PROCEDE DE FORMATION D'UNE PORTION MONOCRISTALLINE A BASE DE SILICIUM

    公开(公告)号:FR2900275A1

    公开(公告)日:2007-10-26

    申请号:FR0603454

    申请日:2006-04-19

    Abstract: Une portion monocristalline (1) à base de silicium est réalisée sur un substrat (100), sélectivement dans une zone (101) où un matériau monocristallin est initialement découvert. La portion est réalisée en dehors de zones où la surface (S) du substrat est en matériau isolant (102). La portion monocristalline est formée à partir d'un mélange gazeux comprenant un précurseur de silicium du type hydrure non-chloré, du chlorure d'hydrogène et un gaz porteur. Le procédé permet de réduire une température de chauffage du substrat nécessaire pour former la portion monocristalline par croissance épitaxiale sélective.

    64.
    发明专利
    未知

    公开(公告)号:FR2779572B1

    公开(公告)日:2003-10-17

    申请号:FR9807059

    申请日:1998-06-05

    Abstract: A vertical bipolar transistor production process comprises epitaxy of a single crystal silicon emitter region in direct contact with the upper layer of a silicon germanium heterojunction base. Production of a vertical bipolar transistor comprises (a) forming an intrinsic collector (4) on an extrinsic collector layer buried in a semiconductor substrate (1); (b) forming a lateral insulation region (5) around the upper part of the intrinsic collector and an offset extrinsic collector well (60); (c) forming an silicon germanium heterojunction base above the intrinsic collector (4) and the lateral insulation region (5) by non-selective epitaxy of a multilayer (8) including a silicon germanium layer; and (e) forming an in-situ doped emitter by epitaxy on a window of the surface of the multilayer located above the intrinsic collector to obtain, above the window, a single crystal silicon emitter region in direct contact with the upper layer of the multilayer (8). An Independent claim is also included for a vertical bipolar transistor produced by the above process.

    68.
    发明专利
    未知

    公开(公告)号:FR2802705B1

    公开(公告)日:2002-08-09

    申请号:FR9915902

    申请日:1999-12-16

    Abstract: The process for fabricating a network of nanometric lines made of single-crystal silicon on an isolating substrate includes the production of a substrate comprising a silicon body having a lateral isolation defining a central part in the body. A recess is formed in the central part having a bottom wall made of dielectric material, a first pair of opposed parallel sidewalls made of dielectric material, and a second pair of opposed parallel sidewalls. At least one of the opposed parallel sidewalls of the second pair being formed from single-crystal silicon. The method further includes the epitaxial growth in the recess, from the sidewall made of single-crystal silicon of the recess, of an alternating network of parallel lines made of single-crystal SiGe alloy and of single-crystal silicon. Also, the lines made of single-crystal SiGe alloy are etched to form in the recess a network of parallel lines made of single-crystal silicon insulated from each other.

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