公开(公告)号：KR1020150073965A

公开(公告)日：2015-07-01

申请号：KR1020157008591

申请日：2013-10-18

Applicant: 미츠비시 가스 가가쿠 가부시키가이샤

Inventor： 지바도모 ,  다카하시히로시 ,  시가에이스케 ,  오가시와다카아키

IPC: C08L63/00 ,  C08L83/06 ,  C08K3/34 ,  C08K3/36 ,  C08G59/20 ,  C08G59/42 ,  C08G59/62 ,  C08G77/18

CPC classification number: C08L73/00 ,  B32B5/26 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/24 ,  C08G59/4246 ,  C08G59/621 ,  C08G77/18 ,  C08G77/52 ,  C08J5/24 ,  C08J2363/00 ,  C08J2373/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2473/00 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  C08L63/06 ,  C08L83/06 ,  C08L83/14 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0275 ,  H05K2201/029

Abstract: 고도의난연성을가지며, 내열성이높고, 열팽창률이낮고, 또한드릴가공성이우수한경화물을실현가능한수지조성물, 그수지조성물을포함하는프리프레그, 그프리프레그를포함하는적층판및 금속피복적층판, 그리고상기수지조성물을포함하는프린트배선판을제공하는것을과제로한다. 카르복실기를갖는직사슬폴리실록산 (a) 와에폭시기를갖는고리형에폭시화합물 (b) 를, 상기직사슬폴리실록산 (a) 의카르복실기에대해상기고리형에폭시화합물 (b) 의에폭시기가 2 ∼ 10 당량이되도록, 반응시켜얻어지는에폭시실리콘수지 (A), 시안산에스테르화합물 (B) 및/또는페놀수지 (C), 그리고무기충전재 (D) 를적어도함유하는수지조성물.

公开(公告)号：US20240090175A1

公开(公告)日：2024-03-14

申请号：US18261994

申请日：2022-01-19

Applicant: Beji SASAKI

Inventor： Beji SASAKI

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/00 ,  H05K13/00

CPC classification number: H05K7/205 ,  H05K1/0209 ,  H05K5/006 ,  H05K13/0015 ,  H05K2201/0212 ,  H05K2201/0275

Abstract: An electronic device has a device part 10; and a fiber member 30 for joining the device part 10 to another member other than the device part included in the electronic device.

公开(公告)号：US20240057252A1

公开(公告)日：2024-02-15

申请号：US18266627

申请日：2020-12-17

Applicant: SEKISUI KASEI CO., LTD.

Inventor： Koichiro OKAMOTO

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/036 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0275

Abstract: There are provided a laminate and the like and a circuit board including the same that exhibit an excellent low dielectric property by a non-conventional new approach. The laminate according to an embodiment of the present invention is a laminate used for a core layer of a circuit board, in which the laminate does not include a buildup layer, the laminate is obtained by laminating a plurality of prepregs including a fiber base material layer and a resin layer (A) so that the prepregs are in direct contact with each other, the resin layer (A) contains an inorganic filler and hollow resin particles, and the hollow resin particles are contained in the resin layer (A) in an amount of 1% by weight to 50% by weight with respect to the total amount of the resin layer (A).

公开(公告)号：US11903127B2

公开(公告)日：2024-02-13

申请号：US17381201

申请日：2021-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/03 ,  B32B27/20 ,  B32B27/12 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/101 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/301 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0275

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

公开(公告)号：US20240018034A1

公开(公告)日：2024-01-18

申请号：US18475424

申请日：2023-09-27

Applicant: Electric Glass Fiber America, LLC.

Inventor： Hong Li

IPC: C03C13/00 ,  C03C3/118 ,  C03C13/06 ,  C03C3/091 ,  C03C3/093 ,  H05K1/03

CPC classification number: C03C13/00 ,  C03C3/118 ,  C03C13/06 ,  C03C3/091 ,  C03C3/093 ,  H05K1/0306 ,  C03C2213/00 ,  H05K2201/0275

Abstract: New glass compositions and applications thereof are disclosed. A glass composition as described herein can include 50 to 55 weight percent SiO2, 17 to 26 weight percent B2O3, 13 to 19 weight percent Al2O3, 0 to 8.5 weight percent MgO, 0 to 7.5 weight percent ZnO, 0 to 6 weight percent CaO, 0 to 1.5 weight percent Li2O, 0 to 1.5 weight percent F2, 0 to 1 weight percent Na2O, 0 to 1 weight percent Fe2O3, 0 to 1 weight percent TiO2, and 0 to 8 weight percent of other constituents. Also described herein are glass fibers formed from such compositions, composites, and articles of manufacture comprising the glass compositions and/or glass fibers.

