电板（220a）和第二导电板（220b）沿着第一区域的一侧形成在同一平面上。 缝合通孔部分（250）电连接第一和第二导电板。
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公开(公告)号：KR101018807B1
公开(公告)日：2011-03-03
申请号：KR1020080120949
申请日：2008-12-02
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01P1/2005 , H01P1/203 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
Abstract: 특정 주파수 대역의 노이즈 차폐를 위한 전자기 밴드갭 구조물이 제공된다. 본 발명의 실시예에 따른 전자기 밴드갭 구조물은, 제1 평면 상에 위치하고, 제1 방향을 따라 열지어 배치되는 복수개의 제1 도전판; 제2 평면 상에 위치하고, 상기 제1 도전판들이 배치된 영역과 대응되는 영역에 상기 제1 방향을 따라 열지어 배치되는 복수개의 제2 도전판; 일부분이 상기 제1 평면과는 다른 평면 상을 경유함으로써, 상기 제1 방향과 다른 방향을 기준으로 상기 제1 평면 상에서 이웃하여 위치하는 어느 2개의 도전성 영역 마다를 전기적으로 연결하는 제1 스티칭 비아; 및 일부분이 상기 제2 평면과는 다른 평면 상을 경유함으로써, 상기 제1 방향과 다른 방향을 기준으로 상기 제2 평면 상에서 이웃하여 위치하는 어느 2개의 도전성 영역 마다를 전기적으로 연결하는 제2 스티칭 비아를 포함할 수 있다.
전자기 밴드갭 구조, 노이즈, 차폐, 회로 기판.-
公开(公告)号：KR100999518B1
公开(公告)日：2010-12-08
申请号：KR1020080117907
申请日：2008-11-26
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
Abstract: 특정 주파수 대역의 노이즈 차폐를 위한 전자기 밴드갭 구조물이 제공된다. 본 발명의 실시예에 따른 전자기 밴드갭 구조물은, 4개 이상의 도전판; 일부분이 상기 도전판들과는 다른 평면을 경유함을 통해, 상기 도전판들 중 어느 2개의 도전판 간을 전기적으로 연결하는 제1 스티칭 비아; 일부분이 상기 도전판들과는 다른 평면을 경유함을 통해, 상기 어느 2개의 도전판을 제외한 다른 2개의 도전판 간을 전기적으로 연결하는 제2 스티칭 비아; 및 상기 제1 스티칭 비아와 상기 제2 스티칭 비아 간을 전기적으로 연결하는 스티칭 비아 체인을 포함한다.
전자기 밴드갭 구조, 노이즈, 차폐, 회로 기판.-
Patent Agency Ranking
公开(公告)号：KR1020090122748A
公开(公告)日：2009-12-01
申请号：KR1020080048705
申请日：2008-05-26
Applicant: 삼성전기주식회사
IPC: H05K3/40
CPC classification number: H05K3/462 , H05K1/0265 , H05K1/0366 , H05K3/025 , H05K3/108 , H05K3/4623 , H05K2201/0352 , H05K2201/0394 , H05K2201/09527 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09736 , Y10T29/49126 , Y10T29/49165
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to remove a dimple by connecting a top via and a bottom via through a conductive bump. CONSTITUTION: A first circuit layer(910) is formed on one surface of a first insulation layer, and includes a first circuit pattern. A second circuit layer(920) is formed on the other surface of the first insulation layer, and includes a first bottom land. A first via(510) connects the first circuit pattern to the first bottom land. A third circuit layer(930) is formed on one surface of a second insulation layer, and includes a second circuit pattern. A fourth circuit layer(940) is formed on the other surface of the second insulation layer, and includes a second bottom land. A second via(520) connects the second circuit pattern to the second bottom land. A third insulation layer is interposed between the second circuit layer and the fourth circuit layer. A conductive bump(800) connects the first bottom land to the second bottom land.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以便通过导电凸块连接顶部通孔和底部通孔来去除凹坑。 构成：第一电路层（910）形成在第一绝缘层的一个表面上，并且包括第一电路图案。 第二电路层（920）形成在第一绝缘层的另一个表面上，并且包括第一底面。 第一通孔（510）将第一电路图案连接到第一底部焊盘。 第三电路层（930）形成在第二绝缘层的一个表面上，并且包括第二电路图案。 第四电路层（940）形成在第二绝缘层的另一个表面上，并且包括第二底面。 第二通孔（520）将第二电路图案连接到第二底部焊盘。 第三绝缘层介于第二电路层和第四电路层之间。 导电凸起（800）将第一底部区域连接到第二底部区域。
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公开(公告)号：KR1020090080462A
公开(公告)日：2009-07-24
申请号：KR1020080057444
申请日：2008-06-18
Applicant: 삼성전기주식회사
CPC classification number: H01P1/2005 , H01L2224/16225
Abstract: An electromagnetic band-gap structure and a printed circuit board are provided to shield a coupling noise of a high frequency when an operation frequency having a high frequency band is used. An electromagnetic band gap structure wafer(300) comprises a dielectric layer and a plurality of conductive plates, a stitching via, and a through via. A switching bar penetrates a dielectric layer and connects the conductive plate by passing the conductive plate and the other plane. The trough via passes a clearance hole formed on a conductive plate and connects two conductive layers electrically.
