公开(公告)号：US11711887B2

公开(公告)日：2023-07-25

申请号：US17619054

申请日：2020-05-28

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Shungo Hiratani ,  Shinsuke Okumi ,  Arinobu Nakamura

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K1/0209 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10553 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2201/10984

Abstract: An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

公开(公告)号：US09907157B2

公开(公告)日：2018-02-27

申请号：US14656237

申请日：2015-03-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Se Jong Kim ,  Sang Ho Choi ,  Jeong Hae Kim ,  Hyung Jun Cho

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0218 ,  H05K1/0243 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/1056 ,  H05K2203/0191

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

公开(公告)号：US09706645B2

公开(公告)日：2017-07-11

申请号：US14428358

申请日：2015-01-07

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Hu He

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/05

CPC classification number: H05K1/028 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10553

Abstract: A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.

公开(公告)号：US09202803B2

公开(公告)日：2015-12-01

申请号：US14229734

申请日：2014-03-28

Applicant: Chong Zhang ,  Stefanie M. Lotz ,  Qinglei Zhang ,  Sri Ranga Boyapati ,  Nikhil Sharma ,  Islam A. Salama

Inventor： Chong Zhang ,  Stefanie M. Lotz ,  Qinglei Zhang ,  Sri Ranga Boyapati ,  Nikhil Sharma ,  Islam A. Salama

IPC: H01L23/24 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2225/06572 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15192 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/305 ,  H05K3/4694 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10553

Abstract: An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers.

Abstract translation: 一种包括包括多层导电材料的封装衬底的装置，所述封装衬底包括空腔; 以及在所述空腔中的装置，其中所述多个导电材料层的最终层限定了与所述装置的接触点的触点。 一种包括包括多个导电层的封装衬底和设置在所述多个导电层中的一个和所述多个导电层的最终层之间的硅桥模的装置限定了与所述硅桥模的接触点的接触点; 以及耦合到多层导电层的最终层的接触点的逻辑裸片。

公开(公告)号：US09198277B2

公开(公告)日：2015-11-24

申请号：US13872515

申请日：2013-04-29

Applicant: Hitachi Metals, Ltd.

Inventor： Yoshinori Sunaga ,  Yoshiaki Ishigami ,  Hidetaka Kawauchi ,  Hidenori Yonezawa ,  Kinya Yamazaki

IPC: H05K7/20 ,  H05K1/02 ,  G06F1/20 ,  H04B1/036 ,  H05K1/14

CPC classification number: H05K1/0209 ,  G06F1/20 ,  H04B1/036 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10553

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract translation: 信号传输装置的高度尽可能地降低以维持或改善通信模块的冷却性能。 Ina信号传输装置设置有设置在基板上的通信模块和用于冷却通信模块的冷却机构，该冷却机构包括：传热板，包括与多个通信模块的底面重叠的第一区域，以及 热连接到底表面和不与通信模块的底表面重叠的第二区域; 以及设置在传热板的第二区域中的散热片。

公开(公告)号：US20140318758A1

公开(公告)日：2014-10-30

申请号：US14038837

申请日：2013-09-27

Applicant: Toyota Motor Engineering & Manufactruing North America, Inc.

Inventor： Ercan Mehmet Dede ,  Tsuyoshi Nomura ,  Paul Schmalenberg ,  Jae Seung Lee

IPC: F28F3/00

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K2201/0376 ,  H05K2201/09718 ,  H05K2201/09972 ,  H05K2201/10553

Abstract: Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and a thermal conductor at least partially embedded in the insulator substrate, a temperature-sensitive component coupled to the composite lamina, and a temperature-insensitive component coupled to the composite lamina and positioned distally from the temperature-sensitive component. The temperature-insensitive component produces heat during operation. The thermal conductor and the insulator substrate are arranged into a targeted heat transfer region proximate to the temperature-sensitive component and a bulk region proximate to the temperature-insensitive component. The targeted heat transfer region and the bulk region are in thermal continuity with one another.

