公开(公告)号：KR1020090041246A

公开(公告)日：2009-04-28

申请号：KR1020070106849

申请日：2007-10-23

Applicant: 제일모직주식회사

Inventor： 김완중 ,  정기성 ,  홍용우 ,  정철 ,  편아람 ,  정창범

IPC: C09J171/10 ,  C09J163/00 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J7/00 ,  C09J11/04 ,  C09J163/00 ,  C09J171/10 ,  C09J2203/326

Abstract: An adhesive film composition for a semiconductor assembly is provided to reduce the generation of burr or chipping in a sawing process by increasing a tensile modulus before curing of the adhesive film. An adhesive film composition for a semiconductor assembly comprises, based on solid portion, (i) phenoxy resin 2-15 weight%; (ii) ester-based thermoplastic resin 10-30 weight%; (iii) elastomer resin 30-60 weight% containing an hydroxyl group or epoxy group; (iv) epoxy-based resin 5-20 weight%; (v) at least one resin 2-20 weight% selected from the group consisting of a phenol type resin hardener or aromatic amine-based hardener resin as a hardener; and (vi) at least one catalyst 0.01-5 weight% selected from the group consisting of phosphine-based, boron-based and imidazole-based curing catalyst.

Abstract translation: 提供一种用于半导体组件的粘合膜组合物，用于通过增加粘合剂膜固化前的拉伸模量来减少锯切过程中的毛刺或碎屑的产生。 用于半导体组合物的粘合剂膜组合物基于固体部分包含（i）2-15重量％的苯氧基树脂; （ii）10-30重量％的酯基热塑性树脂; （iii）含有羟基或环氧基的30-60重量％弹性体树脂; （iv）环氧树脂5-20重量％树脂; （v）至少一种选自苯酚型树脂固化剂或芳族胺类固化剂树脂作为硬化剂的2-20重量％的树脂; 和（vi）至少一种选自磷化氢基，硼基和咪唑基固化催化剂的0.01-5重量％的催化剂。

公开(公告)号：KR100885794B1

公开(公告)日：2009-02-26

申请号：KR1020060134920

申请日：2006-12-27

Applicant: 제일모직주식회사

Inventor： 정기성 ,  김완중 ,  홍용우 ,  정철 ,  편아람 ,  임수미 ,  정창범

IPC: C09J133/08 ,  C09J133/10 ,  C09J183/00 ,  C09J7/02

Abstract: 본 발명은 반도체 조립용 접착필름 조성물에 관한 것으로서, 더욱 상세하게는 수산기, 카르복실기 또는 에폭시기로부터 라디칼 중합을 가능하게 하는 라디칼 중합형 엘라스토머 수지, 0℃ 내지 200℃범위의 높은 유리전이온도(Tg)를 갖는 접착증진 결정성 폴리에스터 필름형성 수지, (메타)아크릴레이트계 수지 및 모노머, (메타)아크릴레이트 수지 경화제, 첨가제,실란 커플링제, 충진제, 및 유기 용매를 포함하는 것을 특징으로 하는 반도체 조립용 접착필름 조성물에 관한 것이다. 본 발명의 반도체 조립용 접착필름 조성물은, 라디칼중합으로 경화가 이루어짐으로써 반도체 제조 공정시 빠른 경화로 인하여 공정성을 향상시킬 수 있는 반도체 조립용 접착필름을 제공할 수 있다.
반도체 조립용 접착필름, 라디칼 중합형 엘라스토머, 퍼옥시드, 실란 커플링제, 다이쉐어값, 반도체공정

公开(公告)号：KR1020080060604A

公开(公告)日：2008-07-02

申请号：KR1020060134916

申请日：2006-12-27

Applicant: 제일모직주식회사

Inventor： 황용하 ,  송규석 ,  기희연 ,  하경진 ,  조재현 ,  정창범

IPC: C09J133/08 ,  C09J133/06 ,  C09J7/02 ,  C09J5/00

CPC classification number: H01L24/27 ,  H01L21/6836 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0665 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/3512 ,  C09J7/00 ,  C09J2203/326

Abstract: A composition for forming an adhesive film is provided to prevent an acrylic adhesive binder and UV curable acrylate from being transferred to an adhesive layer when used in a dicing die bonding film, and to realize high pick-up property even in large chips greater than 10 mm X 10 mm after UV irradiation. A composition for forming an adhesive film comprises: (A) 100 parts by weight of a polymer binder resin; (B) 20-150 parts by weight of a low-molecular weight UV curable acrylate; (C) 0.1-10 parts by weight of a thermal curing agent; and (D) 0.1-5 parts by weight of a photopolymerization initiator based on 100 parts by weight of the UV curable acrylate. The adhesive film formed by the composition has a sea-island surface structure, wherein the island region has an average size of 1-10 micrometers.

