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    Capacitor sheet and electronic circuit board
    72.
    发明专利
    Capacitor sheet and electronic circuit board 有权
    电容器和电子电路板

    公开(公告)号：JP2007250867A

    公开(公告)日：2007-09-27

    申请号：JP2006072739

    申请日：2006-03-16

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： KURAMITSU KOICHI ,  FUJITA KAZUO ,  IZUHARA NOBORU

    IPC: H01G4/38 ,  H01G4/228 ,  H01L23/12 ,  H05K1/16

    CPC classification number: H05K1/0231 ,  H01L23/66 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19103 ,  H01L2924/19106 ,  H05K1/113 ,  H05K1/141 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K2203/0733

    Abstract: PROBLEM TO BE SOLVED: To provide a capacitor sheet and an electronic circuit board wherein a noise of an LSI, etc. is removed in the electronic circuit board of a general electronic instrument including a communication apparatus, whereas, even if a speed of an electronic device is increased and a density of the electronic circuit board is increased, a noise can certainly be removed. SOLUTION: The capacitor sheet and an electronic circuit board have a first through-electrode 33A which is provided through a laminate body 40 and is connected to a terminal electrode 11 of an LSI 1, a second through-electrode 34A which is electrically insulated from the first through-electrode 33A and is provided through the laminate body 40, a first conductor thin film 35A electrically connected to only the first through-electrode 33A, and a second conductor thin film 36A electrically connected to only the second through-electrode 34A and also arranged opposite to the first conductor thin film 35A through a dielectric layer 39. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种在包括通信设备的通用电子仪器的电子电路板中去除LSI等的噪声的电容器片和电子电路板，而即使速度 电子设备的密度增加，并且电子电路板的密度增加，肯定可以去除噪声。 解决方案：电容器片和电子电路板具有通过层叠体40设置并连接到LSI1的端子电极11的第一贯通电极33A，电连接到LSI 1的端子电极11，第二贯通电极34A， 与第一贯通电极33A绝缘，并且通过层叠体40设置与仅第一贯通电极33A电连接的第一导体薄膜35A和仅与第二贯通电极33A电连接的第二导体薄膜36A 34A，并且还通过介电层39布置成与第一导体薄膜35A相对。版权所有（C）2007，JPO＆INPIT

    MONOBLOCK RF RESONATOR/FILTER
    77.
    发明申请
    MONOBLOCK RF RESONATOR/FILTER 审中-公开
    MONOBLOCK RF谐振器/滤波器

    公开(公告)号：WO2008051572A1

    公开(公告)日：2008-05-02

    申请号：PCT/US2007/022556

    申请日：2007-10-24

    Applicant: CTS CORPORATION

    Inventor： ROGOZINE, Alexandre

    IPC: H01P1/205 ,  H01P1/213

    CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

    Abstract: A resonator/filter (100) adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material (110) including at least one resonator through-hole (101-104) extending therethrough and respective top (112), bottom (113) and side surfaces (114-117) defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments (131, 156) electrically interconnect the first and second conductive regions.

    Abstract translation: 一种适于直接表面安装到印刷电路板表面的谐振器/滤波器（100）。 谐振器/滤波器包括介电材料块（110），其包括延伸穿过其中的至少一个谐振器通孔（101-104）和相应的顶部（112），底部（113）和限定相应区域的侧表面（114-117） 介电材料被导电材料覆盖。 顶部块表面限定至少第一导电区域。 块的底表面上的第二导电区域限定了输入/输出触点，其允许过滤器安装在板上，底部过滤器表面位于其上，从而在板和谐振器通孔之间提供直接接地 用于改善衰减性能，特别是在较高频率下。 多个传输线实施例（131,156）电连接第一和第二导电区域。

    MONOLITHIC INTERCONNECTION INTERFACE FOR THE STACKING OF ELECTRONIC COMPONENTS AND THE PRODUCTION METHOD THEREOF
    78.
    发明申请
    MONOLITHIC INTERCONNECTION INTERFACE FOR THE STACKING OF ELECTRONIC COMPONENTS AND THE PRODUCTION METHOD THEREOF 审中-公开
    用于堆叠电子元件的单片互连接口及其生产方法

    公开(公告)号：WO03058719B1

    公开(公告)日：2004-05-27

    申请号：PCT/FR0204009

    申请日：2002-11-22

    Applicant: NOVATEC SOC ,  BOURRIERES FRANCIS ,  KAISER CLEMENT

    Inventor： BOURRIERES FRANCIS ,  KAISER CLEMENT

    IPC: H01L25/10 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

    CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: The invention relates to an interconnection interface (1) which can be used to create at least one additional interconnection surface level for the production of three-dimensional electronic assemblies. According to the invention, the base boxes (3), which provide the electric interconnection with said interface, are surface assembly components of the type which have gullwing connections that extend out from the boxes called SO, TSOP, QFP, etc. Said interface consists of a one-piece printed circuit comprising at least two faces and having non-through openings and metallised through holes, thereby fulfilling the mechanical separator and electric connection functions simultaneously. The upper face (4) of the interface (1) is flat and forms a receiving and interconnecting circuit and the surface thereof, which is totally free, can be adapted to the size of additional components. The lower face of said interface comprises at least two levels, namely: a first level (5) forming a circuit which is used simultaneously for the electric interconnection and the mechanical bearing on the supports (2) of the base box(es) (3) and the link via metallised holes (6) with the upper face (4); and a second level (7) forming the apex of an opening that is used for the passage of the body/bodies of the base box(es) to be avoided.

