公开(公告)号：EP1876695A1

公开(公告)日：2008-01-09

申请号：EP06014158.7

申请日：2006-07-07

Applicant: Tinyplug Technology (Shenzhen) Limited

Inventor： Zhenghong, Zhou

IPC: H02M3/335

CPC classification number: H01R13/6675 ,  H01F27/04 ,  H01F27/323 ,  H01F27/367 ,  H01F27/38 ,  H01F27/40 ,  H02M3/33523 ,  H05K1/0256 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/0191 ,  H05K2203/1572

Abstract: A plugtype power supply unit includes an enclosure (100), a plug portion (150) secured thereto, and a low-voltage cord (200) extending from said enclosure. Each cross-sectional configuration of said enclosure with said plug portion corresponds to and does not exceed the cross-sectional configuration of a plug face of a European type plug according to the EN 50075 standard. A switch mode power supply circuit mounted on a PCB (300) is built into said enclosure, said switch mode power supply circuit includes a transformer (T1) for power converting and a capacitor (C1) for regulating an input voltage, a central axis of said capacitor is disposed parallel to the direction of said PCB (300).

Abstract translation: 插电式电源单元包括外壳（100），固定到其上的插头部分（150）和从所述外壳延伸的低压电缆（200）。 具有所述插头部分的所述外壳的每个横截面构造对应于并且不超过根据EN 50075标准的欧式插头的插头面的横截面构造。 安装在PCB（300）上的开关模式电源电路内置在所述外壳中，所述开关模式电源电路包括用于功率转换的变压器（T1）和用于调节输入电压的电容器（C1），用于调节输入电压的中心轴 所述电容器平行于所述PCB（300）的方向设置。

公开(公告)号：EP1860928A2

公开(公告)日：2007-11-28

申请号：EP07010364.3

申请日：2007-05-24

Applicant: Funai Electric Co., Ltd.

Inventor： Fukumoto, Yasuyuki

IPC: H05K7/12

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract translation: 电子部件保持器包括保持器主体和电线保持部。 保持器本体包括形成在保持器主体的顶面中的多个第一槽和形成在保持器主体的后表面中的多个第二槽。 第一凹槽和第二凹槽构造成接收电子部件的引线。 引线被配置为弯曲以设置在第二凹槽中的一个中。 背面与顶面相交。 电线保持部设置在保持体上。 电线保持部分构造成接合引线以将引线保持在第二槽中。

公开(公告)号：EP1458226A3

公开(公告)日：2006-06-28

申请号：EP04250498.5

申请日：2004-01-29

Applicant: Fujitsu Hitachi Plasma Display Limited

Inventor： Koizumi, Haruo, Fujitsu Hitachi P. D. Ltd. ,  Onozawa, Makoto, Fujitsu Hitachi P. D. Ltd.

IPC: H05K1/18 ,  H05K1/16 ,  H01F27/02 ,  H01F17/00

CPC classification number: H05K1/18 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/22 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/165 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board assembly (10) has a flat coil element (13) mounted on a circuit board (11) so that an electric power loss is not generated even when the flat coil element (13) is mounted to the circuit board (11) together with a circuit part (15) having a large heat sink (16). A module mounted (11) on the circuit board has an electronic circuit device (15) and a heat radiator (16) attached to the electronic circuit device (15). The heat radiator (16) has an extending part (16a) protruding from the electronic circuit device (15) and extending parallel to a surface of the circuit board (11). A coil mounting area provided with no pattern wire is formed in a part of the circuit board (11) facing the extending part (16a). The flat coil element (13) is mounted parallel to the circuit board (11) in a state where a coil part of the flat coil element (13) faces the coil mounting area.

公开(公告)号：EP0924764A2

公开(公告)日：1999-06-23

申请号：EP98121912.4

申请日：1998-11-18

Applicant: Hitachi, Ltd. ,  Hitachi ULSI Systems Co.,Ltd.

Inventor： Azuma, Shuichiro ,  Okinaga, Takayuki ,  Emata, Takashi ,  Kudaishi, Tomoaki ,  Wada, Tamaki ,  Nishi, Kunihiko ,  Masuda, Masachika ,  Sugano, Toshio

IPC: H01L25/065 ,  H01L23/495

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起来实现大容量存储器的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的封装树脂和布置在两个相对的短边上的一对支撑引线组成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：EP0331436A3

公开(公告)日：1991-05-08

申请号：EP89301985.1

申请日：1989-02-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Sugawara, Mitsuru ,  Yoshinaga, Akitoshi ,  Shimizu, Fumihiko ,  Takami, Masayuki

IPC: G02B6/42 ,  H01L33/00 ,  H05K3/32

CPC classification number: H01S5/026 ,  G02B6/42 ,  G02B6/4246 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/10287 ,  H05K2201/10462

Abstract: An optical communication apparatus which comprises a printed circuit board (12), plural circuit elements (20, 21) fixed to the printed circuit board, the circuit elements having terminals (11a, 11b) extended to the printed circuit board, a photosensitive glass base (71) fixed to the printed circuit board, various optical components (1, 2) accurately fixed to the glass base, the optical elements respectively having plural leads (8a, 8b), and corresponding conductive members (10) for electrically connecting the terminals of the circuit elements (11a, 11b) and the corresponding leads of the optical components, the conductive members each having a rigidity smaller than the rigidity of the corresponding leads of the optical components.

