Abstract:
A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.
Abstract:
A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.
Abstract:
A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
Abstract:
An apparatus and a method for recognizing the module of an image display device are provided to have no need to compose each main PCB(Printed Circuit Board) by module manufacturer and use the main PCB of modules manufactured by different manufacturers in common, thereby saving management expenses and improving user's satisfaction in resource management because a user manages only one main board in common. An apparatus for recognizing the module of an image display device includes first and second display modules(100,200) and a main board(300). The first and second display modules have different driving power. The main board determines whether any module of the first and second display modules is connected and supplies selectively driving power suitable for a corresponding module. The main board includes a connection unit(101,201,311,312), an SMPS(Switching Mode Power Supply)(310), a voltage detection unit(340), and a microcomputer(320). The connection unit has first and second connection terminals for connecting separately the first and second display modules. The SMPS supplies different driving power to the first display module or the second display module. The voltage detection unit outputs different voltage values according to a connection status between the first and second display modules and the connection unit. The microcomputer determines whether anyone of the first and second display modules is connected according to a voltage outputted from the voltage detection unit and outputs a control signal to the SMPS to supply proper power for driving a corresponding display module according to the determination result.