Abstract translation: 提供电磁带隙结构和印刷电路板，以在使用具有高频带的操作频率时屏蔽高频耦合噪声。 电磁带隙结构晶片（300）包括电介质层和多个导电板，缝合通孔和通孔。 切换杆穿透电介质层，并且通过使导电板和另一个平面通过来连接导电板。 槽通过形成在导电板上的间隙孔并且电连接两个导电层。
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公开(公告)号：KR100851075B1
公开(公告)日：2008-08-12
申请号：KR1020070041991
申请日：2007-04-30
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01Q15/008 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to block a noise with a specific frequency and to prevent mixed signals in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first and second metal layers(210-1,210-2), first through third dielectric layers(220a,220b,220c), first and second metal plates(330,335), and first and second vias(340,345). The first dielectric layer is formed on the first metal layer. The first metal plate is formed on the first dielectric layer. The first via connects the first metal layer and the first metal plate. The second dielectric layer is formed on the first metal layer and the first dielectric layer. The second metal layer is formed on the second dielectric layer and has a hole(350). The third dielectric layer is formed on the second metal plate. The second metal plate is formed on the third dielectric layer. The second via connects the first metal plate and the second metal plate through the hole.
Abstract translation: 提供电磁带隙结构和印刷电路板以阻挡具有特定频率的噪声，并且防止具有RF电路和数字电路的电子设备中的混合信号在同一基板上。 电磁带隙结构包括第一和第二金属层（210-1,210-2），第一至第三介电层（220a，220b，220c），第一和第二金属板（330,335）以及第一和第二通孔（340,345）。 第一介电层形成在第一金属层上。 第一金属板形成在第一电介质层上。 第一通孔连接第一金属层和第一金属板。 第二电介质层形成在第一金属层和第一电介质层上。 第二金属层形成在第二电介质层上并具有孔（350）。 第三电介质层形成在第二金属板上。 第二金属板形成在第三电介质层上。 第二通孔通过孔连接第一金属板和第二金属板。
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公开(公告)号：KR1020080072505A
公开(公告)日：2008-08-06
申请号：KR1020070093956
申请日：2007-09-17
Applicant: 삼성전기주식회사
IPC: H05K3/40
CPC classification number: H05K1/0236 , H05K1/115 , H05K3/4038
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to solve a mixed signal problem in an electronic device having an RF(Radio Frequency) circuit and a digital circuit on the same substrate. An electromagnetic band gap structure(400) is formed by stacking a first metal layer(410), a first dielectric layer(430a), a second dielectric layer(430b), and a second metal layer(420) and includes a first metal plate(440a), a second metal plate(440b), and a via(450). The first metal plate is formed between the first and second dielectric layers. The second metal plate is formed on the same plane as the first metal plate, received in a hole(445) formed on the first metal plate, and electrically connected to the first metal plate through a metal line(442). The via connects the second metal plate to any one of the first and second metal layers.
Abstract translation: 提供电磁带隙结构和印刷电路板，以解决在同一基板上具有RF（射频）电路和数字电路的电子设备中的混合信号问题。 通过堆叠第一金属层（410），第一介电层（430a），第二电介质层（430b）和第二金属层（420）来形成电磁带隙结构（400），并且包括第一金属板 （440a），第二金属板（440b）和通孔（450）。 第一金属板形成在第一和第二电介质层之间。 第二金属板形成在与第一金属板相同的平面上，容纳在形成在第一金属板上的孔（445）中，并通过金属线（442）与第一金属板电连接。 通孔将第二金属板连接到第一和第二金属层中的任何一个。
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公开(公告)号：KR100838244B1
公开(公告)日：2008-06-17
申请号：KR1020070061834
申请日：2007-06-22
Applicant: 삼성전기주식회사
CPC classification number: H05K1/116 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H01L2224/0401
Abstract: An electromagnetic bandgap structure and a printed circuit board are provided to acquire an enough inductance in a narrow space by separating a plurality of vias installed on the electromagnetic bandgap structure. An electromagnetic bandgap structure includes a first metal layer(310-1), a first dielectric layer(320a), a metal plate(332), a second dielectric layer(320b), a second metal layer(310-2). An odd number of vias are coupled in series between the first metal layer and the metal plate. The vias are arranged on one flat plane. The other vias except at least one via are arranged on the flat plane. A metal line is a linear line which connects between the vias. The metal line is a bent linear or a curve line which connects between the vias.
Abstract translation: 提供电磁带隙结构和印刷电路板，以通过分离安装在电磁带隙结构上的多个通孔来在狭窄的空间中获得足够的电感。 电磁带隙结构包括第一金属层（310-1），第一介电层（320a），金属板（332），第二介电层（320b），第二金属层（310-2）。 奇数个通孔在第一金属层和金属板之间串联耦合。 通孔布置在一个平面上。 除了至少一个通孔之外的其他通孔布置在平面上。 金属线是在通孔之间连接的线性线。 金属线是在通孔之间连接的弯曲线性或曲线。
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