公开(公告)号：KR1020140045030A

公开(公告)日：2014-04-16

申请号：KR1020120111056

申请日：2012-10-08

Applicant: 한국전자통신연구원

Inventor： 강세경 ,  이준기 ,  허준영

IPC: H01L31/12 ,  H05K1/14 ,  H01R12/61

CPC classification number: H04B10/40 ,  G02B6/4281 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/189 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: Disclosed are a flexible printed circuit board and an optical communication module including the same. The flexible printed circuit board includes a base substrate that is flexible; at least one signal pad part including upper and lower signal pads formed at top and bottom surfaces of the base substrate, respectively, and connected to each other through a signal via, and having a through hole formed in a region of the at least signal pad part corresponding to the signal via; a signal line formed on the top surface of the base substrate while extending in a longitudinal direction of the base substrate from the upper signal pad; an upper ground pattern formed on the top surface of the base substrate and spaced apart from the upper signal pad and the signal line around the upper signal pad; and a lower ground pad formed on the bottom surface of the base substrate, connected to the upper ground pad through a ground via, and spaced apart from the lower signal pad around the lower signal pad.

Abstract translation: 公开了一种柔性印刷电路板和包括该印刷电路板的光通信模块。 柔性印刷电路板包括柔性的基底; 至少一个信号焊盘部分，分别包括形成在基板的顶表面和底表面处的上和下信号焊盘，并且通过信号通孔彼此连接，并且具有形成在至少信号焊盘的区域中的通孔 对应于信号通道的部分; 信号线，形成在所述基底基板的上表面上，同时沿所述基底基板的长度方向从所述上部信号焊盘延伸; 形成在基底基板的顶表面上并与上信号焊盘和围绕上信号焊盘的信号线隔开的上接地图; 以及形成在基底基板的底表面上的下接地焊盘，通过接地通孔连接到上接地焊盘，并且与下信号焊盘周围的下信号焊盘间隔开。

公开(公告)号：KR101365956B1

公开(公告)日：2014-02-21

申请号：KR1020107006199

申请日：2008-08-22

Applicant: 시티에스 코포레이션

Inventor： 맥락켄제프리

IPC: H03B5/04 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: 오븐 발진기 패키지는 적어도 회로 기판의 대향 측면들 상에 장착된 히터 및 결정 패키지를 포함한다. 비아가 히터로부터 결정 패키지로 열을 전달하기 위해 회로 기판의 본체를 통해 연장된다. 열 전도성 재료의 층이 회로 기판의 본체를 통해 연장되고, 회로 기판 및 그 상부에 장착된 다른 요소 전체에 걸쳐 열을 확산시키기 위해 비아와 열 결합 관계에 있다.

公开(公告)号：EP1860928B1

公开(公告)日：2011-01-26

申请号：EP07010364.3

申请日：2007-05-24

Applicant: Funai Electric Co., Ltd.

Inventor： Fukumoto, Yasuyuki

IPC: H05K7/12

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

公开(公告)号：EP1860928A3

公开(公告)日：2009-12-02

申请号：EP07010364.3

申请日：2007-05-24

Applicant: Funai Electric Co., Ltd.

Inventor： Fukumoto, Yasuyuki

IPC: H05K7/12

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

公开(公告)号：EP1996000A2

公开(公告)日：2008-11-26

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

Abstract translation: 一种支架安装装置（10/50/80）包括用于板外安装有铅或表面安装部件（18,20 / 58-62 / 92-96）的绝缘载体（12/52/82） 特别是大的温度敏感分立元件，如电容器。 载体（12/52/82）具有相对于电路板（14）升高的部件安装表面，并且相对于电路板（14）定位，使得电路板面积在 载体（12/52/82）可用于放置较小的非温度敏感组件。 车外部件（18,20 / 58-62 / 92-96）安装在载体（12/52/82）的部件安装表面上，并且载体（82）可以包括支撑特征（102） 用于为部件（92-96）提供额外的机械支撑。 用于将升高的部件（18,20 / 58-62 / 92-96）电连接到电路板（14）的电引线（16/56/88）可以嵌入成型在载体（12/52）中，或 可插入载体（82）中的电镀通孔（110）中。