Abstract:
활성영역이 고이동도영역과 저이동도영역으로 정의된 반도체 소자 및 이를 적용하는 박막트랜지스트에 관해 개시한다. 이동도를 소자의 요구를 만족하는 수준으로 낮추고, 이동도의 감소에 따른 반도체 소자간의 이동도의 편차를 감소시킨다. 이러한 이동도의 편차 감소는 대규모의 반도체 소자가 적용되는 예를 들어, 평판 디스플레이 소자의 품질을 크게 향상시킨다. 이동도, 다결정, 단결정, 반도체, 박막트랜지스터
Abstract:
PURPOSE: A manufacturing method of an oxide semiconductor TFT(Thin Film Transistor) which an oxide semiconductor is used for a channel is provided to improve the characteristic of a device by using an oxide semiconductor as a channel material. CONSTITUTION: A gate insulation film(110) is formed on a substrate in order to cover the gate after the gate is formed on the substrate. A channel layer(116) consisting of the transparent oxide semiconductor is formed on the gate insulating layer. Source and drain electrodes are respectively formed on both sides of the channel layer. A protective film(120) is formed in order to cover source, drain electrode, and the channel layer. The substrate in which the protective film is formed is heat-treated at a temperature of 100 degrees.
Abstract:
An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode, and a method for preparing an oxide semiconductor thin film transistor by using the etchant are provided to prevent the back etching of an oxide semiconductor and the dissolution of an oxide semiconductor and to improve etching rate. An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode comprises hydrogen peroxide, ammonium hydroxide, and water. A manufacturing method of an oxide semiconductor thin film transistor comprises the steps of forming a gate on a substrate(110), and forming a gate insulating layer(114) on the substrate so as to cover the gate; forming a channel layer(116) comprising an oxide semiconductor on the gate insulating layer; and forming a metal layer for the formation of a source and a drain electrode at on both surfaces of the channel layer, and pattering it by using the etchant to form a source and drain electrodes(118a,118b).
Abstract:
A plasma processing apparatus having linear antennas is provided to improve density uniformity of plasma by changing a thickness of a dielectric for surrounding the linear antenna. A plasma processing apparatus having linear antennas includes a reaction chamber(110), a substrate supporting plate(120), linear antennas(132), an RF power source(138), and a dielectric(142). The substrate supporting plate is installed in a lower side of the inside of the reaction chamber in order to support a substrate to be processed. The linear antennas are used for inducing electric field to generate electric field. The linear antennas are installed in parallel to each other at an upper side of the inside of the reaction chamber. The RF power source is connected to the linear antennas in order to supply RF power to the linear antennas. The dielectric is formed to surround each of the linear antennas. The thickness of the dielectric is gradually reduced from a RF power input terminal of each linear antenna to a grounding terminal(132b).
Abstract:
A method for manufacturing an oxide semiconductor thin film transistor is provided to improve stability and reliability of the semiconductor thin film transistor by using an oxide semiconductor made of a channel material. A gate insulating layer(114) is formed on a substrate with a gate(112). A channel layer(116) made of the oxide semiconductor is formed on a gate insulating layer. A source electrode(118a) and a drain electrode(118b) are formed in both sides of the channel layer. The plasma process is performed to supply the oxygen to the channel layer. The protection layer covering the source and drain electrodes, and the channel layer is formed. After forming the protection layer, the thermal process is performed.
Abstract:
A polycrystalline silicon thin film and a method of thin film transistor applying the same are provided to obtain medium quality of a poly-crystal silicon and a amorphous silicon in order to be used in a high quality electronic product. A silicon thin film(20) is formed with high density plasma chemical vapor deposition having plasma density more than 2.00E+11cm-3 on a substrate(10). Hydrogen gas is included to reaction gas. The gas forming the silicon thin film comprises one selected from the group of Ar and He. A polycrystalline silicon thin film and a method of thin film transistor applying the same comprises a step for forming a channel region and active layer having a source region and a drain region of the both sides of the channel regions.
Abstract:
An organic electro-luminescent display and a fabrication method thereof are provided to obtain an active layer with a low mobility and an active layer with a high mobility by obtaining different poly crystal silicon islands. An organic electro-luminescent display includes an amorphous silicon(2), a capping layer(3), a driving transistor, and a switching transistor. The capping layer is formed on the amorphous silicon and has two parts(3a,3b) having different thicknesses. The driving transistor is formed under a thick part of the capping layer and drives the organic electro-luminescent display. The switching transistor is formed under a thinner part of the capping layer and controls operation of the driving transistor.
Abstract:
셀프얼라인에 의한 오프셋 구조를 가지는 박막트랜지스터 및 그 제조방법에 관해 개시한다. 박막트랜지스터는 기판과; 기판 상에 형성되는 것으로 폭이 넓은 부분과 좁은 부분을 가지는 것으로 그 양측에 경사면이 형성된 돌출부를 가지는 버퍼층과; 상기 버퍼층의 돌출부상에 마련되는 채널과 돌출부의 양측에 위치하는 소스 및 드레인을 가지는 것으로 상기 돌출부의 양측 경사부에 대응하는 오프렛 구조를 가지는 반도체층과; 상기 돌출부의 상방에 마련되는 것으로 상기 돌출부의 좁은 부분에 비해 큰 폭을 가지는 게이트 절연층 및 게이트를 구비한다. 오프셋, LDD, 박막트랜지스터
Abstract:
A semiconductor element, a semiconductor device with the same and methods for manufacturing a flat panel display and the semiconductor element are provided to improve the degree of integration and to increase the mobility of carrier by using a single crystal TFT structure composed of PMOS single crystal TFT and an NMOS single crystal TFT. A semiconductor element comprises a substrate(40), a PMOS single crystal TFT, and an NMOS single crystal TFT. The PMOS single crystal TFT is formed on the substrate. The NMOS single crystal TFT is formed on the PMOS single crystal TFT. A first source region of the PMOS single crystal TFT is connected with a second source region of the NMOS single crystal TFT.
Abstract:
개시된 실리콘 박막트랜지스터는: 기판에 형성되는 실리콘 채널과; 상기 실리콘 채널 위에 형성되는 게이트 절연층과; 상기 게이트 절연층 위에 마련되는 게이트를; 구비하고, 상기 게이트 절연층은 상기 실리콘 채널의 플라즈마 저온산화에 의한 산화막 및 상기 채널에 별도로 증착된 산화막을 포함하는 구조를 가진다. 이러한 박막트랜지스터는 게이트절연층과 채널간의 개선된 인터페이스특성을 가지며, 특히 낮은 구동전압을 가진다. 다결정, 실리콘, 게이트 절연층, 플라즈마 산화, 저온산화