Abstract translation: 提供一种用于形成粘合剂膜的组合物，用于防止丙烯酸粘合剂粘合剂和UV可固化丙烯酸酯用于切割芯片接合膜时被转移到粘合剂层，并且即使在大于10的大芯片中也实现高拾取性能 紫外线照射后10mm×10mm。 用于形成粘合剂膜的组合物包括：（A）100重量份的聚合物粘合剂树脂; （B）20-150重量份的低分子量可UV固化的丙烯酸酯; （C）0.1-10重量份的热固化剂; 和（D）基于100重量份的UV可固化丙烯酸酯0.1-5重量份的光聚合引发剂。 由该组合物形成的粘合膜具有海岛表面结构，其中岛状区域的平均尺寸为1-10微米。

公开(公告)号：KR1020080036425A

公开(公告)日：2008-04-28

申请号：KR1020060102989

申请日：2006-10-23

Applicant: 제일모직주식회사

Inventor： 황자영 ,  강정구 ,  김현영 ,  이규호 ,  배상식 ,  이태현 ,  정창범

IPC: C09J175/04 ,  C09J133/08 ,  C09J133/06 ,  C09J9/02

CPC classification number: C09J9/02 ,  C08L25/00 ,  C08L75/04 ,  C09J4/06 ,  C09J7/00 ,  C09J133/04

Abstract: A composition for an anisotropic conductive film, and an anisotropic conductive film prepared from the composition are provided to improve initial adhesive strength, to reduce contact resistance and to enhance reliance even under the condition of high temperature and high humidity. A composition for an anisotropic conductive film comprises 5-50 wt% of at least one kind of resin selected from polyurethane and its modified resin; 5-50 wt% of at least one kind of resin selected from an indene resin and its copolymer; 1-50 wt% of a (meth)acrylate oligomer or polymer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Preferably the polyurethane and its modified resin have an average molecular weight (Mw) of about 10,000-1,000,000.

Abstract translation: 提供用于各向异性导电膜的组合物和由该组合物制备的各向异性导电膜，以提高初始粘合强度，降低接触电阻，并且即使在高温高湿条件下也可提高依赖性。 用于各向异性导电膜的组合物包含5-50重量％的选自聚氨酯及其改性树脂中的至少一种树脂; 5-50重量％的选自茚树脂及其共聚物中的至少一种树脂; 1-50重量％的（甲基）丙烯酸酯低聚物或聚合物; 1-30重量％的（甲基）丙烯酸酯单体; 0.1-15重量％的自由基引发剂; 和0.01-20重量％的导电颗粒。 优选地，聚氨酯及其改性树脂的平均分子量（Mw）为约10,000-1,000,000。

公开(公告)号：KR100815384B1

公开(公告)日：2008-03-20

申请号：KR1020060136426

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 이규호 ,  배상식 ,  황자영 ,  이태현 ,  강정구 ,  정창범

IPC: C08L101/00 ,  C08L33/00 ,  C08K7/00

Abstract: A composition for an anisotropic conductive film is provided to inhibit flow of polymer particles during hot pressing, to allow maintenance of a low electric contact resistance even under severe conditions including high temperature and high humidity, and to realize excellent reliability. A composition for an anisotropic conductive film comprises: (i) 5-50 wt% of a thermoplastic resin; (ii) 0.1-30 wt% of polymer microparticles; (iii) 1-50 wt% of a (met)acrylate oligomer; (iv) 0.1-15 wt% of a radical initiator; and (v) 0.1-15 wt% of a radical initiator; and (vi) 0.01-20 wt% of conductive particles, wherein the polymer microparticles have a size equal to or smaller than the conductive particles and a softening point of 140-180 deg.C. The polymer microparticle is at least one selected from the group consisting of tetrafluoroethylene-perfluoro(alkylvinylether) copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-hexafluoropropylene-perfluoro(alkylvinylether) copolymer, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, chlorotrifluoroethylene-ethylene copolymer.