公开(公告)号：US20180215894A1

公开(公告)日：2018-08-02

申请号：US15746985

申请日：2016-07-29

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan CHENG ,  Yun ZHENG ,  Huihui LI ,  Haowei TANG ,  Chao LIU ,  Richard LIU

IPC: C08K3/22 ,  C08K3/013 ,  C08K5/00 ,  C08K7/14 ,  C08K7/06 ,  C08L69/00

CPC classification number: C08K3/22 ,  C08K3/013 ,  C08K5/0041 ,  C08K5/18 ,  C08K5/315 ,  C08K5/3447 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2248 ,  C08K2003/2293 ,  C08K2003/2296 ,  C08L23/0869 ,  C08L33/04 ,  C08L51/04 ,  C08L69/00 ,  C08L69/005 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/0275 ,  H05K2201/09118 ,  C08L101/00

Abstract: The disclosure concerns polymer compositions exhibiting LDS properties while maintaining mechanical properties and a dark color throughout the composition.

公开(公告)号：US09801284B2

公开(公告)日：2017-10-24

申请号：US14944811

申请日：2015-11-18

Applicant: Dow Global Technologies LLC

Inventor： Tamara Dikic ,  Michael A. De Graaf ,  Christophe Brault ,  Stefan Prot ,  C A Torfs-Van Cotthem

IPC: B23B37/00 ,  C03C25/68 ,  C03C15/00 ,  C23F1/00 ,  H01L21/302 ,  H01L21/461 ,  H01L21/31 ,  H01L21/469 ,  H01L21/00 ,  H05K3/06 ,  H01G9/055 ,  C23F4/00 ,  C23F1/02 ,  H05K1/02 ,  H05K1/09 ,  H05K3/22

CPC classification number: H05K3/06 ,  C03C2218/33 ,  C23F1/02 ,  C23F4/00 ,  H01G9/055 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/064 ,  H05K3/22 ,  H05K2201/0275

Abstract: A method of manufacturing a patterned conductor is provided, comprising: providing a substrate, comprising: a base material with an electrically conductive layer disposed thereon; providing an electrically conductive layer etchant; providing a spinning material, comprising: a carrier; and, a photosensitive masking material; providing a developer; forming a plurality of masking fibers and depositing them onto the electrically conductive layer to form a plurality of deposited fibers; patterning the plurality of deposited fibers to provide a treated fiber portion and an untreated fiber portion; developing the plurality of deposited fibers, wherein either the treated fiber portion or the untreated fiber portion is removed, leaving a patterned fiber array; contacting the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the patterned fiber array is removed, leaving a patterned conductive network on the substrate.

公开(公告)号：US20170196082A1

公开(公告)日：2017-07-06

申请号：US15468333

申请日：2017-03-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroharu INOUE ,  Koji KISHINO

IPC: H05K1/03 ,  H05K3/02

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US20170142842A1

公开(公告)日：2017-05-18

申请号：US14944811

申请日：2015-11-18

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Tamara Dikic ,  Michael A. De Graaf ,  Christophe Brault ,  Stefan Prot ,  C A. Torfs-Van Cotthem

IPC: H05K3/06 ,  H05K3/22 ,  H05K1/02 ,  C23F1/02 ,  H05K1/09

CPC classification number: H05K3/06 ,  C03C2218/33 ,  C23F1/02 ,  C23F4/00 ,  H01G9/055 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/064 ,  H05K3/22 ,  H05K2201/0275

Abstract: A method of manufacturing a patterned conductor is provided, comprising: providing a substrate, comprising: a base material with an electrically conductive layer disposed thereon; providing an electrically conductive layer etchant; providing a spinning material, comprising: a carrier; and, a photosensitive masking material; providing a developer; forming a plurality of masking fibers and depositing them onto the electrically conductive layer to form a plurality of deposited fibers; patterning the plurality of deposited fibers to provide a treated fiber portion and an untreated fiber portion; developing the plurality of deposited fibers, wherein either the treated fiber portion or the untreated fiber portion is removed, leaving a patterned fiber array; contacting the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the patterned fiber array is removed, leaving a patterned conductive network on the substrate.

公开(公告)号：US09474149B2

公开(公告)日：2016-10-18

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/20

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: The invention relates to an angle-adjustable and/or printed circuit board structure having at least two printed circuit board sections arrangeable or arranged angularly with respect to one another, wherein the printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads, wherein the two contact pads are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. In order to improve the electrical and mechanical connection between the printed circuit board sections, the invention provides for the conduction element to have a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section. A corresponding method for producing this printed circuit board structure is like wise claimed.

Abstract translation: 本发明涉及一种角度可调节和/或印刷电路板结构，其具有至少两个相对于彼此成角度布置或布置的印刷电路板部分，其中印刷电路板结构包含至少一个传导元件，其至少嵌入 主要在印刷电路板结构中并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘，其中两个接触焊盘位于不同的印刷电路板部分上，其中印刷电路板部分是角度可调节的和/ 或相对于彼此成角度，同时维持接触焊盘和至少一个导电元件之间的连接，并且经由印刷电路板部分之间的弯曲边缘弯曲至少一个导电元件。 为了改善印刷电路板部分之间的电气和机械连接，本发明提供了导电元件沿着弯曲边缘比垂直于其更大的程度，如横截面所示。 用于制造该印刷电路板结构的相应方法如所示。