公开(公告)号：DE102018119677A1

公开(公告)日：2020-02-20

申请号：DE102018119677

申请日：2018-08-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STRUTZ VOLKER ,  SCHALLER RAINER MARKUS

IPC: H01L25/04 ,  H01L43/02 ,  H01L43/06 ,  H01L43/12

Abstract: Ein Sensorpackage umfasst einen Metallträger und einen auf dem Metallträger angeordneten Sensorchip mit einem ersten Sensorelement. In einer Orthogonalprojektion des Sensorchips auf eine Oberfläche des Metallträgers sind mindestens zwei Kantenabschnitte des Sensorchips mit der Oberfläche des Metallträgers überlappungsfrei. Der Sensorchip ist dazu ausgelegt, ein von einem durch einen Stromleiter fließenden elektrischen Strom induziertes Magnetfeld zu erfassen.

公开(公告)号：DE102009044714B4

公开(公告)日：2017-09-21

申请号：DE102009044714

申请日：2009-12-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRÜNDLER GEROLD ,  HÖGERL JÜRGEN ,  STRUTZ VOLKER ,  LUTZ HERMANN JOSEF

IPC: H01L21/58 ,  H01L23/12 ,  H05K3/32

Abstract: Verfahren zum Montieren eines Halbleiter-Bauelements, umfassend: Bereitstellen eines an einem elastischen Träger (36) angebrachten Chips (38); Stützen des elastischen Trägers (36) mit einer Versteifung (52, 62, 92); und Entfernen der Versteifung (52, 62, 92) von dem elastischen Träger (36) nach dem Anbringen des elastischen Trägers (36) an einer Platine (32), wobei der elastische Träger (36) an der Platine (32) angebracht bleibt und wobei der elastische Träger (36) ein Elastizitätsmodul zwischen 2 und 12 kN/mm2 aufweist.

公开(公告)号：DE102013100156A1

公开(公告)日：2013-07-11

申请号：DE102013100156

申请日：2013-01-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUSSERLECHNER UDO ,  GRUENBERGER ROBERT ,  STRUTZ VOLKER ,  VON KOBLINSKI CARSTEN ,  WABNIG SIGRID

IPC: H01L23/13 ,  H01L21/56 ,  H01L21/58 ,  H01L23/15 ,  H01L23/28 ,  H01L23/48 ,  H01L43/06

Abstract: In einer Ausführungsform enthält ein Halbleiterbaustein (130) einen isolierenden Behälter (1410) mit einer Aussparung, die einen inneren Membranabschnitt und einen äußeren Randabschnitt bildet. Der Randabschnitt ist dicker als der Membranabschnitt. Der Baustein (130) enthält einen Halbleiterchip, der in der Aussparung angeordnet ist, und eine Rückwand (1405), die unter dem Membranabschnitt des isolierenden Behälters (1410) angeordnet ist.

公开(公告)号：DE102005012216B4

公开(公告)日：2008-11-13

申请号：DE102005012216

申请日：2005-03-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/36 ,  H01L23/40 ,  H05K7/20

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

公开(公告)号：DE102006022748A1

公开(公告)日：2007-11-15

申请号：DE102006022748

申请日：2006-05-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L21/50 ,  H01L23/31 ,  H01L25/00 ,  H05K1/18 ,  H05K3/30 ,  H05K7/06

公开(公告)号：DE102004059232A1

公开(公告)日：2006-06-14

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L23/34 ,  H01L23/50

Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

公开(公告)号：DE10361106A1

公开(公告)日：2005-05-04

申请号：DE10361106

申请日：2003-12-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L25/10 ,  H01L23/50

Abstract: Semiconductor component contains semiconductor chip (1) and rigid wiring board (2) with outer contacts (3), with chip carried by wiring board whose area is larger than area of semiconductor chip. Resilient bending element structures (4) are included in wiring board for its bending deformation. Preferably chip comprises flipchip contacts (5) coupled to contact terminal pads on top side (6) of wiring board. They are linked to board underside (9) via conductive tracks on top side and through contacts. Independent claims are included for manufacture of wafer with semiconductor chips and wiring boards.

公开(公告)号：DE10236184A1

公开(公告)日：2004-02-19

申请号：DE10236184

申请日：2002-08-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA ,  IRSIGLER ROLAND ,  STRUTZ VOLKER

IPC: H01L23/04 ,  H01L23/32 ,  H01L23/50

Abstract: A semiconductor element (1) for mounting on a conductor plate comprises a chip (3) with a housing (4) and electrical contacts (5) directly to the plate. The housing is only glued to the chip and has a protective cover (8) and frame (9) which does not touch the chip but mechanically supports the housing on the plate.

公开(公告)号：DE10135393B4

公开(公告)日：2004-02-05

申请号：DE10135393

申请日：2001-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GEBAUER UTA ,  STRUTZ VOLKER ,  HEDLER HARRY

IPC: B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  H01L23/50 ,  H01L21/58

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

公开(公告)号：DE10045534A1

公开(公告)日：2002-04-04

申请号：DE10045534

申请日：2000-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： STRUTZ VOLKER ,  GEBAUER UTA

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H05K3/32

Abstract: Outer connection elements (2) are connected to contact areas (3) of a system carrier (4) or of a chip. At least one connection element is provided as a capillary element (6) protruding from the electronic component (1) having a suction opening (8). An Independent claim is also provided for a method for providing electronic connection between the electrical component and the circuit board.