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公开(公告)号:DE69431181D1
公开(公告)日:2002-09-19
申请号:DE69431181
申请日:1994-05-19
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE
IPC: H01L27/088 , H01L21/8232 , H01L21/8234 , H01L21/8238 , H01L27/06 , H01L27/092 , H01L29/78 , H01L21/76
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公开(公告)号:DE69331052T2
公开(公告)日:2002-06-06
申请号:DE69331052
申请日:1993-07-01
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE , LEONARDI SALVATORE , CACCIOLA GIOVANNA
IPC: H01L29/73 , H01L21/331 , H01L21/76 , H01L29/06 , H01L29/10 , H01L29/732 , H01L29/78 , H01L21/329 , H01L21/336 , H01L21/761
Abstract: An integrated edge structure for a high voltage semiconductor device comprising a PN junction represented by a diffused region (3,7) of a first conductivity type extending from a semiconductor device top surface is described. The edge structure comprises a first lightly doped ring (4) of the first conductivity type obtained in a first lightly doped epitaxial layer (2) of a second conductivity type and surrounding said diffused region (3,7), and a second lightly doped ring (8) of the first conductivity type, superimposed on and merged with said first ring (4), obtained in a second lightly doped epitaxial layer (6) of the second conductivity type grown over the first epitaxial layer (2).
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公开(公告)号:DE69426565T2
公开(公告)日:2001-05-31
申请号:DE69426565
申请日:1994-09-21
Applicant: ST MICROELECTRONICS SRL , CONS RIC MICROELETTRONICA
Inventor: PALARA SERGIO , ZAMBRANO RAFFAELE
IPC: H01L27/04 , H01L27/02 , H01L29/78 , H03K17/08 , H03K17/687
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公开(公告)号:DE69519476D1
公开(公告)日:2000-12-28
申请号:DE69519476
申请日:1995-12-07
Applicant: SGS THOMSON MICROELECTRONICS , CONS RIC MICROELETTRONICA
Inventor: CAPOCELLI PIERO , ZAMBRANO RAFFAELE , PIO FEDERICO , RIVA CARLO
IPC: H01F17/00 , H01F41/04 , H01L23/522 , H01L27/04
Abstract: Inductive structures making highly efficient use of the magnetic flux generated, and being consistent with integrated circuit manufacturing techniques, and a method of making them on a semiconductor substrate concurrently with the formation of the integrated circuit itself.
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公开(公告)号:DE69223499D1
公开(公告)日:1998-01-22
申请号:DE69223499
申请日:1992-04-02
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE
IPC: H01L29/78 , H01L21/331 , H01L27/06 , H01L29/73 , H01L29/732 , H01L29/735
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公开(公告)号:DE69125390T2
公开(公告)日:1997-08-28
申请号:DE69125390
申请日:1991-07-03
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE
IPC: H01L27/06 , H01L21/331 , H01L27/082 , H01L29/73 , H01L29/732
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公开(公告)号:DE69029942D1
公开(公告)日:1997-03-27
申请号:DE69029942
申请日:1990-10-16
Applicant: SGS THOMSON MICROELECTRONICS , CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE , MAGRO CARMELO
IPC: H01L21/336 , H01L29/10 , H01L29/78 , H01L29/772
Abstract: The process provides first for the accomplishment of low-doping body regions (12) at the sides and under a gate region (15) and then the accomplishment of high-doping body regions (14) inside said low-doping body regions (12) and self-aligned with said gate region (15). There is thus obtained an MOS power transistor with vertical current flow which has high-doping body regions (14) self-aligned with said gate region (15) and with a reduced junction depth.
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公开(公告)号:DE69122598D1
公开(公告)日:1996-11-14
申请号:DE69122598
申请日:1991-12-18
Applicant: SGS THOMSON MICROELECTRONICS , CONS RIC MICROELETTRONICA
Inventor: PUZZOLO SANTO , ZAMBRANO RAFFAELE , PAPARO MARIO
IPC: H01L21/8249 , H01L21/331 , H01L21/8222 , H01L27/06 , H01L27/082 , H01L29/73 , H01L29/732 , H01L21/82
Abstract: In the version with unisolated components the components of the structure are totally or partially superimposed on each other, partly in a first epitaxial layer and partly in a second epitaxial layer; the low voltage bipolar transistor is indeed situated above the emitter region of the bipolar power transistor which is thus a completely buried active structure. In the version with isolated components, in an n- epitaxial layer there are two p+ regions, i.e. the first, constituting the power transistor base, encloses the n+ emitter region of said transistor while the second encloses two n+ regions and one p+ region constituting the collector, emitter and base regions respectively of the low voltage transistor. A metallization on the front of the chip provides connection between the collector contact of the low voltage transistor and the emitter contact of the power transistor.
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公开(公告)号:DE69213675D1
公开(公告)日:1996-10-17
申请号:DE69213675
申请日:1992-11-27
Applicant: SGS THOMSON MICROELECTRONICS , CONS RIC MICROELETTRONICA
Inventor: PAPARO MARIO , ZAMBRANO RAFFAELE
Abstract: In the device there are present a first, second and third switch designed to connect a node of the insulation region with a ground node, the collector or drain of the power transistor and a region of a control circuit transistor respectively. The dynamic insulation circuit of the control circuit comprises a pilot circuit which controls: closing of the first switch when the potential of the ground node (or insulation region) is less than the potential of the collector or drain region of the power transistor and the potential of the control circuit region, closing of the second switch and opening of the first when the potential of the collector or drain region of the power transistor is less than the potential of the ground node (or the insulation region), closing of the third switch and opening of the first when the potential of said control circuit region is less than the potential of the ground node (or the insulation region).
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公开(公告)号:DE69113987T2
公开(公告)日:1996-04-25
申请号:DE69113987
申请日:1991-04-17
Applicant: CONS RIC MICROELETTRONICA
Inventor: ZAMBRANO RAFFAELE
IPC: H01L21/76 , H01L21/331 , H01L21/74 , H01L21/761 , H01L21/8222 , H01L21/8228 , H01L27/06 , H01L27/082 , H01L29/73
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