Abstract:
(과제) 특히, 접속 단자부를 프린트 기판의 스루홀에 삽입하여 리플로우 납땜했을 때에, 깨끗한 땜납 필렛을 형성할 수 있고, 높은 실장 신뢰성을 얻을 수 있는 전기 부품, 및 상기 전기 부품의 실장 구조, 그리고, 상기 전기 부품의 실장 방법을 제공하는 것을 목적으로 하고 있다. (해결 수단) 회전형 전기 부품을 구성하는 접속 단자부 (17, 18) 는, 금속판 (3, 6) 을 휨 가공하여 외주면 (17a, 18a) 이 곡면으로 형성되어 있다. 접속 단자부 (17, 18) 의 선단 (17b, 18b) 이 스루홀에 충전된 크림 땜납을 압출하기 위한 압출부 (37) 이며, 외주면 (17a, 18a) 이 가열하여 용융된 땜납을 스루홀의 내벽과의 사이에 흡인하기 위한 흡인부 (38) 으로서 기능한다.
Abstract:
This invention provides an electronic assembly (1) for receiving an electronic part (10) in an automotive lighting device. This electronic assembly (1) comprises a plastics substrate (2), an electrically insulating support element (4) and a conductive link (5). The plastics substrate (2) comprises at least one conductive track (3) directly deposited on a first face (21) of the plastics substrate (2). The electrically insulating support element (4) protrudes from the first face (21) of the plastics substrate (2). The conductive link (5) is in electrical contact with the at least one conductive track (3), is mechanically coupled with the electrically insulating support element (4) and comprises a connection portion (51) suitable for being electrically connected to the electronic part (10) of an automotive lighting device (1).
Abstract:
A high frequency circuit unit suitable for miniaturization is provided by surely soldering a single face of a fixing leg of a cover body to a land on a circuit substrate. In the high frequency circuit unit, an electronic component (2) mounted on a component mounting face (1a) of a circuit substrate (1) is covered by a cover body(3) consisting of a metal plate, a fixing leg (6) protruded from four courses of the cover body (3) is inserted into a through-hole (4) in the circuit substrate (1), and a copper foil land (5) provided in a periphery of the through-hole (4) and the fixing leg (6) are soldered on the component mounting face (1a). The fixing leg (6) is press-molded to have a watershoot shape such that one side of front-back both faces for the becomes a convex surface (6a) and the other side becomes a concave surface(6b), and the convex surface (6a) is provided to face an outer circumference side of the circuit substrate (1) within the through-hole (4), in order to solder the convex surface (6a) of the fixing leg (6) to the copper foil land (5).
Abstract:
Contact connecteur pour circuits hybrides utilisés en microélectronique assurant une liaison entre un substrat et un support. Le contact présente une partie (A) destinée à être fixée sur le substrat (S) et une partie (B) destinée à être engagée dans le trou (C1) du support (C). La partie (B) destinée à être engagée dans le trou (C1) du support (C) est soumise à un traitement apte à lui conférer une section transversale ouverte profilée, pour épouser par élasticité, la section du trou (C1) du support (C).