公开(公告)号：KR1020060009401A

公开(公告)日：2006-01-31

申请号：KR1020060002248

申请日：2006-01-09

Applicant: 닛본 덴끼 가부시끼가이샤

Inventor： 모모카와유키

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: 무연솔더를 이용하여도 낮은 비용으로 랜드박리를 생기지 않게 위하여, 관통홀(12)을 갖는 기판(11), 관통홀(12)의 내면을 덮는 제1도전막(13), 기판(11)의 표면에서의 관통홀(12)의 개구의 주위에 형성되고 아울러 제1도전막(13)에 접속된 제2도전막으로 이루어진 랜드(15), 기판(11)의 표면에 형성되고 아울러 랜드(15)에 접속된 회로배선(16), 이 회로배선(16)을 덮는 보호막(17), 및 랜드(15)의 외주가장자리(15A)의 적어도 일부를 덮는 피복부재(18)를 구비한다.
기판, 랜드박리, 랜드, 피복부재, 무연솔더

Abstract translation: 具有通孔12的基板11，覆盖通孔12的内表面的第一导电膜13和覆盖通孔12的内表面的第一导电膜13， 它是围绕在表面处的通孔12的开口形成，以及形成由第二导电膜15，基板11被连接到第一导电膜13以及土地的土地的表面上（15 覆盖电路布线16的保护膜17和覆盖焊盘15的外周缘15A的至少一部分的覆盖部件18。

公开(公告)号：JP2015198103A

公开(公告)日：2015-11-09

申请号：JP2014073577

申请日：2014-03-31

Applicant: パナソニックIPマネジメント株式会社

Inventor： 松本 玄 ,  小掠 哲義 ,  和久田 大介

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K3/0044 ,  H05K3/14 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10901 ,  H05K3/16 ,  Y10T29/49162

Abstract: 【課題】可撓性に加えて伸縮性も呈する伸縮性フレキシブル基板を提供すること。 【解決手段】配線を備えた絶縁性フィルム基材を有して成る伸縮性フレキシブル基板が提供される。かかる伸縮性フレキシブル基板は、絶縁性フィルム基材には複数のスリットが所定間隔をあけて設けられ、絶縁性フィルム基材がスリットを基点に折れ曲がった又は湾曲した蛇腹形状を有しており、また、絶縁性フィルム基材の引伸ばしに際してはスリットが変形する。 【選択図】図1

Abstract translation: 要解决的问题：提供具有柔性和弹性的弹性和柔性基板。解决方案：提供一种弹性和柔性基板，其具有包括布线的凹陷膜基板。 弹性和柔性基板具有在绝缘膜基板上以预定间隔形成的多个狭缝。 该凹陷膜基材具有在狭缝上弯曲或折叠的檐口形状。 当凹版薄膜基板膨胀时，狭缝变形。

公开(公告)号：JP3943181B2

公开(公告)日：2007-07-11

申请号：JP3540097

申请日：1997-02-20

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

Inventor： ヴァーゲンブレンナー ヴァルター ,  ヴィーザ トーマス ,  シミツェク ラルフ

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/0061 ,  H05K3/0094 ,  H05K3/3447 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394 ,  Y10T156/16

公开(公告)号：KR100629982B1

公开(公告)日：2006-10-02

申请号：KR1020060002249

申请日：2006-01-09

Applicant: 닛본 덴끼 가부시끼가이샤

Inventor： 모모카와유키

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: 무연솔더를 이용하여도 낮은 비용으로 랜드박리를 생기지 않게 위하여, 관통홀(12)을 갖는 기판(11), 관통홀(12)의 내면을 덮는 제1도전막(13), 기판(11)의 표면에서의 관통홀(12)의 개구의 주위에 형성되고 아울러 제1도전막(13)에 접속된 제2도전막으로 이루어진 랜드(15), 기판(11)의 표면에 형성되고 아울러 랜드(15)에 접속된 회로배선(16), 이 회로배선(16)을 덮는 보호막(17), 및 랜드(15)의 외주가장자리(15A)의 적어도 일부를 덮는 피복부재(18)를 구비한다.
기판, 랜드박리, 랜드, 피복부재, 무연솔더

公开(公告)号：US20240090114A1

公开(公告)日：2024-03-14

申请号：US18273173

申请日：2022-01-04

Applicant: LS ELECTRIC CO., LTD.

Inventor： Jae Moon LEE

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0201 ,  H05K1/18 ,  H05K7/20909 ,  H05K7/20927 ,  H05K2201/10901 ,  H05K2201/2045

Abstract: The present disclosure relates to an inverter module comprising: a power module coupled to a PCB; a thermal pad positioned between the PCB and the power module to prevent foreign substances from being attached to the PCB and the power module and to conduct heat; and a cooling device including a heat sink attached to the power module to cool the power module.

公开(公告)号：US20230284387A1

公开(公告)日：2023-09-07

申请号：US17688473

申请日：2022-03-07

Applicant: Rolls-Royce Corporation

Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10901

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first portion arranged around the electrical connection pin and a second portion located radially outward of the first portion.

公开(公告)号：US09924595B2

公开(公告)日：2018-03-20

申请号：US14567402

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Beom-Taek Lee ,  Raul Enriquez Shibayama

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01R12/58 ,  H01R12/71 ,  H01R31/06

CPC classification number: H05K1/115 ,  H01R12/585 ,  H01R12/718 ,  H01R31/06 ,  H05K1/147 ,  H05K1/184 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10901

Abstract: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

公开(公告)号：US09761972B2

公开(公告)日：2017-09-12

申请号：US15200695

申请日：2016-07-01

Applicant: MERCURY SYSTEMS, INC.

Inventor： Philip Beucler ,  Daniel Coolidge ,  Darryl J. McKenney ,  Kevin Jorczak

IPC: H01R9/05 ,  H01R12/71 ,  H01R12/58 ,  H01R13/652 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：US09699893B2

公开(公告)日：2017-07-04

申请号：US14626936

申请日：2015-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Matsumoto ,  Tetsuyoshi Ogura ,  Daisuke Wakuda

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/14 ,  H05K1/11 ,  H05K1/18 ,  H05K3/16

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/14 ,  H05K3/16 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10901 ,  Y10T29/49162

Abstract: An elastic flexible substrate including an insulating film base material provided with a wire is provided. In the insulating film base material, a plurality of slits are provided with a predetermined space left therebetween, the insulating film base material has a bellows shape in which the insulating film base material is bent or curved by using the slits as base points, and the slits are deformed when the insulating film base material is stretched.

公开(公告)号：US20150264810A1

公开(公告)日：2015-09-17

申请号：US14636356

申请日：2015-03-03

Applicant: FUJITSU LIMITED

Inventor： Shunji BABA ,  Manabu WATANABE ,  Kenji FUKUZONO ,  Satoshi OHSAWA ,  Tetsuro YAMADA ,  Akihiro WAKABAYASHI ,  Yasushi MASUDA ,  Yohei MIURA

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/144 ,  H05K1/184 ,  H05K1/185 ,  H05K3/22 ,  H05K3/325 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract translation: 电路板包括：基板; 形成在基板中的通孔; 以及设置在通孔中的连接端子; 其中，所述连接端子包括设置在所述通孔内的基座部分和设置在所述基座部分的中心并且从所述基座部朝向所述基板的第一表面延伸的销，使得所述第一端部从所述第一端部突出， 表面。