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公开(公告)号:DE68929356D1
公开(公告)日:2002-01-24
申请号:DE68929356
申请日:1989-06-05
Applicant: CANON KK
Inventor: TERASHIMA SHIGERU , AMEMIYA MITSUAKI , SHIMODA ISAMU , UZAWA SHUNICHI , KARIYA TAKAO
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公开(公告)号:DE69033791D1
公开(公告)日:2001-10-11
申请号:DE69033791
申请日:1990-10-19
Applicant: CANON KK
Inventor: TANAKA YUTAKA , MIZUSAWA NOBUTOSHI , KARIYA TAKAO , UZAWA SHUNICHI , AMEMIYA MITSUAKI
IPC: G21K5/00 , G03F7/20 , H01L21/027
Abstract: An X-ray exposure apparatus, for transferring a pattern of the mask (13) to a wafer (15), includes an X-ray source accommodating chamber (50); a mask chuck (14) for supporting the mask; a wafer chuck (16) for supporting the wafer; a stage (18) for moving the wafer chuck; a stage accommodating chamber (19) for accommodating therein the mask chuck, the wafer chuck and the stage; a barrel (5) for coupling the X-ray source accommodating chamber with the stage accommodating chamber, to define an X-ray projection passageway (30); a blocking window (6) provided in the X-ray projection passageway, for isolating the ambience in the X-ray accommodating chamber and the ambience in the stage accommodating chamber from each other; and a gas supply port (3) contributable to fill the stage accommodating chamber with a gas ambience of low X-ray absorption. The gas supply port opens to the X-ray projection passageway at a position between the blocking window and the mask supported by the mask chuck.
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公开(公告)号:DE69033002T2
公开(公告)日:1999-09-02
申请号:DE69033002
申请日:1990-10-01
Applicant: CANON KK
Inventor: SAKAMOTO EIJI , EBINUMA RYUICHI , AMEMIYA MITSUAKI , UZAWA SHUNICHI , UDA KOJI
IPC: G03F7/20
Abstract: An exposure apparatus includes a chamber (1) for placing the article in a predetermined ambience; holding device (5) for holding the article in the chamber; a fluid supplying device (3) for supplying a temperature adjusting fluid into the holding device through a flow passageway (4); a detecting device (2) for detecting leakage of the fluid from the flow passageway; and a flow rate controlling device (9) for controlling the flow rate of the fluid to be supplied to the holding device on the basis of detection by the detecting device.
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公开(公告)号:DE69032988T2
公开(公告)日:1999-08-19
申请号:DE69032988
申请日:1990-08-29
Applicant: CANON KK
Inventor: KUROSAWA HIROSHI , UDA KOJI , OZAWA KUNITAKA , UZAWA SHUNICHI , EBINUMA RYUICHI , KARIYA TAKAO
IPC: G03F9/00 , H01L21/027 , H01L21/30 , H01L21/68 , H01L21/00
Abstract: An alignment system usable in an exposure apparatus for printing a pattern of a mask on a wafer, for aligning the mask and the wafer, is disclosed. The system includes a plurality of position detecting devices; a plurality of driving stages corresponding to the position detecting devices, respectively, each driving stage being adapted to move corresponding one of the position detecting devices two-dimensionally along a plane which is substantially opposed to the mask; a plurality of contacts corresponding to the position detecting devices, respectively, each contact being provided at an end portion of corresponding one of the position detecting devices, along the plane and facing to the pattern side; a detecting device for detecting mutual approach of the position detecting devices through at least one of contacts; and a control device for controlling movement of at least one of the driving stages in accordance with the detection by the detecting device.
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公开(公告)号:DE69128655T2
公开(公告)日:1998-05-07
申请号:DE69128655
申请日:1991-02-28
Applicant: CANON KK
Inventor: EBINUMA RYUICHI , MIZUSAWA NOBUTOSHI , KARIYA TAKAO , SUDA SHIGEYUKI , UZAWA SHUNICHI , HASEGAWA TAKAYUKI
Abstract: An exposure apparatus for transferring a pattern of an original (1) onto a workpiece (2) by using first light, includes a blocking member (4) for defining a rectangular exposure region on the workpiece. The blocking member (4) has a function for blocking the first light, wherein, through the exposure region defined by the blocking member (4), exposure for the pattern transfer can be effected. A detecting device (6) detects a positional deviation between the original (1) and the workpiece (2), by using second light different from the first light, wherein the blocking member (4) has a portion for transmitting the second light such that the detecting device (6) can detect the positional deviation with the second light passed through that portion of the blocking member.
