COMPUTATIONAL METROLOGY
    7.
    发明公开

    公开(公告)号:EP3441819A1

    公开(公告)日:2019-02-13

    申请号:EP17185116.5

    申请日:2017-08-07

    Abstract: A method, includes obtaining, for each particular feature of a plurality of features of a device pattern of a substrate being created using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a measurement target for the substrate and the particular feature; and based on the relation and measured values of the parameter from the metrology target, generating a distribution of the parameter across at least part of the substrate for each of the features, the distributions for use in design, control or modification of the patterning process.

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