公开(公告)号：US20180331447A1

公开(公告)日：2018-11-15

申请号：US15774412

申请日：2016-11-10

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： Ralf Geske

IPC: H01R13/05 ,  H01R43/16 ,  H01R12/71 ,  H05K1/18

CPC classification number: H01R13/052 ,  H01R12/585 ,  H01R12/71 ,  H01R43/16 ,  H05K1/184 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

公开(公告)号：US20180288873A1

公开(公告)日：2018-10-04

申请号：US15920806

申请日：2018-03-14

Applicant: Delphi International Operations Luxembourg, S.A.R.L.

Inventor： Matthias Rieke ,  Volker Klink ,  Florin Badarau-Trescovan

IPC: H05K1/14 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/147 ,  H05K1/0203 ,  H05K1/184 ,  H05K5/0204 ,  H05K5/0213 ,  H05K7/1427 ,  H05K7/1434 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20854 ,  H05K7/20863 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10189 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

公开(公告)号：US09891733B2

公开(公告)日：2018-02-13

申请号：US14843467

申请日：2015-09-02

Applicant: Samsung Display Co., Ltd.

Inventor： Byeong Kyu Jeon ,  Hyung Chul Kim ,  Jung Mok Park

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/18

CPC classification number: G06F3/041 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10901

Abstract: A touch screen panel includes: a touch sensor film including: at least one corner formed in a curved line; and a through part; and a flexible printed circuit board including one end connected to a wiring extending from the touch sensor film; the flexible printed circuit board disposed through the through part, wherein the through part is disposed adjacent to the corner of the touch sensor film formed in the curved line, and wherein the through part includes a curved line corresponding to the corner of the touch sensor film formed in the curved line.

公开(公告)号：US20170244184A1

公开(公告)日：2017-08-24

申请号：US15422978

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/11 ,  H01R13/405 ,  H01R13/05

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20160239116A1

公开(公告)日：2016-08-18

申请号：US14843467

申请日：2015-09-02

Applicant: Samsung Display Co., Ltd.

Inventor： Byeong Kyu JEON ,  Hyung Chul KIM ,  Jung Mok PARK

IPC: G06F3/041

CPC classification number: G06F3/041 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10901

Abstract: A touch screen panel includes: a touch sensor film including: at least one corner formed in a curved line; and a through part; and a flexible printed circuit board including one end connected to a wiring extending from the touch sensor film; the flexible printed circuit board disposed through the through part, wherein the through part is disposed adjacent to the corner of the touch sensor film formed in the curved line, and wherein the through part includes a curved line corresponding to the corner of the touch sensor film formed in the curved line.

Abstract translation: 触摸屏面板包括：触摸传感器薄膜，包括：形成在曲线中的至少一个角部; 和一部分; 以及柔性印刷电路板，其包括连接到从所述触摸传感器膜延伸的布线的一端; 所述柔性印刷电路板设置在所述贯穿部分中，其中所述贯穿部分邻近形成在所述曲线中的所述触摸传感器膜的角部设置，并且其中所述贯穿部分包括与所述触摸传感器膜的角部相对应的曲线 形成在曲线上。

公开(公告)号：US20160021747A1

公开(公告)日：2016-01-21

申请号：US14333774

申请日：2014-07-17

Applicant: DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.

Inventor： KIN YEAN CHOW

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/181 ,  H05K3/308 ,  H05K3/328 ,  H05K2201/10015 ,  H05K2201/10803 ,  H05K2201/10856 ,  H05K2201/10901 ,  H05K2201/10924 ,  H05K2203/107

Abstract: A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.

Abstract translation: 电路板组件包括印刷电路板和部件。 印刷电路板包括穿过印刷电路板的电镀通孔。 该部件包括用于将部件与印刷电路板互连的引线。 引线形成为通过引线定义开口。 引线被放置在电镀通孔中，使得开口的至少一部分在电镀通孔内。 铅被激光焊接到电镀通孔上。

公开(公告)号：US07708590B1

公开(公告)日：2010-05-04

申请号：US12508833

申请日：2009-07-24

Applicant: Zhan-Yang Li

Inventor： Zhan-Yang Li

IPC: H01R13/66

CPC classification number: H01R12/58 ,  H01R12/7011 ,  H05K1/18 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2201/10659 ,  H05K2201/10901

Abstract: A circuit board includes a board body of a thickness, and a socket. The board body defines a plurality of through holes therein. The socket includes a first line of short pin groups and a second line of long pin groups engaging the through holes of the board body. The socket defines a slot. The first line of short pin groups and the second line of long pin groups are respectively located on opposite sides of the slot. The first line of short pin groups has a length less than the thickness of the board body. The second line of long pin groups has a length sufficient that the second line of pin groups protrudes the board body.

Abstract translation: 电路板包括厚度的板体和插座。 板主体在其中限定多个通孔。 插座包括第一线短销组和与板主体的通孔接合的第二条长销组。 插座定义一个插槽。 短销组的第一行和长销组的第二行分别位于插槽的相对侧。 短销组的第一行长度小于板体的厚度。 长销组的第二行具有足够的长度，使得第二组销组突出板主体。

公开(公告)号：US20080280463A1

公开(公告)日：2008-11-13

申请号：US11746463

申请日：2007-05-09

Applicant: Darryl J. McKenney ,  Michael W. Gust ,  David G. Persad

Inventor： Darryl J. McKenney ,  Michael W. Gust ,  David G. Persad

IPC: H01R12/00

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K1/112 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10704 ,  H05K2201/10901 ,  H05K2203/1178 ,  Y02P70/613

Abstract: Improved printed circuit boards (PCBs), printed circuit board assemblies (PCBAs) and methods thereof contemplate PCBs with recesses incorporated into planar surfaces thereof adapted to receive respective elongate leads of circuit components. The recesses are sized so as to prevent distal ends of the leads from emerging through the far sides of the boards and, indeed, allow for positioning of the component flush with, or offset above, the board to which they are mounted.

Abstract translation: 改进的印刷电路板（PCB），印刷电路板组件（PCBA）及其方法考虑了具有并入其适于接收电路部件的相应细长引线的平面中的凹部的PCB。 凹槽的尺寸设计成防止引线的远端通过板的远侧出现，并且实际上允许将元件与其安装的板齐平或偏置在其上。

公开(公告)号：US20050230147A1

公开(公告)日：2005-10-20

申请号：US11150210

申请日：2005-06-13

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

公开(公告)号：US06878884B2

公开(公告)日：2005-04-12

申请号：US10419197

申请日：2003-04-21

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/16

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。