Abstract translation: 提供用于各向异性导电膜的组合物以抑制热压时的聚合物颗粒的流动，从而即使在包括高温和高湿度的苛刻条件下也能够保持低的电接触电阻，并且实现优异的可靠性。 用于各向异性导电膜的组合物包括：（i）5-50重量％的热塑性树脂; （ii）0.1-30重量％的聚合物微粒; （iii）1-50重量％的（甲基）丙烯酸酯低聚物; （iv）0.1-15重量％的自由基引发剂; 和（v）0.1-15重量％的自由基引发剂; 和（vi）0.01-20重量％的导电颗粒，其中聚合物微粒的尺寸等于或小于导电颗粒，软化点为140-180℃。 聚合物微粒是选自四氟乙烯 - 全氟（烷基乙烯基醚）共聚物，四氟乙烯 - 六氟丙烯共聚物，四氟乙烯 - 六氟丙烯 - 全氟（烷基乙烯基醚）共聚物，四氟乙烯 - 乙烯共聚物，聚偏二氟乙烯，聚氯三氟乙烯，氯三氟乙烯 - 乙烯共聚物 。

公开(公告)号：KR100787728B1

公开(公告)日：2007-12-24

申请号：KR1020060131009

申请日：2006-12-20

Applicant: 제일모직주식회사

Inventor： 김현영 ,  정창범 ,  강정구 ,  최중식

IPC: C08L33/10 ,  C08F20/06 ,  C08J5/18

Abstract: An anisotropic conductive film composition, and an anisotropic conductive film formed from the composition are provided to improve initial adhesive strength, to increase the reliance even under high temperature and high humidity and under thermal impact, to enhance productivity and to lower contact resistance. An anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 1-50 wt% of an acrylic copolymer resin having a glass transition temperature of 5-120 deg.C; 1-30 wt% of a (meth)acrylate oligomer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Also an anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 1-50 wt% of an acrylic copolymer resin having a glass transition temperature of 5-120 deg.C; 1-80 wt% of at least one of epoxy monomer, oligomer or resin selected from the group consisting of bisphenolic, novolac, glycidyl, aliphatic and alicyclic epoxy compounds; 0.1-15 wt% of a thermal curing agent for epoxy; and 0.01-20 wt% of a conductive particle.

Abstract translation: 提供各向异性导电膜组合物和由该组合物形成的各向异性导电膜，以提高初始粘合强度，即使在高温高湿和热冲击下也可提高依赖性，以提高生产率和降低接触电阻。 各向异性导电膜组合物包含5-50重量％的热塑性树脂; 1-50重量％的玻璃化转变温度为5-120℃的丙烯酸共聚物树脂; 1-30重量％的（甲基）丙烯酸酯低聚物; 1-30重量％的（甲基）丙烯酸酯单体; 0.1-15重量％的自由基引发剂; 和0.01-20重量％的导电颗粒。 各向异性导电膜组合物还包含5-50重量％的热塑性树脂; 1-50重量％的玻璃化转变温度为5-120℃的丙烯酸共聚物树脂; 1-80重量％的选自双酚，酚醛清漆，缩水甘油基，脂族和脂环族环氧化合物的环氧单体，低聚物或树脂中的至少一种; 0.1-15重量％的环氧树脂热固化剂; 和0.01-20重量％的导电颗粒。

公开(公告)号：KR100787727B1

公开(公告)日：2007-12-24

申请号：KR1020060106239

申请日：2006-10-31

Applicant: 제일모직주식회사

Inventor： 김현영 ,  정창범 ,  강정구 ,  최중식

IPC: C08L25/12 ,  C08L33/00 ,  C08J5/18

CPC classification number: H01B1/22 ,  H05K3/323

Abstract: An anisotropic conductive film composition, and an anisotropic conductive film formed from the composition are provided to improve initial adhesive strength, to reduce contact resistance and to prevent the generation of short between circuits, thereby enhancing productivity. An anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-50 wt% of a (meth)acrylate oligomer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Also an anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-80 wt% of at least one of epoxy monomer, oligomer or resin selected from the group consisting of bisphenolic, novolac, glycidyl, aliphatic and alicyclic epoxy compounds; 0.1-15 wt% of a thermal curing agent for epoxy; and 0.01-20 wt% of a conductive particle.

Abstract translation: 提供各向异性导电膜组合物和由该组合物形成的各向异性导电膜以提高初始粘合强度，降低接触电阻并防止电路之间产生短路，从而提高生产率。 各向异性导电膜组合物包含5-50重量％的热塑性树脂; 5-50重量％的苯乙烯 - 丙烯腈共聚物树脂; 1-50重量％的（甲基）丙烯酸酯低聚物; 1-30重量％的（甲基）丙烯酸酯单体; 0.1-15重量％的自由基引发剂; 和0.01-20重量％的导电颗粒。 各向异性导电膜组合物还包含5-50重量％的热塑性树脂; 5-50重量％的苯乙烯 - 丙烯腈共聚物树脂; 1-80重量％的选自双酚，酚醛清漆，缩水甘油基，脂族和脂环族环氧化合物的环氧单体，低聚物或树脂中的至少一种; 0.1-15重量％的环氧树脂热固化剂; 和0.01-20重量％的导电颗粒。

