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    INTEGRATED STRUCTURE OF MEMS PRESSURE SENSOR AND MEMS INERTIA SENSOR
    72.
    发明申请
    INTEGRATED STRUCTURE OF MEMS PRESSURE SENSOR AND MEMS INERTIA SENSOR 审中-公开

    公开(公告)号：US20180044174A1

    公开(公告)日：2018-02-15

    申请号：US15554652

    申请日：2015-12-14

    Applicant: Goertek.Inc

    Inventor： Guoguang ZHENG

    IPC: B81B7/02 ,  B81B7/00 ,  G01P15/125 ,  G01L9/12 ,  G01L19/04 ,  B81B3/00 ,  B81C1/00

    CPC classification number: B81B7/02 ,  B81B3/0021 ,  B81B7/0061 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/04 ,  B81C1/00166 ,  B81C1/00269 ,  G01L9/12 ,  G01L19/04 ,  G01P15/125

    Abstract: The present invention discloses a integrated structure of an MEMS pressure sensor and an MEMS inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate. The integrated structure according to the present invention integrates the MEMS inertia sensor and the MEMS pressure sensor on the same substrate, which may effectively reduce the area of the chip, so as to reduce the cost of the chip. Single packaging may complete the packaging of the entire chip and reduce the cost of the chip packaging.

    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
    78.
    发明授权
    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权
    在半导体衬底上具有单片集成多传感器装置的运输装置及其方法

    公开(公告)号：US09327965B2

    公开(公告)日：2016-05-03

    申请号：US14207443

    申请日：2014-03-12

    Applicant: Versana Micro Inc.

    Inventor： Bishnu Prasanna Gogoi

    IPC: B81B7/02 ,  H01L27/14 ,  H01L27/22 ,  H01L27/16 ,  H05K7/02 ,  H01L41/113

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

    Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

    Apparatus for Sensor with Communication Port for Configuring Sensor Characteristics and Associated Methods
    79.
    发明申请
    Apparatus for Sensor with Communication Port for Configuring Sensor Characteristics and Associated Methods 审中-公开
    具有通信端口的传感器装置，用于配置传感器特性和相关方法

    公开(公告)号：US20160116499A1

    公开(公告)日：2016-04-28

    申请号：US14520774

    申请日：2014-10-22

    Applicant: Silicon Audio Seismic, LLC

    Inventor： Charles D. Thompson

    IPC: G01P21/00 ,  B81B3/00 ,  B81B7/02 ,  G01D5/20 ,  G01B11/00

    CPC classification number: G01P21/00 ,  B81B3/0021 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2207/03 ,  G01B11/00 ,  G01D5/20 ,  G01D5/30 ,  G01P15/105 ,  G01P2015/0814

    Abstract: A sensor includes a coil suspended in a magnetic field, an optical detector to detect displacement of the coil in response to a stimulus, and a feedback circuit coupled to the optical detector and to the coil. The sensor further includes a serial communication port used to configure at least one characteristic of the sensor, wherein the at least one characteristic of the sensor comprises an overload point of the sensor, a gain of the sensor, a full-scale range of the sensor, a power consumption of sensor, sleep mode parameters of the sensor, a coil configuration of the sensor, and/or coil damping of the sensor.

    Abstract translation: 传感器包括悬挂在磁场中的线圈，用于响应于刺激来检测线圈的位移的光学检测器，以及耦合到光学检测器和线圈的反馈电路。 传感器还包括用于配置传感器的至少一个特征的串行通信端口，其中传感器的至少一个特性包括传感器的过载点，传感器的增益，传感器的满量程范围 ，传感器的功耗，传感器的睡眠模式参数，传感器的线圈配置和/或传感器的线圈阻尼。

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