Abstract:
A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a step of forming laminated meshy sheets, by squashing the meshy cylindrical body in the radial direction, a step of inserting an insulation sheet between the meshy sheets, and a step of forming lacking portions at a position in the peripheral direction of conductive rings of the meshy sheets. It becomes possible to directly join a semiconductor chip to the conductive ring of the meshy sheet, and therefore, a wiring circuit can be obtained without using a solder joint.
Abstract:
A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.
Abstract:
A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a step of forming laminated meshy sheets, by squashing the meshy cylindrical body in the radial direction, a step of inserting an insulation sheet between the meshy sheets, and a step of forming lacking portions at a position in the peripheral direction of conductive rings of the meshy sheets. It becomes possible to directly join a semiconductor chip to the conductive ring of the meshy sheet, and therefore, a wiring circuit can be obtained without using a solder joint.
Abstract:
An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; and a plurality of conductive elements embedded in the dielectric matrix.
Abstract:
The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable on non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.
Abstract:
Apparatus and method for assembling solder balls in a selected one of several different patterns for delivery to connector pads on an integrated circuit package, or other receiver, includes a universal template containing holes at locations in an aggregate pattern of all hole locations for the several different patterns, and includes a subtemplate for each individual different pattern that contains posts at locations for insertion from the rear of the template into holes therein at locations where no surface recess is desired. The universal template may remain aligned with an assembly jig or holder of packages while only the subtemplate is changed to change the surface pattern of holes into which solder balls may then be distributed.
Abstract:
A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.
Abstract:
The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is then formed over the one or both surfaces of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalized pattern of bonding pads may also be formed on the surfaces of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearby via.
Abstract:
A multilayer thin-film wiring board formed by laminating at least three wiring layers including first, second, and third wiring layers together with a dielectric layer. The first wiring layer includes a first pattern having a plurality of first windows arranged with the same pitch both in a lateral direction and in a longitudinal direction of the wiring board, and a plurality of first island patterns each located at a substantially central portion of each first window. Similarly, the second wiring layer includes a second pattern having a plurality of second windows, and a plurality of second island patterns each located at a substantially central portion of each second window. The second windows are shifted from the first windows by half the pitch both in the lateral direction and in the longitudinal direction. The third wiring layer includes first and second via pads formed on a surface of the wiring board. The first via pad, the first pattern, and at least one of the second island patterns are connected together by a first via. The second via pad, the second pattern, and at least one of the first island patterns are connected together by a second via.
Abstract:
A method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, uses displaced application of etching windows on opposite sides and corresponding pronounced under-etching of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, `oblique` passages are obtained through the substrate. By a suitable location of the windows it is also possible to produce branched passages with more than one outlet opening.