公开(公告)号：KR100787721B1

公开(公告)日：2007-12-24

申请号：KR1020060069718

申请日：2006-07-25

Applicant: 제일모직주식회사

Inventor： 김완중 ,  정창범 ,  홍용우 ,  정기성 ,  정철

IPC: H01L21/48 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L2221/68327

Abstract: A dicing die bond film suitable for processing a thin film wafer is provided to remove a chip flying effect by increasing fixing force to a ring frame. A dicing die bond film includes a supporting base layer, an adhesive layer, and a fixing adhesive layer. The adhesive layer includes a lower adhesive layer(32) and an upper adhesive layer(22). The lower adhesive layer is laminated on the supporting base layer. The upper adhesive layer is laminated on the lower adhesive layer. The peel strength between the lower adhesive layer and the ring frame is 0.007N/mm to 1.000N/mm. The peel strength between the upper adhesive and the fixing adhesive layer is 0.002N/mm to 0.020N/mm after the peel strength. Further, the upper adhesive layer contains 30-90 wt.% of acryl copolymer, 10-70 wt.% of acryl compound and 0.1-10 wt.% of photoinitiator based on 100 wt.% of the upper adhesive layer.

Abstract translation: 提供适于处理薄膜晶片的切割模片接合薄膜，以通过增加对环形框架的固定力来消除芯片飞行效应。 切割芯片接合膜包括支撑基底层，粘合剂层和固定粘合剂层。 粘合剂层包括下部粘合剂层（32）和上部粘合剂层（22）。 下部粘合剂层层压在支撑基底层上。 上粘合剂层层压在下粘合剂层上。 下粘合剂层和环形框架之间的剥离强度为0.007N / mm至1.000N / mm。 剥离强度后，上粘合剂和固定粘合剂层之间的剥离强度为0.002N / mm至0.020N / mm。 此外，上粘合剂层包含基于100重量％的上粘合剂层的30-90重量％的丙烯酸共聚物，10-70重量％的丙烯酸化合物和0.1-10重量％的光引发剂。

公开(公告)号：KR101002488B1

公开(公告)日：2010-12-17

申请号：KR1020080103105

申请日：2008-10-21

Applicant: 제일모직주식회사

Inventor： 최한님 ,  송기태 ,  엄태신 ,  정창범

IPC: C08J5/18 ,  C08L33/14 ,  C08L63/00 ,  C09J133/08

CPC classification number: C09J163/00 ,  C08G59/621 ,  C08L33/08 ,  C08L61/06 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C09J133/08 ,  Y10T428/2848

Abstract: 본 발명은 아크릴계 고분자, 에폭시 수지, 페놀형 경화 수지, 경화 촉매, 실란 커플링제 및 충진제를 포함하고 경화 후 공-연속으로 상 분리되는 반도체 다이 접착제 조성물 및 이로부터 제조된 접착제 필름에 관한 것이다.
본 발명에 따르는 접착 필름은 경화부의 함량이 많더라도 연 구조성과 필름의 인장강도 증가를 동시에 만족시키므로, 필름이 끊어지지 않고 단단하여 반도체 조립시 높은 신뢰성을 확보할 수 있다.
공-연속 상, 가교성 관능기, 반도체 접착 필름, 다이 접착(die attach), 아크릴계 고분자, 페놀형 경화 수지, 경화 촉매, 실란 커플링제

公开(公告)号：KR100963675B1

公开(公告)日：2010-06-15

申请号：KR1020080024027

申请日：2008-03-14

Applicant: 제일모직주식회사

Inventor： 황용하 ,  조재현 ,  송규석 ,  정창범

IPC: H01L21/48 ,  H01L21/52 ,  H01L21/78

CPC classification number: H01L21/6835 ,  C09J7/20 ,  C09J7/35 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3114 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29082 ,  H01L2224/73104 ,  H01L2224/83191 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  Y10T428/2848 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

Abstract: 이면연삭공정, 다이싱 공정, 및 픽업-다이 어태칭 공정을 하나의 테이프에 의해 수행할 수 있다는 장점이 있으며, 특히 점착층과 제2 접착층의 계면에 자외선 경화제를 포함하여 자외선 경화시 점착층과 함께 경화되는 제1 접착층을 둠으로서 점착층의 박리특성을 월등히 향상시킬 수 있는 반도체 패키지용 복합기능 테이프가 제공된다. 본 발명에 따른 반도체 패키지용 복합기능 테이프는 기재필름의 일면에 형성된 자외선 경화형 점착층, 상기 점착층 상에 형성되는 제1 접착층, 및 제2 접착층을 포함한다.
반도체, 패키지, 복합, 이면연삭, 다이싱, 다이본딩, 어태칭, 점착층, 접착층