公开(公告)号：DE102014116451A1

公开(公告)日：2015-05-13

申请号：DE102014116451

申请日：2014-11-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： RUHL GÜNTHER ,  FRIES MANFRED ,  ELIAN KLAUS ,  DARRER FRANZ MICHAEL ,  THEUSS HORST ,  VAUPEL MATHIAS ,  DANGELMAIER JOCHEN ,  MÜLLER THOMAS

IPC: H01M10/48

Abstract: Eine Sensoranordnung gemäß einem Ausführungsbeispiel weist einen Sender auf, der innerhalb einer Batteriezelle angeordnet werden soll und ein Signal drahtlos basierend auf zumindest einem erfassten Betriebsparameter der Batteriezelle übertragen soll.

公开(公告)号：DE102009042921A1

公开(公告)日：2010-04-29

申请号：DE102009042921

申请日：2009-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  FRIES MANFRED ,  PETZ MARTIN ,  MUELLER THOMAS

IPC: H01L23/055 ,  H01L21/60 ,  H01L23/28 ,  H01L23/34 ,  H01L23/48

Abstract: This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.

公开(公告)号：BR9917569A

公开(公告)日：2004-02-25

申请号：BR9917569

申请日：1999-12-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  HOUDEAU DETLEF

IPC: G07G1/00 ,  G06K19/067 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077 ,  G06K19/10 ,  G08B13/24 ,  G09F3/00 ,  H01Q1/00

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

公开(公告)号：DE59708844D1

公开(公告)日：2003-01-09

申请号：DE59708844

申请日：1997-06-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED

IPC: G06K19/07 ,  G06K7/08 ,  G06K19/00 ,  G06K19/067 ,  G06K19/077

Abstract: The portable data transmission system is adapted to the contactless transmission of electrical signals and/or data between a smart card and a read-write station. The smart card has an electronic circuit with a data memory and an induction coil integrated in a smart card body. A coupling element is assigned to the induction coil and is disposed in a predetermined spatial position with regard to the induction coil. The smart card and the coupling element are respectively autonomous components which can be used independently of one another. A fixing element is at least partially matched to the outer dimensions of the smart card. The fixing element supports the smart card, on the one hand, and the coupling element, on the other hand, in the predetermined position with regard to the smart card.

公开(公告)号：AT222010T

公开(公告)日：2002-08-15

申请号：AT99936259

申请日：1999-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  A61B5/1172 ,  G06F3/041 ,  G06K9/00 ,  G06K9/20 ,  G06K9/62 ,  G06K11/06 ,  G06T1/00 ,  G06K11/16

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

公开(公告)号：AU5460901A

公开(公告)日：2001-10-15

申请号：AU5460901

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：BR9912812A

公开(公告)日：2001-05-02

申请号：BR9912812

申请日：1999-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.