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71.发明公开
公开(公告)号：EP1620352A2
公开(公告)日：2006-02-01
申请号：EP04750192.9
申请日：2004-04-16
Applicant: MEDTRONIC, INC.
Inventor： RECEVEUR, Rogier , HABETS, Philippe , DANZL, Ralph, B. , HOUBEN, Richard, P. M. , MATTES, Michael, F.
CPC classification number: H01H59/0009 , B81B3/0054 , B81B2201/018 , B81B2203/051 , H01H2001/0042 , H01H2001/0078 , Y10T29/49105
Abstract: A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a receiving terminal is formed on a substrate. The moveable member and the receiving terminal each include an insulating layer proximate to the substrate and a conducting layer proximate to the insulating layer opposite the substrate. In various embodiments, the conducting layers of the moveable member and/or receiving terminal include a protruding region that extends outward from the substrate to switchably couple the conducting layers of the moveable member and the receiving terminal to thereby form a switch. The switch may be actuated using, for example, electrostatic energy.
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公开(公告)号：EP1601821A1
公开(公告)日：2005-12-07
申请号：EP04718225.8
申请日：2004-03-08
Applicant: Micro Relay Holdings Pty Ltd
Inventor： SEXTON, Brett,CSIRO , DAVIS, Thimothy J.,CSIRO
IPC: C25D5/12
CPC classification number: B81C1/00666 , B81B2201/018 , B81B2203/0118 , B81C2201/0167 , C25D5/12 , H01H2059/0081 , H05K3/4092 , H05K2201/0311 , H05K2201/0338 , H05K2201/0397 , H05K2203/0726
Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.
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73.发明公开
公开(公告)号：EP1156499A1
公开(公告)日：2001-11-21
申请号：EP01420110.7
申请日：2001-05-15
Applicant: Memscap , Planhead-Silmag Phs
Inventor： Charrier, Catherine , Bouchon, Eric , Campo, Alain , Imbert, Guy , Valentin, François , Basteres, Laurent
CPC classification number: B81C1/00158 , B81B3/007 , B81B2201/018 , B81B2203/0127 , B81B2203/0307 , B81B2203/033 , B81C2201/0109 , B81C2201/0197 , H01G5/16 , H01H1/0036
Abstract: Procédé de fabrication de microcomposants électroniques, du type capacité variable ou microswitch, comprenant une armature fixe (1) et une membrane (20) déformable situées en regard l'une de l'autre, caractérisé en ce qu'il comporte les étapes suivantes, consistant :
◆ à déposer une première couche métallique sur une couche d'oxyde (2), ladite première couche métallique étant destinée à former l'armature fixe ;
◆ à déposer un ruban métallique (10, 11) sur au moins une partie de la périphérie et de part et d'autre de l'armature fixe (1), ledit ruban étant destiné à servir d'espaceur entre l'armature fixe (1) et la membrane déformable (20) ;
◆ à déposer une couche de résine sacrificielle (15) sur au moins la superficie de ladite armature fixe (1) ;
◆ à générer par lithographie une pluralité de caissons, sur la surface de ladite couche de résine sacrificielle ;
◆ à déposer par électrolyse, à l'intérieur des caissons formés sur la résine sacrificielle (15), au moins une zone métallique destinée à former la membrane déformable (20), cette zone métallique s'étendant entre des sections du ruban métallique (10, 11) situées de part et d'autre de ladite armature fixe (1) ;
◆ à éliminer la couche de résine sacrificielle (15).-
公开(公告)号：EP2902358B1
公开(公告)日：2018-09-26
申请号：EP15153380.9
申请日：2015-01-30
Applicant: STMicroelectronics S.r.l.
Inventor： Carminati, Roberto , Conti, Sebastiano
CPC classification number: B81B3/0062 , B81B3/0043 , B81B7/008 , B81B2201/018 , B81B2201/033 , B81B2201/042 , B81B2201/045 , B81B2203/058 , G02B26/0841 , G03B21/142 , G03B21/2033 , G03B21/28
Abstract: The MEMS device has a suspended mass (31) supported via a pair of articulation arms (32) by a supporting region (33). An electrostatic driving system (36), coupled to the articulation arms (32), has mobile electrodes (38) and fixed electrodes (39) that are coupled to each other. The electrostatic driving system is formed by two pairs of actuation assemblies (36), arranged on opposite sides of a respective articulation arm (32) and connected to the articulation arm through connection elements (30). Each actuation assembly (36) extends laterally to the suspended mass (31) and has an auxiliary arm (37) carrying a respective plurality of mobile electrodes (38). Each auxiliary arm is parallel to the articulation arms (32). The connection elements (30) may be rigid or formed by linkages.
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公开(公告)号：EP2739562B1
公开(公告)日：2017-12-20
申请号：EP12746449.3
申请日：2012-08-03
Applicant: Cavendish Kinetics, Inc.
Inventor： TROY, Brian I. , RENAULT, Mickael , MAGUIRE, Thomas L. , LACEY, Joseph Damian Gordon , BOBEY, James F.
