公开(公告)号：US08884167B2

公开(公告)日：2014-11-11

申请号：US13346085

申请日：2012-01-09

Applicant: Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

Inventor： Kazuya Miyasaka ,  Kouji Kobayashi ,  Akihito Fukuzawa

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A printed circuit board unit includes: a printed circuit board including a through hole including first and second inner surfaces opposite to each other; a terminal pin including an insertion portion inserted into the through hole; solder filled into the through hole, and joining the printed circuit board with the terminal pin, wherein the insertion portion includes a base portion abutting the first inner surface, and a protruding portion including: a projection surface projecting from the base portion to the second inner surface and abutting the second inner surface; and a recess surface located at a rear side of the projection surface and spaced apart from the first inner surface, and a length of the protruding portion in a thickness direction of the printed circuit board is greater than a thickness of the printed circuit board.

Abstract translation: 印刷电路板单元包括：印刷电路板，包括具有彼此相对的第一和第二内表面的通孔; 终端销，其包括插入到所述通孔中的插入部; 焊料填充到通孔中，并且将印刷电路板与端子销接合，其中插入部分包括抵靠第一内表面的基部，以及突出部分，包括：从基部突出到第二内部的突出表面 表面并邻接第二内表面; 以及位于所述突起表面的后侧并与所述第一内表面间隔开的凹部表面，并且所述突出部分在所述印刷电路板的厚度方向上的长度大于所述印刷电路板的厚度。

公开(公告)号：US20110299250A1

公开(公告)日：2011-12-08

申请号：US13152419

申请日：2011-06-03

Applicant: Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K7/20 ,  H05K3/10

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

Abstract translation: 布线基板11A包括高散热基板21，其具有高导热层，其中前表面和后表面中的至少一个是用于各种部件的安装表面21a; 连接端子31，其从高散热基板21延伸并且在垂直于高散热基板21的表面的方向上弯曲; 以及一体地安装在连接端子31上的散热片部35。

公开(公告)号：US08004856B2

公开(公告)日：2011-08-23

申请号：US12711200

申请日：2010-02-23

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/14

CPC classification number: A41D27/085 ,  A43B1/0036 ,  H05K3/325 ,  H05K2201/10393 ,  H05K2201/10787 ,  H05K2203/0173

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US07946861B2

公开(公告)日：2011-05-24

申请号：US12449283

申请日：2007-02-02

Applicant: Reinhard Sander

Inventor： Reinhard Sander

IPC: H01R12/00

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10871

Abstract: The invention relates to contact pins for providing an electrical connection between electronic devices. In one aspect the pin is adapted to be inserted into a hole of a circuit carrier and the pin comprises at least three portions; namely a contact termination portion, an electrical contact portion and a mechanical fastening portion. The mechanical fastening portion preferably allows a fastening of the contact pin without any soldering.

Abstract translation: 本发明涉及用于在电子设备之间提供电连接的接触针。 在一个方面，所述销适于插入电路载体的孔中，并且所述销包括至少三个部分; 即接触终端部分，电接触部分和机械紧固部分。 机械紧固部分优选地允许接触针的紧固而没有任何焊接。

公开(公告)号：US20110068460A1

公开(公告)日：2011-03-24

申请号：US12888174

申请日：2010-09-22

Applicant: Felix SCHINNER ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

Inventor： Felix SCHINNER ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

IPC: H01L23/10

CPC classification number: H05K3/3442 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/202 ,  H05K2201/10636 ,  H05K2201/10787 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract translation: 本发明涉及具有半导体元件，特别是半导体芯片的电子部件，以及至少一个SMD元件，具有支撑平台的芯片载体和连接引线。 由此通过芯片连接电连接到连接引线的键指的半导体部件安装在支撑平台上，并且SMD部件通过布置在其上的接触表面将支撑平台连接到连接引线，壳体包围半导体 组件，SMD组件，并且至少部分地是芯片载体。 在SMD部件的区域中的支撑平台和连接引线被成型以形成阻挡层，使得自由流动的材料从连接到芯片载体的SMD部件的接触表面流到支撑平台上， 阻止连接引线。

公开(公告)号：US07677905B2

公开(公告)日：2010-03-16

申请号：US11979968

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

公开(公告)号：US07578681B2

公开(公告)日：2009-08-25

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

公开(公告)号：US07563112B2

公开(公告)日：2009-07-21

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US20080253096A1

公开(公告)日：2008-10-16

申请号：US12155947

申请日：2008-06-12

Applicant: Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

Inventor： Atsushi Ito ,  Takayoshi Honda ,  Hidehiro Mikura ,  Tadashi Tsuruzawa ,  Takuya Sakuta

IPC: H05K7/00

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract translation: 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。

公开(公告)号：US20060192273A1

公开(公告)日：2006-08-31

申请号：US11066875

申请日：2005-02-25

Applicant: Bernhard Lange ,  William Boyd

Inventor： Bernhard Lange ,  William Boyd

IPC: H01L23/48

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

Abstract translation: 集成电路（IC）封装100包括耦合到IC的IC 102和引线104。 每个引线具有被配置为耦合到集成电路的第一端106和被配置为穿过延伸穿过安装板112的多个安装孔110中的一个的第二端108。 引线包括至少一个定位引线114，定位引线114包括止动件118，该止动件118是定位引线的连续部分，并且具有大于多个安装孔中的第一孔124的直径122的横向尺寸120。 引线还包括至少一个非定位引线116，其具有连续均匀成形的主体130，其横向尺寸132小于多个安装孔中的第二孔136的直径134。 停止限制非定位导线通过第二个孔的延伸。