61.
    发明专利
    未知

    公开(公告)号:DE69115756T2

    公开(公告)日:1996-05-15

    申请号:DE69115756

    申请日:1991-05-17

    Applicant: CANON KK

    Abstract: An X-ray exposure apparatus using radiation light as exposure light is disclosed, wherein the apparatus includes: a display device; a detecting device for detecting in each exposure the amount of exposure as absorbed by a mask during the exposure; a memory for memorizing an accumulated dose of the mask; and a controller for causing the display device to display a dose of the mask, wherein the does to be displayed corresponds to the sum of the accumulated dose as memorized in the memory and the amount of exposure as detected by the detecting device. Also disclosed is a mask structure suitably usable in such an exposure apparatus.

    63.
    发明专利
    未知

    公开(公告)号:DE69023186T2

    公开(公告)日:1996-03-28

    申请号:DE69023186

    申请日:1990-08-06

    Applicant: CANON KK

    Abstract: An exposure apparatus for printing a pattern of a mask (2) onto a wafer (3) includes a mask moving mechanism (4) for moving the mask; a wafer moving mechanism (10,11) for moving the wafer along a predetermined movement coordinate; a measuring system for measuring an error with respect to the movement coordinate, resulting from the movement of the mask by the mask moving mechanism; and a memorizing device for memorizing a data table prepared on the basis of the error measured by the measuring system; wherein the wafer moving mechanism uses the data in the data table when it moves the wafer for positioning of the wafer with respect to the mask.

    65.
    发明专利
    未知

    公开(公告)号:DE69110698D1

    公开(公告)日:1995-08-03

    申请号:DE69110698

    申请日:1991-02-08

    Applicant: CANON KK

    Abstract: A gate valve device including a partition wall (41) having an opening (13); a valve member (14) movable along the partition wall to openably close the opening; a driving system means for moving the valve member (14); and a pressing mechanism (26) for pressing the valve member toward the partition wall, the pressing mechanism having a pressing member (33) projectable toward and retractable from the valve member, wherein the pressing mechanism presses the valve member against the partition wall when the valve member is in a position closing the opening.

    67.
    发明专利
    未知

    公开(公告)号:DE68915239D1

    公开(公告)日:1994-06-16

    申请号:DE68915239

    申请日:1989-10-04

    Applicant: CANON KK

    Abstract: An X-ray exposure system, for exposing a semiconductor wafer to a mask with X-rays contained in synchrotron radiation, is disclosed. In this system, the mask (1) and the wafer (46) are held on a main frame (4) so that their surfaces extend substantially in parallel to a vertical axis. The main frame suspends from a supporting frame (10) through a plurality of air mounts (7) each being displaceable vertically. The supporting frame is placed on the same reference surface as of a SOR ring (17) that produces synchrotron radiation (20). By using these air mounts, any tilt of the mask and the wafer relative to the irradiation region of the synchrotron radiation as well as the position of the mask and the wafer in the vertical direction, with respect to the irradiation region, can be controlled and maintained constant. Thus, accurate pattern printing is ensured.

    PHOTOELECTRIC CONVERTER WITH REDUCED CROSSTACK

    公开(公告)号:GB2139038B

    公开(公告)日:1987-05-13

    申请号:GB8404878

    申请日:1984-02-24

    Applicant: CANON KK

    Abstract: An elongated photoelectric converter unit having a good S/N characteristic but no crosstalk without using any blocking diode. The photoelectric converter comprising: a signal amplifying device having m photosensor groups each consisting of n photosensor elements and n signal amplifying elements connected to the photosensor elements in each group; first and second sample and hold device each having n sample and hold elements connected to the signal amplifying elements; first and second input signal selecting device connected to those first and second sample and hold device, respectively, each of the first and second input signal selecting device having n input signal selecting elements provided corresponding to the respective sample and hold elements of each sample and hold device; and an amplifying device for amplifying the difference between the values of the signals to be transferred from the respective first and second input signal selecting device as a signal and outputting.

    69.
    发明专利
    未知

    公开(公告)号:DE3112209A1

    公开(公告)日:1982-01-28

    申请号:DE3112209

    申请日:1981-03-27

    Applicant: CANON KK

    Abstract: A photoelectric transducing element comprising (a) a substrate; (b) first electrode provided on said substrate; (c) first contact layer to form an ohmic contact with said first electrode with respect to electric charge in at least one polarity; (d) a photoconductive layer provided in contact with said first contact layer and composed of an amorphous material containing silicon atom as a matrix and hydrogen atom, or halogen atom, or both, at a ratio of 1 to 30 atomic % with respect to said silicon atom; (e) second contact layer provided in contact with said photoconductive layer; and (f) second electrode to form an ohmic contact with said second contact layer with respect to said charge.

    70.
    发明专利
    未知

    公开(公告)号:DE68929187D1

    公开(公告)日:2000-04-27

    申请号:DE68929187

    申请日:1989-08-31

    Applicant: CANON KK

    Abstract: An exposure apparatus usable with synchrotron radiation source (201) wherein the synchrotron radiation (202,204) is generated by electron injection (210) into a ring (201). The exposure apparatus is to transfer a semiconductor element pattern of a mask (208) onto a semiconductor wafer (209) by the synchrotron radiation. The apparatus includes a shutter (207) for controlling the exposure of the wafer (209). The shutter (207) controls the exposure with the illuminance distribution on the wafer surface taken into account. The illuminance distribution is determined (206,211,216) in response to the electron injection (210), and thereafter, the illuminance distribution is corrected (216,215,213,207) in a predetermined manner. By this, the illuminance distribution data for controlling (213,215) the shutter (207) always correspond to the actual illuminance distribution. The entire shot areas of the semiconductor wafer (209) are exposed with high precision.

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