公开(公告)号：CA1135871A

公开(公告)日：1982-11-16

申请号：CA336708

申请日：1979-10-01

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  KIESSLING JOHN B ,  PERLMAN DAVID J ,  TYNAN EUGENE E ,  VON GUTFELD ROBERT J

IPC: H01R43/00 ,  B23K26/22 ,  H01L21/60 ,  H01R43/02 ,  H05K3/32 ,  H05K3/00

Abstract: METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS A wire is positioned in intimate contact with a microcircuit hip above a conductor line or pad on the chip. The line is protected by a thin film layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line. YO978-042

公开(公告)号：FI57673C

公开(公告)日：1980-09-10

申请号：FI269373

申请日：1973-08-29

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  CUOMO JEROME JOHN ,  GAMBINO RICHARD JOSEPH

IPC: G02F1/09 ,  C22C19/00 ,  C22C45/04 ,  G02F1/00 ,  G11B11/10 ,  G11B11/105 ,  G11C11/14 ,  G11C13/06 ,  G11C19/08 ,  H01F10/00 ,  H01F10/12 ,  H01F10/13 ,  H01F10/14 ,  H01F10/16 ,  H01F10/10

公开(公告)号：CA1028056A

公开(公告)日：1978-03-14

申请号：CA280629

申请日：1977-06-16

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  CUOMO JEROME J ,  GAMBINO RICHARD J

公开(公告)号：CA995865A

公开(公告)日：1976-08-31

申请号：CA159892

申请日：1972-12-27

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FEDER RALPH ,  ROSENBERG ROBERT

IPC: C08J5/16 ,  C23C14/24 ,  C23C14/34 ,  C23C30/00 ,  C25D7/00 ,  C25D7/10 ,  F16C33/12 ,  F16C33/20 ,  G11B5/187 ,  G11B5/72

Abstract: 1395738 Records INTERNATIONAL BUSINESS MACHINES CORP 25 Oct 1972 [30 Dec 1971] 49105/72 Heading G5R [Also in Division C7] A wear resistant surface is provided on a first component, e.g. a magnetic disc or tape of granular material having a predetermined grain size, for sliding mechanical contact by a second component, e.g. a magnetic transducer head movable over the surface, by forming on the first component a layer of granular polycrystalline material, e.g. Au or Ni having a grain size of 10 to 1000Š, less than that of the first component, to reduce the development of a wear track caused by an asperity of the face of the second component. A polycrystalline Ni layer may-be electroplated from a solution comprising 218 g/l NiCl 2 .6H 2 O, 25 g/l H 3 BO 3 , 1À64 g/l Na saccharin and 10 drops of saturated 2- butyne 1,4 diol.

公开(公告)号：AU4870772A

公开(公告)日：1974-05-09

申请号：AU4870772

申请日：1972-11-09

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FEDER RALPH ,  RESENBERG ROBERT

IPC: C08J5/16 ,  C23C14/24 ,  C23C14/34 ,  C23C30/00 ,  C25D7/00 ,  C25D7/10 ,  F16C33/12 ,  F16C33/20 ,  G11B5/187 ,  G11B5/72 ,  C23B5/08 ,  C23C13/04 ,  C23C15/00

Abstract: 1395738 Records INTERNATIONAL BUSINESS MACHINES CORP 25 Oct 1972 [30 Dec 1971] 49105/72 Heading G5R [Also in Division C7] A wear resistant surface is provided on a first component, e.g. a magnetic disc or tape of granular material having a predetermined grain size, for sliding mechanical contact by a second component, e.g. a magnetic transducer head movable over the surface, by forming on the first component a layer of granular polycrystalline material, e.g. Au or Ni having a grain size of 10 to 1000Š, less than that of the first component, to reduce the development of a wear track caused by an asperity of the face of the second component. A polycrystalline Ni layer may-be electroplated from a solution comprising 218 g/l NiCl 2 .6H 2 O, 25 g/l H 3 BO 3 , 1À64 g/l Na saccharin and 10 drops of saturated 2- butyne 1,4 diol.

公开(公告)号：CA945506A

公开(公告)日：1974-04-16

申请号：CA113589

申请日：1971-05-21

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FREEDMAN JAMES F ,  KOVAC ZLATA

IPC: B29C70/14 ,  B29C70/62 ,  C22C32/00 ,  C22C47/00

公开(公告)号：DE2340475A1

公开(公告)日：1974-04-04

申请号：DE2340475

申请日：1973-08-10

Applicant: IBM

Inventor： CUOMO JEROME JOHN ,  GAMBINO RICHARD JOSEPH ,  MCGUIRE RHOMAS ROCHE ,  CHAUDHARI PRAVEEN

IPC: G11C11/14 ,  G11B11/10 ,  G11B11/105 ,  G11B11/11 ,  G11C13/06 ,  G11C19/08 ,  H01F10/00 ,  H01F10/12 ,  H01F10/13 ,  G11C13/04 ,  G11B5/62 ,  G11B7/24

公开(公告)号：DE60128953D1

公开(公告)日：2007-07-26

申请号：DE60128953

申请日：2001-11-30

Applicant: IBM

Inventor： CALLEGARI ALESSANDRO C ,  CHAUDHARI PRAVEEN ,  DOANY FUAD E ,  DOYLE JAMES P ,  GALLIGAN EILEEN A ,  HOUGHAM GARETH G ,  GLOWNIA JAMES H ,  LACEY JAMES A ,  LIEN SHUI-CHIH ,  LU MINHAU ,  ROSENBLUTH ALAN E ,  YANG KEI-HSIUNG

IPC: G02F1/1337 ,  B01J19/12 ,  C01B31/02 ,  C23C14/48 ,  C23C14/58

Abstract: A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

公开(公告)号：AT364860T

公开(公告)日：2007-07-15

申请号：AT01993186

申请日：2001-11-30

Applicant: IBM

Inventor： CALLEGARI ALESSANDRO ,  CHAUDHARI PRAVEEN ,  DOANY FUAD E ,  DOYLE JAMES ,  GALLIGAN EILEEN ,  HOUGHAM GARETH ,  GLOWNIA JAMES ,  LACEY JAMES ,  LIEN SHUI-CHIH ,  LU MINHAU ,  ROSENBLUTH ALAN ,  YANG KEI-HSIUNG

IPC: G02F1/1337 ,  B01J19/12 ,  C01B31/02 ,  C23C14/48 ,  C23C14/58

Abstract: A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

公开(公告)号：AU2002351391A1

公开(公告)日：2004-07-22

申请号：AU2002351391

申请日：2002-12-18

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN

IPC: H01L21/98 ,  H01L23/12 ,  H01L51/00 ,  H01L23/48

Abstract: A method of assembling a circuit includes providing a template, enabling a semiconductor material to self assemble on the template, and enabling self-assembly of a connection between the semiconductor material and the template to form the circuit and a circuit created by self-assembly.