Abstract:
A unit for preventing drying of a substrate, a substrate cleaning apparatus having the same and a substrate cleaning method are provided to prevent a substrate from being dried in a substrate transfer process by spraying deionized water onto the substrate using a spraying part. A unit for preventing drying of a substrate includes a substrate transfer arm, a spraying part, a container, and a driving part. The substrate transfer arm(110) is installed between at least two baths to transfer a substrate from one bath to the other baths. The spraying part(120) is installed over the substrate to spray deionized water onto the substrate in a substrate transfer process. The container(130) is installed under the substrate to collect deionized water sprayed from the spraying part. The driving part(140) is used for controlling properly the position of the container.
Abstract:
반도체 소자의 패턴형성용 마스크의 표면에 잔류하는 이온을 분석하는 이온 분석 방법 및 장치를 개시한다. 이온 분석 방법은 먼저, 챔버 내부의 가열 용기내에 일정량의 용매를 채워준다. 이어서, 상기 가열 용기내에 채워진 상기 용매에 마스크를 담근다. 상기 챔버 내부로 개스를 공급하여 상기 챔버의 내부압력을 일정 압력까지 상승시켜 준다. 상기 가열 용기내의 상기 용매를 일정 온도로 일정시간 가열시켜 상기 마스크의 표면으로부터 이온을 분리시켜 준다. 상기 용매를 포집하여 상기 이온을 분석한다.
Abstract:
PURPOSE: A method and an apparatus for cleaning a photo mask using a blowing operation is provided to expand the life expectancy of the photo mask by preventing the change of a critical dimension due to the loss of chromium. CONSTITUTION: One side of a photo mask(1) is divided into a first region(10) and a second region(20). A main pattern(15) to be protected from a cleaning solution is formed in the first region. A material(25) to be eliminated using the cleaning solution is in the second region. The cleaning solution is sprayed from the inside to the outside of the second region in order to eliminate the material. A gas is blown from the first region to the second region in order to protect the pattern from the cleaning solution.
Abstract:
위상 쉬프트 마스크의 수리 방법을 제공한다. 이 방법은 위상 쉬프트 패턴들이 형성된 위상 쉬프트 마스크에서, 상기 위상 쉬프트 패턴들의 상부면 및 측면을 노출시키고, 상기 노출된 위상 쉬프트 패턴들의 표면에만 선택적으로 보호막을 형성한 후, 상기 보호막이 형성된 위상 쉬프트 마스크를 세정하는 단계를 포함한다.
Abstract:
PURPOSE: A photo-mask and a method for manufacturing the same are provided to improve the reliability of a semiconductor device manufacturing process by being repeatedly used without the line width change of patterns. CONSTITUTION: A method for manufacturing a photo-mask includes the following: a light shielding pattern(115) and a reflection preventive film pattern(125) are successively stacked on a transparent substrate(100). The light shielding pattern is based on at least one of chrome(Cr), aluminum(Al), rubidium(Ru), tantalum(Ta), tantalum boron oxide(TaBO), and tantalum boron nitride(TaBN). The sidewall of the light shielding pattern is oxidized and nitrided to form a protective film pattern(135) based on plasma treatment. The plasma treatment uses oxygen gas and nitrogen gas as reactive gas. The mixed ratio of the oxygen gas and the nitrogen gas is in a range between 5 and 8. The temperature of a chamber for the plasma treatment is kept in a range between 200 and 400 degrees Celsius.
Abstract:
A composition for cleaning a phase shift mask is provided to effectively remove sulfate ion inducing haze and to reduce phase change and transmittance change generated with damage of a phase shift layer. A composition for cleaning a phase shift mask comprises ammonium salts of organic acids of which the ionization constant(Kb) of ammonium salts is greater than the ionization constant(Ka) of organic acid ions; hydrogen peroxide; and water. A method for cleaning a phase shift mask comprises the steps of: (S10) performing a first cleaning process on a substrate formed with the phase shifting mask by using a first cleaning solution including an sulfuric acid to remove photoresist and etching byproducts; and (S40) performing a second cleaning process by using the composition for cleaning the phase shift mask to remove sulfate ion remaining on the substrate without the damage of the phase shifting mask.
Abstract:
위상 쉬프트 마스크의 수리 방법을 제공한다. 이 방법은 위상 쉬프트 패턴들이 형성된 위상 쉬프트 마스크에서, 상기 위상 쉬프트 패턴들의 상부면 및 측면을 노출시키고, 상기 노출된 위상 쉬프트 패턴들의 표면에만 선택적으로 보호막을 형성한 후, 상기 보호막이 형성된 위상 쉬프트 마스크를 세정하는 단계를 포함한다.
Abstract:
PURPOSE: An ultraviolet ray-based washing apparatus and a washing method using the same are provided to reduce the defect generation of a wafer by preventing the performance reduction of a photo mask. CONSTITUTION: An ultraviolet ray-based washing apparatus includes the following: a substrate with a photo-mask is loaded in an operational chamber(S110); a reflector is arranged at the lower sides of ultraviolet ray lamps in the operation chamber to correspond to the pattern region of the photo-mask(S120); the ultraviolet ray lamps operate to irradiate a surface of remaining organic materials around the photo-mask with ultraviolet rays(S130); the ultraviolet ray lamps are turned off(S140); fluid is supplied to the substrate to be washed(S150); and the substrate is unloaded from the operational chamber(S170). [Reference numerals] (AA) Start; (BB) End; (S110) Loading a wafer with a photo-mask in an operational chamber; (S120) Arranging a reflector at the lower sides of UV lamps in the operational chamber to correspond to the pattern region of the photo-mask; (S130) Operating the UV lamps to activate the surface of the wafer with remaining organic materials; (S140) Turning off the UV lamps; (S150) Supplying treatment fluid on the wafer and washing the wafer; (S160) Stopping supplying the fluid for washing the wafer; (S170) Unloading the wafer from the operational chamber