Abstract:
A method of determining a stochastic metric, the method comprising: obtaining a trained model having been trained to correlate training optical metrology data to training stochastic metric data, wherein the training optical metrology data comprises a plurality of measurement signals relating to distributions of an intensity related parameter across a zero or higher order of diffraction of radiation scattered from a plurality of training structures, and the training stochastic metric data comprises stochastic metric values relating to said plurality of training structures, wherein the plurality of training structures have been formed with a variation in one or more dimensions on which said stochastic metric is dependent; obtaining optical metrology data comprising a distribution of the intensity related parameter across a zero or higher order of diffraction of radiation scattered from a structure; and using the trained model to infer a value of the stochastic metric from the optical metrology data.
Abstract:
Disclosed is a method of aligning a pair of complementary diffraction patterns comprising a first complementary diffraction pattern and a second complementary diffraction pattern, the pair of complementary diffraction patterns being obtained from performance of a metrology process on a structure formed by a lithographic process. The method comprises performing at least a fine alignment stage to align the pair of complementary diffraction patterns. The alignment stage comprises: interpolating measured values of the first complementary diffraction pattern over at least a portion of the detector area; and minimizing a residual between measured values in the second complementary diffraction pattern and corresponding interpolated values from the interpolation of the first complementary diffraction pattern, by one or both of translation and rotation of the second complementary diffraction pattern. Also disclosed is a method of measuring a parameter of interest of a structure using the aligning method, and an associated metrology apparatus.
Abstract:
Disclosed is a method of measuring a parameter of a lithographic process, and associated inspection apparatus. The method comprises measuring at least two target structures on a substrate using a plurality of different illumination conditions, the target structures having deliberate overlay biases; to obtain for each target structure an asymmetry measurement representing an overall asymmetry that includes contributions due to (i) the deliberate overlay biases, (ii) an overlay error during forming of the target structure and (iii) any feature asymmetry. A regression analysis is performed on the asymmetry measurement data by fitting a linear regression model to a planar representation of asymmetry measurements for one target structure against asymmetry measurements for another target structure, the linear regression model not necessarily being fitted through an origin of the planar representation. The overlay error can then be determined from a gradient described by the linear regression model.
Abstract:
Disclosed is a method of metrology. The method comprises illuminating a radiation onto a substrate; obtaining measurement data relating to at least one measurement of each of one or more structures on the substrate; using a Fourier-related transform to transform the measurement data into a transformed measurement data; and extracting a feature of the substrate from the transformed measurement data, or eliminating an impact of a nuisance parameter.
Abstract:
A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the structure having diffractive properties, the apparatus comprising: focusing optics configured to focus illumination radiation comprising a plurality of wavelengths onto the structure; a first detector configured to detect at least part of the illumination radiation which has been diffracted from the structure; and additional optics configured to produce, on at least a portion of the first detector, a wavelength-dependent spatial distribution of different wavelengths of the illumination radiation which has been diffracted from the structure, wherein the first detector is arranged to detect at least a non-zero diffraction order of the illumination radiation which has been diffracted from the structure.
Abstract:
Disclosed is a method of performing a measurement in an inspection apparatus, and an associated inspection apparatus and HHG source. The method comprises configuring one or more controllable characteristics of at least one driving laser pulse of a high harmonic generation radiation source to control the output emission spectrum of illumination radiation provided by the high harmonic generation radiation source; and illuminating a target structure with said illuminating radiation. The method may comprise configuring the driving laser pulse so that the output emission spectrum comprises a plurality of discrete harmonic peaks. Alternatively the method may comprise using a plurality of driving laser pulses of different wavelengths such that the output emission spectrum is substantially monochromatic.
Abstract:
Disclosed is a method of determining at least one parameter of interest relating to a structure formed in at least one respective layer on a substrate, the method comprising: obtaining measured metrology data relating to a measurement of said structure; obtaining a model of said structure, said model describing said structure in terms of a plurality of model parameters; performing one or more first optimization steps to determine one or more vertical positional parameters of said model parameters, said one or more vertical positional parameters relating to a direction perpendicular to a substrate plane defined by a surface or interface of said substrate; and performing one or more second optimization steps subsequently to performance of said one or more first optimization steps, to determine one or more other model parameters of said plurality of model parameters.
Abstract:
Disclosed is a method of aligning a pair of complementary diffraction patterns comprising a first complementary diffraction pattern and a second complementary diffraction pattern, the pair of complementary diffraction patterns being obtained from performance of a metrology process on a structure formed by a lithographic process. The method comprises performing at least a fine alignment stage to align the pair of complementary diffraction patterns. The alignment stage comprises: interpolating measured values of the first complementary diffraction pattern over at least a portion of the detector area; and minimizing a residual between measured values in the second complementary diffraction pattern and corresponding interpolated values from the interpolation of the first complementary diffraction pattern, by one or both of translation and rotation of the second complementary diffraction pattern. Also disclosed is a method of measuring a parameter of interest of a structure using the aligning method, and an associated metrology apparatus.
Abstract:
A metrology apparatus for determining a characteristic of interest of a structure on a substrate, the structure having diffractive properties, the apparatus comprising: focusing optics configured to focus illumination radiation comprising a plurality of wavelengths onto the structure; a first detector configured to detect at least part of the illumination radiation which has been diffracted from the structure; and additional optics configured to produce, on at least a portion of the first detector, a wavelength-dependent spatial distribution of different wavelengths of the illumination radiation which has been diffracted from the structure, wherein the first detector is arranged to detect at least a non-zero diffraction order of the illumination radiation which has been diffracted from the structure.