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    MODULAR CIRCUIT BOARD CONSTRUCTION AND METHOD OF PRODUCING THE SAME
    82.
    发明申请
    MODULAR CIRCUIT BOARD CONSTRUCTION AND METHOD OF PRODUCING THE SAME 审中-公开
    模块化电路板结构及其制造方法

    公开(公告)号：WO99025163A1

    公开(公告)日：1999-05-20

    申请号：PCT/US1998/023862

    申请日：1998-11-09

    IPC: H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/09072 ,  H05K2203/1572

    Abstract: A modular printed circuit (PC) board (52) construction for achieving greater circuit design flexibility wherein a predetermined circuit is segmented into a plurality of sub-parts, each circuit sub-part is embodied in a separate sub-circuit board or PC module (24, 26, 28), and the plurality of PC modules are interconnected to one another in an overlapping arrangement to implement the predetermined circuit. In one embodiment, the modular circuit board construction (52) is achieved by forming a plurality of openings (16, 18, 20, 22) through a primary circuit board (10). The present modules (24, 26, 28) are positionable over any one of the plurality of openings (16, 18, 20, 22) associated with the primary circuit board (10) adjacent either the top or bottom surface (12, 14) thereof and still other modules are stackably positionable on top of and interconnectable to other modules previously connected to the primary circuit board (10). In another embodiment, the entire predetermined circuit can be assembled and implemented by merely interconnecting the appropriate circuit modules. The overlapping arrangement of the present construction also enables the present modules (24, 26, 28) to include surface mounted components (36, 38) on both opposite surfaces thereof.

    Abstract translation: 一种用于实现更大的电路设计灵活性的模块化印刷电路（PC）板（52）结构，其中预定电路被分割成多个子部件，每个电路子部分体现在单独的子电路板或PC模块（ 24,26,28），并且多个PC模块以重叠布置彼此互连以实现预定电路。 在一个实施例中，模块化电路板结构（52）通过通过初级电路板（10）形成多个开口（16,18,20,22）来实现。 本模块（24,26,28）可定位在与顶部或底部表面（12,14）相邻的与主电路板（10）相关联的多个开口（16,18,20,22）中的任何一个上， 并且其他模块可堆叠地定位在先前连接到主电路板（10）的其它模块之上并可互连。 在另一个实施例中，整个预定电路可以仅通过互连适当的电路模块来组装和实现。 本结构的重叠布置还使得本模块（24,26,28）能够在其两个相对表面上包括表面安装部件（36,38）。

    CONTROL DEVICE
    83.
    发明申请
    CONTROL DEVICE 审中-公开
    控制装置

    公开(公告)号：WO1991005292A1

    公开(公告)日：1991-04-18

    申请号：PCT/JP1990001223

    申请日：1990-09-21

    Applicant: FANUC LTD ,  IMAZEKI, Ryoji ,  KURAKAKE, Mitsuo ,  YONEKURA, Mikio

    Inventor： FANUC LTD

    IPC: G05B11/01

    CPC classification number: H05K7/1467 ,  G05B15/02 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10189

    Abstract: A control device such as a numerical controller constituted of a plurality of printed boards on which are mounted various circuit components. Input/output interface connectors (9) are mounted on the printed board (1) in a manner that the lengthwise directions thereof are oriented in the vertical direction relative to the mounting surface of the printed board. Module boards (10) are mounted in the vertical direction relative to the mounting surface of the printed board (1). The module boards (10) have a height nearly equal to the height of the interface connectors (9). This makes it possible to increase the number of circuit components that can be mounted in a unit space, and to decrease the outer size of the whole control device.

    Abstract translation: 一种控制装置，例如由安装有各种电路部件的多个印刷电路板构成的数字控制装置。 输入/输出接口连接器（9）以其长度方向相对于印刷电路板的安装表面在垂直方向上取向的方式安装在印刷电路板（1）上。 模块板（10）相对于印刷板（1）的安装表面在垂直方向上安装。 模块板（10）的高度几乎等于接口连接器（9）的高度。 这使得可以增加可以安装在单元空间中的电路部件的数量，并且可以减小整个控制装置的外部尺寸。

    APPARATUS AND METHOD FOR TEMPERATURE COMPENSATING AN OVENIZED OSCILLATOR
    85.
    发明申请
    APPARATUS AND METHOD FOR TEMPERATURE COMPENSATING AN OVENIZED OSCILLATOR 审中-公开
    温度补偿烧结振荡器的装置和方法

    公开(公告)号：WO2008112265A1

    公开(公告)日：2008-09-18

    申请号：PCT/US2008/003306

    申请日：2008-03-12

    Applicant: CTS CORPORATION

    Inventor： STOLPMAN, James ,  KNECHT, Thomas ,  SHIRAR, Jerry

    IPC: H03B5/04

    CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

    Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

    Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

    SYSTEM AND METHOD FOR ADVANCED MEZZANINE CARD CONNECTION
    87.
    发明申请
    SYSTEM AND METHOD FOR ADVANCED MEZZANINE CARD CONNECTION 审中-公开
    用于高级MEZZANINE卡连接的系统和方法

