公开(公告)号：US11696396B2

公开(公告)日：2023-07-04

申请号：US17585363

申请日：2022-01-26

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H05K1/0268 ,  H05K1/0283 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US09793634B2

公开(公告)日：2017-10-17

申请号：US15060728

申请日：2016-03-04

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/415 ,  H01R13/11 ,  H01R43/04 ,  H01R12/71

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US20170149155A1

公开(公告)日：2017-05-25

申请号：US14952242

申请日：2015-11-25

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H01R12/58

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US08795865B2

公开(公告)日：2014-08-05

申请号：US12358032

申请日：2009-01-22

Applicant: Junyoung Park

Inventor： Junyoung Park

IPC: H01M2/10 ,  H01M4/02

CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

Abstract: A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.

Abstract translation: 公开了一种电池组，其防止由于电池将电池连接到保护电路板而将焊料材料向下流动，从而提高了可靠性，耦合效率，安全性和生产率。 电池组包括：具有正电极和负电极的多单元电池，多个电池单元彼此电连接; 电连接到多节电池并具有通孔的保护电路板; 一对导电片，每个导电片包括插入对应的通孔中的插入部分和从插入部分整体延伸并从插入部分弯曲的弯曲部分; 以及一对焊接部分，每个焊接部分在相应的插入部分和对应的弯曲部分的至少一些部分处形成。

公开(公告)号：US06169325A

公开(公告)日：2001-01-02

申请号：US09210883

申请日：1998-12-15

Applicant: Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

Inventor： Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

IPC: H01L2302

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起，实现了大型存储尺寸的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的灌封树脂和布置在两个相对的短边上的一对支撑引线构成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：US3444617A

公开(公告)日：1969-05-20

申请号：US3444617D

申请日：1965-11-05

Applicant: IBM

Inventor： STRICKER ALFRED A ,  WALKER WILLIAM J

IPC: H05K3/30 ,  H05K7/10

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K7/1053 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/4914

公开(公告)号：US3281923A

公开(公告)日：1966-11-01

申请号：US39239364

申请日：1964-08-27

Applicant: CORNING GLASS WORKS

Inventor： BEST HOWARD S ,  EDELSON NORMAN M

IPC: H01L21/48 ,  H01R4/06 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/328 ,  H01L21/4853 ,  H01R4/06 ,  H01R12/58 ,  H05K3/308 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1078 ,  H05K2203/1115 ,  H05K2203/1446 ,  Y10T29/49151

公开(公告)号：US3063134A

公开(公告)日：1962-11-13

申请号：US77971158

申请日：1958-12-11

Applicant: WESTERN ELECTRIC CO

Inventor： MCGRAW JR GEORGE P

IPC: H05K13/00

CPC classification number: H05K3/284 ,  H05K3/308 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10409 ,  H05K2201/10651 ,  H05K2201/1078 ,  Y10T29/49172 ,  Y10T29/49888

公开(公告)号：US11710929B2

公开(公告)日：2023-07-25

申请号：US17340309

申请日：2021-06-07

Applicant: Dongguan Luxshare Technologies Co., Ltd

Inventor： Xiaogang Liu ,  Rongzhe Guo ,  Kun Liu ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

公开(公告)号：US11699881B2

公开(公告)日：2023-07-11

申请号：US17340369

申请日：2021-06-07

Applicant: Dongguan Luxshare Technologies Co., Ltd

Inventor： Xiaogang Liu ,  Rongzhe Guo ,  Kun Liu ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A terminal module includes a number of conductive terminals and an insulating frame. Each conductive terminal includes a contact portion. The conductive terminals include a first signal terminal and a second signal terminal. The contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The terminal module includes an insulating block sleeved on the first contact arm and the second contact arm, and a metal shield surrounding member sleeved on the insulating block. The insulating block includes a limiting groove and the metal shield surrounding member includes a limiting protrusion protruding into the limiting groove. As a result, it facilitates to assemble the insulating block and the metal shield surrounding member. The present disclosure also relates to a backplane connector having the terminal module.