CPC classification number: B81C1/00484 , B81B3/0008 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81C2201/0108 , H01H1/0036 , H01H2001/0089
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Patent Agency Ranking
公开(公告)号：EP2702004A2
公开(公告)日：2014-03-05
申请号：EP12719509.7
申请日：2012-03-23
Applicant: Clean Energy Labs, LLC
IPC: B82B3/00
CPC classification number: B82B3/0023 , B81B2201/018 , B81B2201/036 , B81B2203/0109 , B81B2207/053 , B81C3/001 , B81C2201/019 , B81C2201/0194 , B81C2203/036 , B81C2203/051 , G01L9/0042 , H01H1/0094
Abstract: The present invention relates to thin membranes (such as graphene windows) and methods of aligned transfer of such thin membranes to substrates. The present invention further relates to devices that include such thin membranes.
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77.发明公开STRUCTURE FOR SIGNAL LINE, MANUFACTURING METHOD FOR SIGNAL LINE AND SWITCH USING THE SIGNAL LINE 审中-公开结构某个信号线，方法信号管理和开关，SIGNALLEITUNG
公开(公告)号：EP2546920A4
公开(公告)日：2013-11-06
申请号：EP10847501
申请日：2010-12-09
Applicant: OMRON TATEISI ELECTRONICS CO
Inventor： YAMAMOTO JUNYA , NARISE KOJI
CPC classification number: H01P3/081 , B81B3/0086 , B81B2201/018 , B81B2203/0136 , H01H59/0009 , H01H2001/0078 , H01P1/127
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78.发明公开STRUCTURE FOR SIGNAL LINE, MANUFACTURING METHOD FOR SIGNAL LINE AND SWITCH USING THE SIGNAL LINE 审中-公开结构某个信号线，方法信号管理和开关，SIGNALLEITUNG
公开(公告)号：EP2546920A1
公开(公告)日：2013-01-16
申请号：EP10847501.3
申请日：2010-12-09
Applicant: Omron Corporation
Inventor： YAMAMOTO Junya , NARISE Koji
CPC classification number: H01P3/081 , B81B3/0086 , B81B2201/018 , B81B2203/0136 , H01H59/0009 , H01H2001/0078 , H01P1/127
Abstract: Disclosed is a structure for a signal line (21) wherein a lower insulating layer (23) is formed on the upper surface of a base (22); a semiconductor layer (24) is provided on the upper surface of the lower insulating layer (23) such that at least one part thereof follows a pathway intended for signal transmission; an upper insulating layer (25) is provided on the upper surface of the semiconductor layer (24) such that at least one part thereof follows the semiconductor layer (24); and a strip conductor (26) is wired on the upper surface of the insulating layer (25) such that at least one part thereof follows the upper insulating layer (25). The signal line (21) is formed as an island, and the semiconductor layer (24) and upper insulating layer (25) are of roughly the same width as the strip conductor (26).
Abstract translation: 公开了一种用于worin下绝缘层的信号线（21）的结构（23）形成在一个底座（22）的上表面上; 的半导体层（24）设置在检测（23）的下部绝缘层的上表面上没有它们的至少一部分如下拟用于信号传输的通道; 在上层绝缘层（25）被设置在半导体层的上表面（24）做了检查其至少一个部分如下所述半导体层（24）; 和带状导体（26）被布线上的绝缘层（25）的上表面上做检查其至少一部分如下所述上绝缘层（25）。 信号线（21）形成为在冰岛，和半导体层（24）和上层绝缘层（25）是相同的，为带状导体（26）大致宽度。
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公开(公告)号：EP1721866B1
公开(公告)日：2008-12-10
申请号：EP06116530.4
申请日：2002-11-08
Applicant: WiSpry, Inc.
Inventor： Cunningham, Shawn, J. , Dereus, Dana R. , Sett, Subham , Tatic-Lucic, Svetlana
IPC: B81B3/00
CPC classification number: B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
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80.发明公开
公开(公告)号：EP1785391A3
公开(公告)日：2008-06-11
申请号：EP07002339.5
申请日：2004-04-16
Applicant: MEDTRONIC, INC.
Inventor： Receveur, Rogier , Habets, Philippe , Danzl, Ralph B. , Houben, Richard P. M. , Mattes, Michael F.
CPC classification number: H01H59/0009 , B81B3/0054 , B81B2201/018 , B81B2203/051 , H01H2001/0042 , H01H2001/0078 , Y10T29/49105
Abstract: A multi-stable electromechanical switch having an open state and a closed state, the electromechanical switch comprising: a moveable member, at least one pair of receiving terminals biased to a bias position corresponding to the open state, wherein each terminal of the at least one pair of receiving terminals is configured to interface with the moveable member in the closed state; and an actuating circuit configured to provide electrostatic energy and to thereby displace the at least one pair of receiving terminals from the bias position, and to displace the moveable member toward the bias position; wherein the receiving terminals are further configured to return towards the bias position when the electrostatic energy is removed, and to thereby create an electrical connection with the moveable member, thereby retaining the electromechanical switch in the closed state.
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