Abstract:
A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205'). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.
Abstract:
A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205!). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.
Abstract:
Die Erfindung bezieht sich auf ein elektronisches Gerät, umfassend - eine Leiterplatte (10), die einen Satz von Eingangskontakten (IN/COM), einen Satz von Ausgangskontakten (OUT/COM) und eine zwischen den Eingangskontakten (IN/COM) einerseits und den Ausgangskontakten (OUT/COM) andererseits angeschlossene, elektrische Schaltung (18) aufweist, sowie - eine Steuereinheit. Die Erfindung zeichnet sich dadurch aus, die Steuereinheit mittels eines Testsignals, das sie in die elektrische Schaltung einspeist, eine Echtheitsüberprüfung der Leiterplatte durchführt, wobei die elektrische Schaltung (18) als ein passives, herkunftsspezifisches oder leiterplattenindividuelles Netzwerk mit wenigstens einem induktiv wirkenden Element ausgebildet ist, wobei als induktiv wirkendes Element ein Leiterdraht (201) zu einer Spule um einen Durchbruch (202) in der Leiterplatte (10) geschlungen ist, der in Einbaulage von einem ferromagnetischen Dorn des elektronischen Gerätes oder einem ferromagnetischen Befestigungsstift (203) durchsetzt ist, sodass der Induktivitätswert des induktiv wirkenden Elementes in Einbaulage verschieden ist von seinem Induktivitätswert im ausgebauten Zustand.
Abstract:
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated (66) until it is liquid, wherein the excess solder is wicked (68) vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted (70) from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.
Abstract:
A delivery system (100) for delivering a paste to an electronic substrate (130) includes a pressurized supply (141, 142) of via fill paste and a pressure head (200) attached to the pressurized supply (141, 142) of via fill paste. The pressure head (200) includes a main body (210) and a wear portion (220). Attached to the wear portion (220) is a gasket (230) positioned along one surface of the pressure head (200). The pressure head (200) also includes a flow dispersion regulator (310) which includes a feed tube positioned within the main body (210), the feed tube has a plurality of flow regulating openings (311). The flow regulating openings (311) in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings (311). Positioned between the main body (210) and the wear portion (220) is a flow equalization grid (500). The flow equalization grid (500) includes a multiplicity of openings (510).
Abstract:
A touch-screen device is disclosed having a touch-sensitive area that includes a plurality of patterned driver electrodes, each having a plurality of patterned conductive electrically connected driver micro-wires. An unpattemed conductive layer that is unpattemed in the touch-sensitive area is in electrical contact with the driver micro-wires of the driver electrodes. A plurality of patterned sensor electrodes each includes a plurality of patterned conductive electrically connected sensor micro-wires. A dielectric layer is located between the driver electrodes and the sensor electrodes.
Abstract:
본 발명의 일예에 따른 기판 갭 서포터(30)는, 절연체로 이루어진 육면체 형상의 몸체(31); 및 몸체(31)의 서로 대향하는 양측면에 설치되되 상기 양측면의 윗부분은 노출시키고 몸체(31)의 양측면 아랫부분은 가리도록 상기 양측면의 아랫부분에 설치되는 금속박(32a, 32b);을 포함하여 이루어지며, 몸체(31)의 밑면이 기판(210)에 부착되도록 설치되는 것을 특징으로 한다. 본 발명에 의하면, 갭 서포터를 자동화 공정을 통해서 만들 수 있으므로 그 크기를 정교하게 제어할 수 있고, 기판의 표면에 부착 설치되기 때문에 설치 높이차가 발생할 염려가 적고, 그 설치 또한 자동화 공정으로 할 수 있기 때문에 대량생산 공정에 적합하다.
Abstract:
A reliable and durable method of testing of printed circuit boards is presented. Test access components are placed in contact regions for providing electrical connectivity between test probes and the printed circuit board. In some cases, a test access component may be a surface mount resistor. The test access component may provide two points of contact for test probes to make electrical and mechanical contact with the printed circuit board. Test access components may also provide for increased durability of testing, allowing for a greater number of test contacts to be made between test probes and printed circuit boards than were previously possible.