公开(公告)号：EP2245512A4

公开(公告)日：2011-08-10

申请号：EP09706292

申请日：2009-01-29

Applicant: BREWER SCIENCE INC

Inventor： SUN SAM X ,  XU HAO ,  FLAIM TONY D

IPC: G03F7/26 ,  H01L21/027

CPC classification number: H01L21/0337 ,  G03F7/0752 ,  G03F7/094 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/0332 ,  H01L21/0338 ,  H01L21/312

Abstract: This invention provides methods of creating via or trench structures on a developer-soluble hardmask layer using a multiple exposure-development process. The hardmask layer is patterned while the imaging layer is developed. After the imaging layer is stripped using organic solvents, the same hardmask can be further patterned using subsequent exposure-development processes. Eventually, the pattern can be transferred to the substrate using an etching process.

公开(公告)号：EP2188335A4

公开(公告)日：2010-10-13

申请号：EP08798953

申请日：2008-08-29

Applicant: BREWER SCIENCE INC

Inventor： XU GU ,  YESS KIMBERLY A ,  FLAIM TONY D

IPC: C09D125/12 ,  B81C1/00 ,  C08L25/12 ,  C09D163/04 ,  H01L21/027

CPC classification number: H01L21/0271 ,  B81C1/00801 ,  C08L63/04 ,  C09D125/12 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/14

公开(公告)号：EP1025462A4

公开(公告)日：2001-01-17

申请号：EP98952384

申请日：1998-10-20

Applicant: BREWER SCIENCE INC

Inventor： SHAO XIE ,  HESTER COLIN ,  FLAIM TONY D ,  BREWER TERRY L

IPC: G03F7/11 ,  C08G63/54 ,  C09D167/00 ,  G03F7/09 ,  G03C1/492 ,  G03F7/038

CPC classification number: G03F7/091 ,  C09D167/00 ,  Y10S430/109 ,  C08L61/20

Abstract: Thermosetting, bottom-applied polymeric anti-reflective coatings exhibiting high optical density, rapid plasma etch rates, high solubility in preferred coating solvents, excellent feature coverage, and improved stability in solution are disclosed. The principal component of these new anti-reflective coatings is a polyester resin produced by the reaction of one or more difunctional aliphatic carboxylic acids with a stoichiometric excess of a di- and/or a trifunctional aliphatic primary alcohol, wherein at least one of the dicarboxylic acids may contain a reactive methylene (-CH2-) group. The resulting polyester resin reaction product is further modified by attaching light-absorbing groups to some or all of the reactive methylene groups (if present) and/or hydroxy groups present on the resin. The dye-attached polyester resin is combined with an aminoplast crosslinking agent and acid catalyst in a suitable solvent system to form the final anti-reflective coating.

公开(公告)号：EP2142960A4

公开(公告)日：2010-11-10

申请号：EP08730646

申请日：2008-02-25

Applicant: BREWER SCIENCE INC

Inventor： ZHONG XING-FU ,  FLAIM TONY D ,  MALHOTRA JYOTI

IPC: G03F7/004

CPC classification number: G03F7/0752 ,  G03F7/0045 ,  G03F7/0382 ,  G03F7/0751 ,  Y10S430/108 ,  Y10S430/115

公开(公告)号：EP1715961A4

公开(公告)日：2007-08-22

申请号：EP05705442

申请日：2005-01-07

Applicant: BREWER SCIENCE INC

Inventor： LI CHENGHONG ,  RUBEN KIMBERLY A ,  FLAIM TONY D

IPC: B05D1/36 ,  B32B9/04 ,  B81C1/00 ,  C09D125/12 ,  H01L21/308 ,  H01L21/311

CPC classification number: B81C1/00539 ,  C03C15/00 ,  C03C2218/355 ,  C09D125/12 ,  H01L21/3081 ,  H01L21/31144 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

公开(公告)号：EP2601676A4

公开(公告)日：2014-08-06

申请号：EP11836791

申请日：2011-08-05

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  ZHONG XING-FU ,  FLAIM TONY D ,  MCCUTCHEON JEREMY

IPC: H01L21/20 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

公开(公告)号：EP2362970A4

公开(公告)日：2013-05-29

申请号：EP09824030

申请日：2009-10-22

Applicant: BREWER SCIENCE INC

Inventor： HONG WENBIN ,  BAI DONGSHUN ,  FLAIM TONY D ,  PULIGADDA RAMA

IPC: H01L21/302 ,  C08L65/00 ,  C09J123/08 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/187 ,  C08G2261/332 ,  C08G2261/418 ,  C08L65/00 ,  C09J123/0823 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/1153 ,  Y10T428/24355 ,  Y10T428/24802

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

公开(公告)号：EP1590100A4

公开(公告)日：2006-04-05

申请号：EP04703073

申请日：2004-01-16

Applicant: BREWER SCIENCE INC

Inventor： FLAIM TONY D ,  WANG YUBAO ,  MERCADO RAMIL-MARCELO L

IPC: B05D3/02 ,  C04B35/00 ,  C08F20060101 ,  C08F2/00 ,  C08G79/00 ,  C08K3/00 ,  C08K3/10 ,  C08K5/00 ,  C08K5/56 ,  C08L85/00

CPC classification number: C08G79/00 ,  C08K5/0091 ,  C08K5/56 ,  C08L85/00 ,  Y10T428/25 ,  C08L2666/02

Abstract: Novel compositions and methods of using those compositions to form metal oxide films or coatings are provided. The compositions comprise an organometallic oligomer and an organic polymer dispersed or dissolved in a solvent system. The compositions have long shelf lives and can be prepared by easy and reliable preparation procedures. The compositions can be cured to cause conversion of the compositions into films of metal oxide interdispersed with organic polymer or oligomer. The cured films have high refractive indices, high optical clarities, and good mechanical stabilities at film thickness of greater than about 1 µm.

公开(公告)号：EP3172762A4

公开(公告)日：2018-02-28

申请号：EP15824894

申请日：2015-07-22

Applicant: BREWER SCIENCE INC

Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

IPC: H01L21/683 ,  C08G73/10 ,  C09D179/08 ,  H01L21/58

CPC classification number: B32B7/06 ,  B05D3/007 ,  B32B27/06 ,  B32B37/14 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2405/00 ,  B32B2457/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

公开(公告)号：EP2419926A4

公开(公告)日：2013-06-05

申请号：EP10810300

申请日：2010-03-19

Applicant: BREWER SCIENCE INC

Inventor： TANG TINGJI ,  XU GU ,  ZHONG XING-FU ,  HONG WENBIN ,  FLAIM TONY D ,  YESS KIMBERLY ,  TRICHUR RAMACHANDRAN K

IPC: H01L21/312 ,  B81C1/00 ,  C08G61/08 ,  G03F7/039

CPC classification number: B81C1/00801 ,  B81C2201/053 ,  C08G61/08 ,  C08G2261/3324 ,  C08G2261/418 ,  G03F7/033 ,  G03F7/094 ,  H01L21/0274 ,  H01L21/3081 ,  Y10T428/31645 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T428/31909