PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    63.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20160381796A1

    公开(公告)日:2016-12-29

    申请号:US15096993

    申请日:2016-04-12

    Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

    Abstract translation: 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层,嵌入绝缘层中的电路层,设置在绝缘层的一个表面上的阻焊层,阻焊层具有通孔形状的空腔,以暴露部分 电路层,以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱,金属柱包括第一后​​金属层,后阻挡层和第二柱 金属层。

    Layered metal structure for interconnect element
    65.
    发明授权
    Layered metal structure for interconnect element 有权
    用于互连元件的分层金属结构

    公开(公告)号:US07696439B2

    公开(公告)日:2010-04-13

    申请号:US11801336

    申请日:2007-05-09

    Applicant: David Light

    Inventor: David Light

    Abstract: A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

    Abstract translation: 根据本发明的一个方面提供了层状金属结构。 该结构可以用于例如制造导电互连一个或多个微电子元件的导电互连元件。 层状结构包括例如可以包括铜或铝中的一种或多种的第一和第二金属层。 中间层可以包括例如在第一和第二金属层之间的铬,铬耐腐蚀剂可以选择性地将第一和第二金属层图案化成中间层。 在这种情况下,可以使用诸如氯化铜,氯化铁(FeCl 3),过氧化硫组合物或过硫酸盐组合物的蚀刻剂来图案化第一和第二金属层。

    METHOD FOR FABRICATING A PACKAGING SUBSTRATE
    66.
    发明申请
    METHOD FOR FABRICATING A PACKAGING SUBSTRATE 有权
    制造包装基材的方法

    公开(公告)号:US20090294401A1

    公开(公告)日:2009-12-03

    申请号:US12129689

    申请日:2008-05-30

    Applicant: Chang-Fu Chen

    Inventor: Chang-Fu Chen

    Abstract: A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion.

    Abstract translation: 公开了一种制造封装衬底的方法。 提供由第一金属箔,第二金属箔和介于第一和第二金属箔之间的蚀刻停止层构成的覆层片。 然后将第一金属箔图案化成第一电路迹线。 绝缘层被层压到第一电路迹线上。 此后,将第二金属箔图案化成多个凸块焊盘。 剥离不被凸块焊接的蚀刻停止层被剥离。 施加焊接掩模以填充凸块之间的间隔。 每个凸块焊盘的顶表面被蚀刻以自对准的方式形成接合孔。

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