中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

625 records (took 0.022 seconds)

    발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법
    81.
    发明公开
    발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법 有权
    发光二极管封装，发光二极管封装模块及其制造方法，以及具有其的头灯模块及其控制方法

    公开(公告)号：KR1020110060074A

    公开(公告)日：2011-06-08

    申请号：KR1020090116550

    申请日：2009-11-30

    Applicant: 삼성전자주식회사

    Inventor： 이영진 ,  김형근

    IPC: H01L33/48 ,  H01L33/64

    CPC classification number: H01L33/647 ,  F21S41/147 ,  F21V29/677 ,  F21V29/89 ,  H01L2224/13 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10969

    Abstract: PURPOSE: A light emitting diode package, a light emitting diode package module including the same, a manufacturing method thereof, a head lamp module including the same, and a controlling method thereof are provided to improve heat dissipation by omitting an insulation layer between a package substrate and a heat sink. CONSTITUTION: A light emitting diode chip is mounted on one side of a package substrate. An electrode pad(126) is formed on the other side of the package substrate and is electrically connected to a light emitting diode chip. A heat radiation pad(125) is formed on the other side of the package substrate and is electrically insulated from the electrode pad. A circuit pattern is formed on the package substrate and is electrically connected to the light emitting diode chip. A via(128) is formed on the package substrate and electrically connects the circuit pattern to the electrode pad.

    Abstract translation: 目的：提供一种发光二极管封装，包括该发光二极管封装的发光二极管封装模块，其制造方法，包括该发光二极管封装的封装模块的头灯模块及其控制方法，以通过省略封装之间的绝缘层来改善散热 基板和散热片。 构成：发光二极管芯片安装在封装基板的一侧。 电极焊盘（126）形成在封装基板的另一侧，并与发光二极管芯片电连接。 散热垫（125）形成在封装基板的另一侧上并与电极焊盘电绝缘。 电路图案形成在封装衬底上并与发光二极管芯片电连接。 在封装衬底上形成通孔（128），并将电路图案电连接到电极焊盘。

    개량구조로 이루어진 철도 궤도회로 송신기 장치
    82.
    发明公开
    개량구조로 이루어진 철도 궤도회로 송신기 장치 有权
    改进结构的铁路电路的发电机

    公开(公告)号：KR1020070091257A

    公开(公告)日：2007-09-10

    申请号：KR1020070084111

    申请日：2007-08-21

    Applicant: 주식회사 혁신전공사

    Inventor： 김동준

    IPC: B61L25/02

    CPC classification number: B61L1/181 ,  B61L27/0005 ,  B61L2205/00 ,  H05K3/0061 ,  H05K3/328 ,  H05K5/02 ,  H05K7/20409 ,  H05K2201/10166 ,  H05K2201/10174

    Abstract: A transmitter of a railway circuit is provided to enhance an insulation property of inner components of the transmitter by replacing electric lines with PCB(Printed Circuit Board) lines. A transmitter(40) of a railway circuit includes an external case, a PCB(42), a diode fixing plate(44), a diode(46), and a transistor(60). Various boards and chips are embedded in the external case. The PCB is coupled with an inner portion of the external case. Circuit lines are printed at a rear surface of the PCB. The diode fixing plate is laminated on an upper surface of the PCB. Cathode terminals of the diodes are coupled with each other and are soldered with each other through a through-hole of the PCB. An anode terminal of the diode passes through the through-hole and is soldered on the PCB. The transistor is soldered, while the cathode and anode terminals penetrate the through-holes.

    Abstract translation: 提供铁路电路的发射器，通过用PCB（印刷电路板）线代替电线来提高发射机内部组件的绝缘性能。 铁路电路的发射机（40）包括外壳，PCB（42），二极管固定板（44），二极管（46）和晶体管（60）。 各种电路板和芯片都嵌在外壳中。 PCB与外壳的内部连接。 电路线印在PCB的背面。 二极管固定板层叠在PCB的上表面上。 二极管的阴极端子彼此耦合并且通过PCB的通孔彼此焊接。 二极管的阳极端子穿过通孔并焊接在PCB上。 晶体管被焊接，而阴极和阳极端子穿透通孔。

    일체형브로드사이드마이크로파커플러를가진인쇄회로기판
    84.
    发明公开
    일체형브로드사이드마이크로파커플러를가진인쇄회로기판 失效
    印刷电路板集成广泛的微波耦合器

    公开(公告)号：KR1020000016642A

    公开(公告)日：2000-03-25

    申请号：KR1019980710241

    申请日：1997-05-28

    Applicant: 더블유제이 커뮤니케이션즈, 인코포레이티드

    Inventor： 리,프랭크,시아오휴이

    IPC: H04B1/26 ,  H01P3/18 ,  H01P5/10 ,  H05K1/02

    CPC classification number: H05K1/0239 ,  H01P5/10 ,  H03D7/1408 ,  H03D9/0633 ,  H05K1/162 ,  H05K2201/09672 ,  H05K2201/10174

    Abstract: PURPOSE: A printed circuit board is to provide a component that is compatible with conventional printed wiring boards and is less costly to manufacture. CONSTITUTION: A printed wiring board comprises a center layer of dielectric material sandwiched between first and second layers of insulating material; a first embedded thin, narrow elongated conductor on one surface of the dielectric layer; a second embedded thin, narrow elongated conductor on the other surface of the dielectric layer opposite the first conductor whereby the first and second conductors are electrically coupled; and feed through vias extending from one surface of the printed wiring board to the conductors to provide electrical connections from the surface to the embedded coupled conductors. The balun is used to form components which are integrated into the multi-layer printed wiring board, such as a microwave mixer formed by two of the broadside coupled baluns embedded in a multi-layer printed wiring board and connected to a diode ring quad (57).

