公开(公告)号：US09247642B2

公开(公告)日：2016-01-26

申请号：US13533681

申请日：2012-06-26

Applicant: Tsung-Yu Chen ,  Rebecca Shia

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L23/498 ,  H05K3/40 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

Abstract translation: 示出了引脚连接，电子设备和方法的实施例，其包括引脚配置以减少引脚连接操作期间的空隙和引脚倾斜以及其它问题，诸如附接到芯片封装引脚网格阵列。 引脚头被显示为包括诸如凸表面，多个腿和销头表面中的通道的特征。

公开(公告)号：US20150157862A1

公开(公告)日：2015-06-11

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J. Greenberg ,  Neil H. Talbot ,  James S. Little

IPC: A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  A61N1/372

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

Abstract translation: 本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录 的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。 该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。 大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。 该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。 本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。

公开(公告)号：US07786556B2

公开(公告)日：2010-08-31

申请号：US12215168

申请日：2008-06-25

Applicant: Tomoyuki Yoshino

Inventor： Tomoyuki Yoshino

IPC: H01L21/00

CPC classification number: H05K3/3426 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device has an element encapsulated in a resin mold. Metal leads protruding from the resin mold are solder plated except at the lead-tip end surfaces, and the exposed lead-tip end surfaces have an area less than half the cross-sectional area of the protruding metal leads. The semiconductor device is manufactured using a lead frame in which the metal leads are connected to a frame by plating bars having a thickness smaller than half the thickness of the metal leads. In another embodiment, the metal leads are connected to the frame by plating bars that extend sideways from the metal leads, and the end tips of the metal leads are entirely covered with plating to improve soldering wettability.

Abstract translation: 半导体器件具有封装在树脂模具中的元件。 从树脂模具突出的金属引线除了铅尖端面以外是焊料镀覆的，露出的引线前端端面的面积小于突出金属引线的横截面面积的一半。 使用引线框架制造半导体器件，其中金属引线通过具有小于金属引线厚度的一半厚度的电镀棒连接到框架。 在另一个实施例中，金属引线通过从金属引线横向延伸的电镀棒连接到框架，并且金属引线的端部末端被电镀覆盖以提高焊接润湿性。

公开(公告)号：US20100139970A1

公开(公告)日：2010-06-10

申请号：US12633443

申请日：2009-12-08

Applicant: Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

Inventor： Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

IPC: H01R12/04 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Abstract translation: 提供具有引脚的布线板。 具有引线销的布线板包括形成在布线板上的连接焊盘，引导销通过导电材料接合到该连接焊盘。 引导销包括：轴部; 头部，其设置在所述轴部的一端; 形成在所述头部的与所述连接垫相对的表面侧的突出部; 以及形成在所述头部与所述轴部的基部之间的第一锥形部。

公开(公告)号：US20080006937A1

公开(公告)日：2008-01-10

申请号：US11426157

申请日：2006-06-23

Applicant: Akira Matsunami

Inventor： Akira Matsunami

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48611 ,  H01L2224/48613 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48711 ,  H01L2224/48713 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/48811 ,  H01L2224/48813 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/85411 ,  H01L2224/85413 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic device package that includes a microelectronic device encapsulated within a packaging material. The microelectronic device package also includes a lead attached to a portion of the microelectronic device extending through the packaging material. The lead has a break portion and a non-break portion on a tip of the lead.

Abstract translation: 一种微电子器件封装，其包括封装在封装材料内的微电子器件。 微电子器件封装还包括附接到延伸穿过包装材料的微电子器件的一部分的引线。 引线在引线的尖端上具有断裂部分和非断裂部分。

公开(公告)号：US20070207635A1

公开(公告)日：2007-09-06

申请号：US11604289

申请日：2006-11-27

Applicant: Mark Gailus ,  Leon Khilchenko

Inventor： Mark Gailus ,  Leon Khilchenko

IPC: H01R12/00

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

公开(公告)号：US20020096344A1

公开(公告)日：2002-07-25

申请号：US09883946

申请日：2001-06-20

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Masaaki Okada ,  Hitoshi Matsudaira

IPC: H05K009/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  Y10S174/35

Abstract: The invention provides a shield structure that allows an easy installment of a shield case on a circuit board with more strength and firmness even if the shield case is warped or distorted. The proposed shield case comprises a frame member consisting of four sidewalls and a covermember covering a farther end of the frame member from the circuit board. The frame member comprises a supporting member for sustaining the frame member on the circuit board and end faces confronting the circuit board. The supporting member comprises three projections protruding from the end face toward the circuit board.