    公开(公告)号：WO2006105521A2

    公开(公告)日：2006-10-05

    申请号：PCT/US2006/012586

    申请日：2006-03-31

    Applicant: INTEL CORPORATION ,  CAMPINI, Edoardo ,  SAFFARIAN, Andy ,  KHOURY, Marwan

    Inventor： CAMPINI, Edoardo ,  SAFFARIAN, Andy ,  KHOURY, Marwan

    IPC: H05K7/14

    CPC classification number: G06F1/186 ,  G06F1/184 ,  G06F1/185 ,  H01R12/52 ,  H05K1/141 ,  H05K1/144 ,  H05K3/323 ,  H05K3/325 ,  H05K7/1429 ,  H05K2201/0314 ,  H05K2201/045

    Abstract: A method according to one embodiment may include providing a circuit board having a connector footprint including a plurality of electrical contacts and providing a mezzanine card including a first plurality of conductive traces on a first side of the mezzanine card. The method of this embodiment may also include providing a first wiring board disposed between at least a portion of the circuit board and at least a portion of the mezzanine card. The first wiring board may electrically couple at least a portion of the electrical contacts of the connector footprint to at least a portion of the conductive traces of the mezzanine card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

    Abstract translation: 根据一个实施例的方法可以包括提供具有包括多个电触点的连接器封头的电路板，并且提供夹层卡，该夹层卡在夹层卡的第一侧上包括第一多个导电迹线。 该实施例的方法还可以包括提供设置在电路板的至少一部分与夹层卡的至少一部分之间的第一布线板。 第一布线板可以将连接器覆盖区的电触点的至少一部分电耦合到夹层卡的导电迹线的至少一部分。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

    HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURES
    89.
    发明申请
    HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURES 审中-公开
    高密度，具有热管理结构的高频记忆芯片模块

    公开(公告)号：WO01045479A1

    公开(公告)日：2001-06-21

    申请号：PCT/US2000/003888

    申请日：2000-02-15

    IPC: G11C5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

    CPC classification number: G11C5/143 ,  G11C5/00 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/066 ,  H05K2201/09709 ,  Y10T29/49004

    Abstract: The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card (20) has a number of electrical receptacles adapted to receive a daughter card (16). The daughter card (16) has memory devices (14 and 18) attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies (14 and 18) or thin packages are mounted onto daughter cards (16), which in turn are mounted onto either a mother board or memory card (20) using pin/hole technology.

    Abstract translation: 本发明具有适用于构造高容量，高速计算机存储卡等的超高密度三维电子电路封装。 可拆卸的触点系统允许轻松测试和/或老化。 存储卡（20）具有多个适于接收子卡（16）的电插座。 子卡（16）具有附接到其上的存储器件（14和18）以及沿着至少一个边缘放置的相应数量的电连接器，适于可拆卸地与存储卡的插座配合。 可拆卸的连接器允许在可选的永久焊接附着之前轻松地返修模块。 裸机（14和18）或薄封装安装在子卡（16）上，子卡（16）又使用针/孔技术安装在母板或存储卡（20）上。

    MULTICHIP MODULE
    90.
    发明申请
    MULTICHIP MODULE 审中-公开
    多芯片组件

    公开(公告)号：WO1998007193A1

    公开(公告)日：1998-02-19

    申请号：PCT/DE1997000856

    申请日：1997-04-26

    Applicant: ROBERT BOSCH GMBH ,  NAPIERALA, Dieter

    Inventor： ROBERT BOSCH GMBH

    IPC: H01L25/16

    CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/73 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/045 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A multichip module with a substrate which is equipped on its component side with an IC component and other electronic components interconnected by electroconducting lines. Electric leadthroughs extend from the component side to the bottom side of the substrate and are connected to solder contacts arranged on the bottom side of the substrate to electrically connect the multichip module to a subassembly support. In order to reduce the density of printed circuits on the top side of the multichip module and to reduce the number of required substrate layers, a support is arranged between each IC component and the substrate and comprises printed circuits and components connected by means of first connecting surfaces to the corresponding IC component and by means of second connecting surfaces to connections on the substrate.

    Abstract translation: 本发明涉及一种具有载体衬底一个多芯片模块，在被施加的IC器件和其他电子部件的元件侧它们经由导电连接彼此连接，以从组件侧电馈通被引导至载体基板的下侧和上底部 布置成用于与模块载体的多芯片模块的电连接被连接到焊接触点。 本发明提出了安排的支撑构件用于减小在多芯片模块的顶侧导体密度并降低相应的IC器件和载体衬底之间的载体基片，其具有导体轨迹和组件，与相应的其中第一焊盘的所需层的数量 IC设备经由第二连接表面与载体衬底连接相连。

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