    Abstract translation: 本发明涉及一种互连接口（1），其可用于产生用于生产三维电子组件的至少一个额外的互连表面水平。 根据本发明，提供与所述接口的电互连的底盒（3）是具有从称为SO，TSOP，QFP等的盒延伸出的鸥翼连接类型的表面组装部件。所述接口包括 包括至少两个面并且具有不通孔和金属化通孔的单件印刷电路，从而同时实现机械分离器和电连接功能。 接口（1）的上表面（4）是平坦的，并且形成接收和互连电路，并且其完全没有的表面可以适应于附加部件的尺寸。 所述接口的下表面包括至少两个层次，即形成电路的第一层（5），其与电互连同时使用，并且基座盒（3）的支撑件（2）上的机械轴承 ）和通过金属化孔（6）与上表面（4）的连接; 以及形成用于待避免的底盒的主体/主体的通道的开口的顶点的第二水平面（7）。

    CIRCUIT BOARD WITH AT LEAST ONE ELECTRONIC COMPONENT
    79.
    发明申请
    CIRCUIT BOARD WITH AT LEAST ONE ELECTRONIC COMPONENT 审中-公开
    电路板，至少一个电子元件

    公开(公告)号：WO02100140A3

    公开(公告)日：2003-03-20

    申请号：PCT/EP0205512

    申请日：2002-05-18

    Applicant: ENDRESS & HAUSER GMBH & CO KG ,  BIRGEL DIETMAR ,  LOPATIN SERGEJ

    Inventor： LOPATIN SERGEJ

    IPC: H05K3/34 ,  H01L23/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H05K3/363 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/28 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0979 ,  H05K2201/10666 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655

    Abstract: A circuit board (1) is disclosed, comprising a mechanical and electrical connection between the circuit board and a component (17) thereon which may be subjected to high mechanical and electrical loads, with at least one internal connector strip (3), a first insulation layer (5) arranged on a first surface of the circuit board (1), a second insulation layer (7) arranged on a second surface of the circuit board (1), a first contact point (9, 31) to which the contact strip (3) has access, a second contact point (13) to which the contact strip (3) has access through a drilling (15), extending right through the circuit board (1) and an electronic component (17), arranged on the first surface, which has a first contact surface (19), connected to the first contact point (9, 31) by means of a solder or glued with an electrically conducting adhesive and comprising a second contact surface (21), connected to the second contact point (13) by means of a solder or adhesive.

    Abstract translation: 这是一个印刷电路板（1），其中，上述电路板（1）和组分位于其上（17）之间的是具有至少一个内导体（3）机械地高度可加载电和机械连接，一个第一上的第一表面 所述电路板（1），其布置（5），在所述电路板（1）的第二表面上的第二布置绝缘层绝缘层（7），第一接触位置（9，31），在该导体路径（3）是可访问的（第二接触点 13），在该导体路径（3）是通过（1）完全穿过孔（15）的印刷电路板可访问的，并且，设置在具有第一接触表面（19设置有电子部件（17））的第一表面上 第一接触位置（9，31）通过钎焊或导电性粘接剂粘接，和第二接触表面（21）连接，其与 第二接触点（13）通过焊接或胶合连接。

    PRINTED CIRCUIT BOARD ASSEMBLY
    80.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开
    印刷电路板组装

    公开(公告)号：WO0178199A3

    公开(公告)日：2002-04-11

    申请号：PCT/US0111840

    申请日：2001-04-11

    Applicant: POWER ONE INC ,  LIU HANSON ,  LU QUN

    Inventor： LIU HANSON ,  LU QUN

    IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K3/368 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10666

    Abstract: In printed circuit board fabrication, processing steps for components on one section of the board are sometimes incompatible with processing steps for components on another section of the board. The method of the invention provides for physically separate printed circuit board sections that are processed separately and joined together following processing. To provide electrical connection between a first component on a first printed circuit board section and a second component on a second printed circuit board section, the method of the invention includes the steps of connecting the first and second components to conducting regions disposed on edges of their respective printed circuit board sections. The two printed circuit board sections are then joined together so that the two conducting regions contact each other.

    Abstract translation: 在印刷电路板制造中，板的一个部分上的部件的处理步骤有时与板的另一部分上的部件的处理步骤不兼容。 本发明的方法提供了物理上分开的印刷电路板部分，它们在处理之后分开处理并连接在一起。 为了在第一印刷电路板部分上的第一部件和第二印刷电路板部分上的第二部件之间提供电连接，本发明的方法包括将第一和第二部件连接到设置在它们的边缘上的导电区域的步骤 各个印刷电路板部分。 然后将两个印刷电路板部分接合在一起，使得两个导电区域彼此接触。

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