Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group
    59.
    发明公开
    Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group 审中-公开
    一种用于制备的基团,其保留至少两个元件,它保留一个护套的微一体化结构,从而获得组过程

    公开(公告)号:EP1122720A1

    公开(公告)日:2001-08-08

    申请号:EP00830075.8

    申请日:2000-02-02

    CPC classification number: G11B5/5552

    Abstract: The manufacture process comprises: forming a first wafer (20) of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit (22); forming microactuators (10), each comprising a rotor (52) and a stator (51), in a surface portion of a second wafer (28) of semiconductor material; attaching the second wafer (28) to the first wafer (20), with the surface portion of the second wafer facing the first wafer; thinning the second wafer (28); attaching the second wafer (28) to a third wafer (75) to obtain a composite wafer (78); thinning the first wafer (20); cutting the composite wafer (78) into a plurality of dice (77) connected to a protection chip (75'); removing the protection chip (75'); attaching read/write transducers (6) to the dice (77); and attaching the dice to supporting blocks (3) for hard-disk drivers (1).

    Abstract translation: 制造方法包括:在形成微致动器控制电路和信号前置放大电路(22),半导体材料壳体集成电子部件的第一晶片(20); 微致动器形成(10),每个包括一个转子(52)和在所述半导体材料的第二晶片(28)的表面部分的定子(51); 附着在第二晶片(28)到所述第一晶片(20)具有面向所述第一晶片的第二晶片的表面部分; 减薄所述第二晶片(28); 第二晶片(28)附接至第三晶片(75),以获得复合晶片(78); 减薄第一晶片(20); 切割所述复合晶片(78)插入连接到一个保护芯片(75“)的骰子的多个(77); 去除保护芯片(75“); 附接的读/写换能器(6)连接到骰子(77); 和骰子附着到用于硬盘驱动器支撑块(3)(1)。

    High-performance integrated microactuator, particularly for a hard disc read/write transducer
    60.
    发明公开
    High-performance integrated microactuator, particularly for a hard disc read/write transducer 有权
    特别适用于硬盘驱动器的读/写头集成了高性能微型驱动器

    公开(公告)号:EP0991175A1

    公开(公告)日:2000-04-05

    申请号:EP98830573.6

    申请日:1998-09-30

    Inventor: Vigna, Benedetto

    CPC classification number: H02N1/006 G11B5/5569

    Abstract: The microactuator (9') comprises a stator element (17') and a rotor element (11') which are capacitively coupled. The rotor element (11') comprises a suspended mass (12) and a plurality of movable drive arms (13') extending radially from the suspended mass (12) and biased at a reference potential. The stator element (17') comprises a plurality of first and second fixed drive arms (18a', 18b') associated with respective movable drive arms (13') and biased at a first drive potential. A mechanical damping structure (32) is formed by at least one movable damping arm (13'') extending radially from the suspended mass (12) and by at least one first and one second fixed damping arm (18a'', 18b'') associated with the movable damping arm (13'') and biased at said reference potential, to dampen settling oscillations of the rotor element (11').

    Abstract translation: 微致动器(9“)包括一个定子元件(17”),并且电容耦合的转子元件(11“)。 转子元件(11“)包括一个悬挂质量(12)和可移动的驱动臂(13的多元性”)处于基准电位从悬挂物体(12)和偏置径向延伸。 定子元件(17“)包括第一和第二固定驱动臂(18a的多元性”“(和偏置在第一驱动电位respectivement可移动的驱动臂13)相关联,18b)的”。 一种机械阻尼结构(32)通过至少一个可移动减震臂(13“”)形成为从所述悬挂质量(12)径向延伸,并通过至少一个第一和一个第二固定阻尼臂(18A',18B“” )与可移动减震臂(13“”相关联)和偏置在所述基准电势,以抑制沉降转子元件(11的振荡“)。

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