Abstract translation: 本发明提供了一种屏蔽结构，即使屏蔽壳体翘曲或变形，也能够在电路板上容易地安装屏蔽壳体，并具有更强的强度和坚固性。 所提出的屏蔽壳包括由四个侧壁构成的框架构件和覆盖框架构件与电路板的更远端的覆盖构件。 框架构件包括用于维持电路板上的框架构件的支撑构件和面对电路板的端面。 支撑构件包括从端面朝向电路板突出的三个突起。

公开(公告)号：US4995156A

公开(公告)日：1991-02-26

申请号：US748390

申请日：1985-06-25

Applicant: Giuseppe R. Pinnavaia

Inventor： Giuseppe R. Pinnavaia

IPC: H05K20060101 ,  H05K1/09 ,  H05K1/11 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/326 ,  H05K3/308 ,  H05K1/095 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10871 ,  H05K2203/1189 ,  H05K2203/1446 ,  H05K2203/1453 ,  H05K3/245 ,  H05K3/306 ,  Y10T29/4913 ,  Y10T29/4914 ,  Y10T29/49837

Abstract: Subject-matter of this invention is a method for assembling components, such as M.O.S, devices and the like, upon printed circuit boards by clinching, such method including the steps of providing a board bearing a printed circuit with places upon which a component is to be assembled; applying the component upon the board with its pins in contact with the places of the circuit among which it is to be assembled; pressing the component in order that the pins are forced to penetrate through the thickness of the board; and clinching the end portions of the pins protruding from the back side of the board.

Abstract translation: 本发明的主题是在印刷电路板上通过铆接来组装诸如MOS，器件等的部件的方法，包括以下步骤：提供带有印刷电路的印刷电路板，其中部件将在其上 组装; 将所述部件施加在所述电路板上，其引脚与要组装的电路的位置接触; 按压组件以使销被迫穿过板的厚度; 并且夹紧从板的背面突出的销的端部。

公开(公告)号：US4818823A

公开(公告)日：1989-04-04

申请号：US70343

申请日：1987-07-06

Applicant: Robert F. Bradley

Inventor： Robert F. Bradley

IPC: H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/284 ,  H05K3/305 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K2203/1311 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting method which utilizes an adhesive component to mount the electrical components to a printed circuit board instead of solder and which includes the use, between the contacting surfaces, of a flowable, corrosion-resistant material which bridges contact imperfections and penetrates surface films. The method may also be implemented to connect two electrical conductors.

Abstract translation: 一种表面安装方法，其利用粘合剂部件将电气部件安装到印刷电路板而不是焊料，并且包括在接触表面之间使用桥接接触缺陷并渗透表面膜的可流动的耐腐蚀材料。 还可以实现该方法来连接两个电导体。

公开(公告)号：US4659156A

公开(公告)日：1987-04-21

申请号：US748264

申请日：1985-06-24

Applicant: Douglas M. Johnescu ,  Erlon F. Johnson

Inventor： Douglas M. Johnescu ,  Erlon F. Johnson

IPC: H01R24/50 ,  H05K3/30 ,  H01K1/00

CPC classification number: H01R24/50 ,  H05K3/308 ,  H01R2103/00 ,  H05K2201/09809 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10795 ,  H05K2201/10863 ,  H05K2203/167

Abstract: According to the invention an improved connector has a housing portion with a base for mounting on a printed circuit board, projecting mounting posts extend from the base, a conductive outer shell and a dielectric body are surrounded by the housing portion, a first conductive contact is carried by the dielectric body and projects from the outer shell and has a first contact portion projecting from the housing for insertion into a corresponding aperture of a printed circuit board, the outer shell has a second contact portion projecting from the housing for insertion into a corresponding aperture of a printed circuit board, the free ends of the mounting posts project outwardly further from the base of the housing than the free ends of the first and the second contact portions, and the connector is characterized in that; each mounting post has a taper toward the free end, and each contact portion has a taper toward the free end and with an apex of the taper that intersects a longitudinal edge of the corresponding contact portion and is aligned with a center line of a corresponding aperture of a printed circuit board.

Abstract translation: 根据本发明，改进的连接器具有壳体部分，其具有用于安装在印刷电路板上的基座，突出的安装柱从基座延伸，导电外壳和电介质体被壳体部分包围，第一导电触点 由电介质体承载并从外壳突出并且具有从壳体突出以插入到印刷电路板的相应孔中的第一接触部分，外壳具有从壳体突出以插入相应的第二接触部分 印刷电路板的孔径，安装柱的自由端比第一和第二接触部分的自由端从壳体的底部向外突出，并且连接器的特征在于： 每个安装柱具有朝向自由端的锥形，并且每个接触部分具有朝向自由端的锥形，并且锥形的顶点与相应的接触部分的纵向边缘相交并且与对应的孔的中心线对准 的印刷电路板。