Abstract translation: 根据本公开的热传递管理装置包括具有绝缘体衬底和至少部分地嵌入绝缘体衬底中的热导体的复合层，耦合到复合层的温度敏感组件和耦合到复合层的温度不敏感组件 复合层板，并远离温度敏感部件。 温度不敏感的部件在运行过程中产生热量。 热导体和绝缘体基板被布置成靠近温度敏感部件的目标传热区域和靠近温度不敏感部件的主体区域。 目标传热区域和体积区域彼此热连续。

公开(公告)号：US20140048326A1

公开(公告)日：2014-02-20

申请号：US13962991

申请日：2013-08-09

Applicant: Bridge Semiconductor Corporation

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K9/00

CPC classification number: H05K9/00 ,  H01L23/552 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0216 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4697 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/10674 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures.

Abstract translation: 多空腔布线板包括无芯基板，粘合剂和具有多个具有横向屏蔽侧壁的孔的加强件。 无芯基板覆盖加强件并且包括从加强件的孔暴露的电焊盘，作为封装在孔内的半导体器件的电触点。 加强件的开口侧壁可以用作孔内的半导体器件的有效横向电磁屏蔽。

公开(公告)号：US08432034B2

公开(公告)日：2013-04-30

申请号：US13115545

申请日：2011-05-25

Applicant: Eric Vance Kline ,  Michael Robert Rasmussen ,  Arvind Kumar Sinha

Inventor： Eric Vance Kline ,  Michael Robert Rasmussen ,  Arvind Kumar Sinha

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H01L23/498 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10155 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/10553 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.

Abstract translation: 一个实施例涉及一种IC安装组件，其包括具有第一平面表面的IC器件，其中多个导电第一端子位于第一表面。 组件还包括具有与第一表面紧密隔开的第二平坦表面的IC器件安装平台，其中多个导电第二端子位于第二表面处，每个第二端子对应于第一端子之一。 焊料元件在每个第一端子和其对应的第二端子之间延伸，并且约束元件可固定地接合到第二表面，其中约束元件具有选择性地小于第二表面处的安装平台的CTE的CTE。 约束元件设置有多个孔或孔，并且每个孔由在第一端子和其相应的第二端子之间延伸的焊料元件横越。

公开(公告)号：US20120299201A1

公开(公告)日：2012-11-29

申请号：US13115545

申请日：2011-05-25

Applicant: Eric V. Kline ,  Michael R. Rasmussen ,  Arvind K. Sinha

Inventor： Eric V. Kline ,  Michael R. Rasmussen ,  Arvind K. Sinha

IPC: H01L23/48 ,  H01L21/60 ,  H01L21/58

CPC classification number: H01L23/498 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10155 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/10553 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first surface. The assembly further comprises an IC device mounting platform having a second planar surface in closely spaced relationship with the first surface, wherein multiple electrically conductive second terminals are located at the second surface, each second terminal corresponding to one of the first terminals. A solder element extends between each first terminal and its corresponding second terminal, and a constraining element is fixably joined to the second surface, wherein the constraining element has a CTE which is selectively less than the CTE of the mounting platform at the second surface. The constraining element is provided with a number of holes or apertures, and each hole is traversed by a solder element that extends between a first terminal and its corresponding second terminal.

Abstract translation: 一个实施例涉及一种IC安装组件，其包括具有第一平面表面的IC器件，其中多个导电第一端子位于第一表面。 组件还包括具有与第一表面紧密隔开的第二平坦表面的IC器件安装平台，其中多个导电第二端子位于第二表面处，每个第二端子对应于第一端子之一。 焊料元件在每个第一端子和其对应的第二端子之间延伸，并且约束元件可固定地接合到第二表面，其中约束元件具有选择性地小于第二表面处的安装平台的CTE的CTE。 约束元件设置有多个孔或孔，并且每个孔由在第一端子和其相应的第二端子之间延伸的焊料元件横越。

公开(公告)号：US08070313B2

公开(公告)日：2011-12-06

申请号：US12893373

申请日：2010-09-29

Applicant: Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

Inventor： Chuan-Ho Cheng ,  Chih-Kang Wu ,  Kuo-Cheng Huang ,  Shih-Che Fu

IPC: H01R33/02 ,  G09F13/04

CPC classification number: H05K3/301 ,  G02F1/133604 ,  G02F1/133608 ,  H01R12/718 ,  H01R33/0818 ,  H05K2201/10113 ,  H05K2201/10295 ,  H05K2201/10553

Abstract: A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.

Abstract translation: 背光结构包括框架，电路板和连接器。 框架有一个开口。 电路板位于框架下方并具有通孔，其中通孔与开口对准。 连接器穿过开口并且通孔从框架的表面突出并且电连接到电路板。