    Abstract translation: 目的：印刷电路板提供与传统印刷电路板兼容的部件，制造成本较低。 构成：印刷电路板包括夹在第一和第二绝缘材料层之间的电介质材料的中心层; 在介电层的一个表面上的第一嵌入式薄的细长导体; 在所述电介质层的与所述第一导体相对的另一表面上的第二嵌入式细窄细长导体，由此所述第一和第二导体电耦合; 并且通过从印刷电路板的一个表面延伸到导体的通孔，以提供从表面到嵌入的耦合导体的电连接。 平衡 - 不平衡转换器用于形成集成到多层印刷线路板中的组件，例如由嵌入在多层印刷线路板中并连接到二极管环四边形（57）的两个宽边耦合平衡 - 不平衡变换器形成的微波混频器 ）。

    회로 기판의 제조 방법 및 회로 기판
    87.
    发明公开
    회로 기판의 제조 방법 및 회로 기판 无效
    生产电路板和电路板的方法

    公开(公告)号：KR1020110013250A

    公开(公告)日：2011-02-09

    申请号：KR1020100070822

    申请日：2010-07-22

    Applicant: 소니 주식회사

    Inventor： 노모또아끼히로

    IPC: H05K3/40 ,  H01L51/05 ,  H01L21/336

    CPC classification number: H05K1/16 ,  H05K3/1275 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10174 ,  H05K2203/1476

    Abstract: PURPOSE: A method for manufacturing a circuit board and the circuit board are provided to prevent the deterioration of a connection material pattern by forming the connection material pattern after an upper wiring pattern is formed. CONSTITUTION: A lower wiring pattern(3) is formed on a substrate(1). An insulation layer(5) is formed on the substrate to cover the lower wiring pattern. An opening unit is formed on the insulation layer to expose the lower wiring pattern. The upper wiring pattern(7) is formed on the insulation layer. A connection material pattern(9) is formed on the sidewall of the opening unit of the insulation layer to connect the upper and lower wiring patterns. The connection material pattern is made of organic semiconductor materials.

    Abstract translation: 目的：提供一种制造电路板和电路板的方法，用于通过在形成上部布线图案之后形成连接材料图案来防止连接材料图案的劣化。 构成：在基板（1）上形成较低的布线图案（3）。 在基板上形成绝缘层（5）以覆盖下布线图案。 在绝缘层上形成开口单元以露出下布线图案。 上部布线图案（7）形成在绝缘层上。 连接材料图案（9）形成在绝缘层的开口单元的侧壁上，以连接上下布线图案。 连接材料图案由有机半导体材料制成。

    멀티밴드용 고주파 스위치 모듈
    88.
    发明公开
    멀티밴드용 고주파 스위치 모듈 有权
    用于多频带的无线电频率开关模块，将通用天线连接到发射和接收系统中的发射电路或接收系统中的不同通道

    公开(公告)号：KR1020040068522A

    公开(公告)日：2004-07-31

    申请号：KR1020040053285

    申请日：2004-07-09

    Applicant: 히다찌긴조꾸가부시끼가이사

    Inventor： 켐모치시게루 ,  와타나베미쯔히로 ,  타이히로유키 ,  타케타쯔요시 ,  타나카토시히코

    IPC: H04B1/38

    CPC classification number: H04B1/005 ,  H04B1/48 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/10015 ,  H05K2201/10174 ,  Y02P70/611

    Abstract: PURPOSE: A radio frequency switch module for multi-band is provided to reduce the size of a dual-band cellular phone by realizing a small chip in a laminated structure. CONSTITUTION: A band separation circuit(2) is formed of filter circuits each having an LC circuit, with one end connected with a common antenna. Switching circuits switch transmission circuits and receiving circuits of transmission and receiving systems, each including switching elements and transmission lines. A laminated body includes a plurality of dielectric layers, pattern electrodes printed on the dielectric layers, a terminal electrode formed on a surface of the laminated body, and a chip element packed on a top side of the laminated body. A transmission system has a low pass filtering function provided by low pass filter circuits. The low pass filter circuit includes pattern electrodes printed on the dielectric layers. The pattern electrodes of the band separation circuit(2) and the pattern electrodes of the low pass filter circuit are individually formed in a horizontal direction of the laminated body.

    Abstract translation: 目的：提供一种用于多频带的射频开关模块，通过实现层叠结构中的小芯片来减小双频蜂窝电话的尺寸。 构成：带分离电路（2）由各自具有LC电路的滤波器电路形成，其一端与公共天线连接。 开关电路切换发送和接收系统的传输电路和接收电路，每个包括开关元件和传输线。 层叠体包括多个电介质层，印刷在电介质层上的图形电极，形成在层叠体的表面上的端子电极和填充在层叠体的上侧的芯片元件。 传输系统具有由低通滤波器电路提供的低通滤波功能。 低通滤波器电路包括印刷在电介质层上的图形电极。 带分离电路（2）的图案电极和低通滤波器电路的图形电极分别在层叠体的水平方向上形成。

Patent Agency Ranking