Abstract:
The present invention relates to a compact substrate and a method for making the same. The compact substrate comprises at least one or a combination of a coreless structure, a double via structure and a compact double sided laser drilled (DSLD) via structure. The coreless structure has a first circuit comprising a plurality of first metal pads (151) and first metal lines (152). A first solder resist layer (16) is formed to cover parts of the first circuit and expose parts of the first metal pads (151) and parts of the first metal lines (152). Some Photo-Imageable Dielectric (PID) material can also be used to form the first solder resist layer (16). A second circuit comprising second metal pads (181) and second metal lines (182) are formed on the first solder resist layer (16). The second metal pads (181) cover the exposed first metal pads (151) and exposed first metal lines (152). The double via structure comprises a core substrate (19) having a first surface (191) and a second surface (192). Blind via holes (201) are formed on the first surface (191) of the core substrate (19). At least one through via holes (202) are formed on the base of the blind Via holes. The through via holes (202) are smaller in diameter as compared to that of the blind via holes (201). The through via holes (202) are located within the base of the blind via holes (201): The combination of the blind via holes (201) and the through via holes (202) forms the double via holes that penetrate through the core substrate (19). A compact double sided laser drilled (DSLD) via structure comprises a core substrate (19) having a first surface (191) and a second surface (192). DSLD via holes are formed and penetrate through the core substrate (19). Having the shape of two cones combined heads on, the DSLD via hole has its largest opening at its both ends and has its smallest opening somewhere near its middle portion.
Abstract:
L'invention concerne un procédé de fabrication d'un composant ou d'un module regroupant dans un boîtier prêt à monter sur circuit imprimé un ensemble de composants montés sur un substrat comprenant au moins une étape d'enrobage à l'aide d'un matériau isolant d'au moins une partie dudit module et au moins une étape de réalisation, sur une partie dudit matériau isolant, d'au moins une zone conductrice, de façon à définir des zones formant et/ou pouvant recevoir au moins une partie d'un composant et/ou au moins un élément d'interconnexion.
Abstract:
The present invention relates to a moulded module, comprising at least one conductor track (2), at least one outermost substrate layer (3, 4), which covers the conductor track on an outer side, at least one contact base (6), which is arranged on an outer side of the outermost substrate layer (3, 4) and provides an interfacial connection through the outermost substrate layer (3, 4) to the conductor track (2), at least one electronic component (7), which is in electrical contact on the contact base (6), and an encapsulating compound (11), which at least partially encloses the moulded component from the outside, wherein all the electronic components (7) are in electrical contact by means of contact bases (6).
Abstract:
In a method for fixing an electronic component (3) on a printed circuit board (2), and contact-connecting the electronic component (3) to the printed circuit board (2), the following steps are provided: - providing the printed circuit board (2) having a plurality of contact and connection pads (8), - providing the electronic component (3) having a number of contact and connection locations (5) corresponding to the plurality of contact and connection pads (8) of the printed circuit board (2), with a mutual spacing reduced in comparison with the spacing of the contact and connection pads (8) of the printed circuit board (2), and – arranging or forming at least one interlayer (4) for routing the contact and connection locations (5) of the electronic component (3) between the contact and connection pads (8) of the printed circuit board (2) and the contact and connection locations (5) of the electronic component (3). A method for producing an interlayer (4) for routing and a system having a printed circuit board (2) and an electronic component (3) using the interlayer (4) for routing are also provided.
Abstract:
A method of creating an active electrode (10) that includes providing a flex circuit (100) having an electrode (120) made of a first material and providin a first mask (200) over the flex circuit, the first mask having an offset region (305) and an opening (220) that exposes the electrode. The method also includes depositing a second material (300) over the offset region and the opening, the second material being different from the first material an providing a second mask (400) over the second material, the second mask havin a opening (405) over a portion of the second material that is over the offset region.