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公开(公告)号:DE69126719T2
公开(公告)日:1997-11-06
申请号:DE69126719
申请日:1991-03-08
Applicant: CANON KK
Inventor: MIZUSAWA NOBUTOSHI , EBINUMA RYUICHI C O CANON KABU , KUROSAWA HIROSHI , UDA KOJI , KARIYA TAKAO , UZAWA SHUNICHI
IPC: G03F7/20
Abstract: An exposure method for manufacture of semiconductor devices, includes moving a shutter having an edge so that the edge is related to a predetermined exposure region; projecting an exposure beam to the edge of the shutter and to at least a portion of the exposure region; determining a position of a shadow of the edge of the shutter formed by the exposure beam with respect to a predetermined coordinate system related to movement of a movable chuck; adjusting the shutter in accordance with the determination; placing a substrate on the chuck; moving the chuck so that the substrate is related to the exposure region; and controlling the exposure of the substrate with the exposure beam through the shutter.
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公开(公告)号:DE69030348D1
公开(公告)日:1997-05-07
申请号:DE69030348
申请日:1990-10-03
Applicant: CANON KK
Inventor: WATANABE YUTAKA , EBINUMA RYUICHI , MIZUSAWA NOBUTOSHI , UZAWA SHUNICHI , KARIYA TAKAO
IPC: G03F7/20
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公开(公告)号:DE68927364T2
公开(公告)日:1997-03-06
申请号:DE68927364
申请日:1989-08-31
Applicant: CANON KK
Inventor: SAKAMOTO EIJI , HARA SHINICHI , SHIMODA ISAMU , UZAWA SHUNICHI
IPC: G03F7/20 , H01L21/027 , H01L21/30 , H01L21/683 , H01L21/00
Abstract: A wafer chuck (2) usable with a semiconductor exposure apparatus (Fig.2A) wherein a mask and a semiconductor wafer (1) are placed in a vacuum ambience or a pressure-reduced gas ambience, and wherein the wafer (1) is exposed through the mask to radiation energy such as X-rays contained in a synchrotron radiation beam, by which the pattern of the mask is transferred onto the wafer (1). The wafer (1) is first attracted on the wafer supporting surface of the chuck (2) by vacuum attraction (21), and thereafter, the wafer (1) is attracted by electrostatic attraction force. Thereafter, the vacuum attraction is broken by supplying (24) a gas. Preferably Helium or other thermally conductive gas is admitted at this point. When the pattern of the mask is transferred onto the wafer (1), the wafer (1) is retained on the wafer supporting surface (20) by the electrostatic attraction force only. By this, the wafer supporting apparatus can correctly contact the wafer supporting surface (20) to the wafer (1) without being influenced by the undulation of the wafer (1). In addition, the heat produced in the wafer (1) during exposure can be removed efficiently by temperature controlled (23) water (11) supplied to the wafer supporting apparatus (2).
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公开(公告)号:DE68927146D1
公开(公告)日:1996-10-17
申请号:DE68927146
申请日:1989-09-29
Applicant: CANON KK
Inventor: MATSUI SHIN , KARIYA TAKAO , MIZUSAWA NOBUTOSHI , EBINUMA RYUICHI , UZAWA SHUNICHI
IPC: G03F7/20 , H01L21/677 , H01L21/68
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公开(公告)号:DE69121747D1
公开(公告)日:1996-10-10
申请号:DE69121747
申请日:1991-03-18
Applicant: CANON KK
Inventor: MARUMO MITSUJI , IWAMOTO KAZUNORI , MIZUSAWA NOBUTOSHI , KARIYA TAKAO , UZAWA SHUNICHI
IPC: H01L21/673 , G03F7/20 , H01L21/027 , H01L21/677 , H01L21/683 , H01L21/687 , H05K13/00 , H01L21/00
Abstract: A device for holding a substrate includes a holding system for holding a substrate by attraction and a guard system for preventing drop of the substrate held by the holding system, the guard system being out of contact with the substrate as the same is held by the holding system.
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