METHOD OF DETERMINING A CORRECTION STRATEGY IN A SEMICONDUCTOR MANUFACTURE PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:WO2022012875A1

    公开(公告)日:2022-01-20

    申请号:PCT/EP2021/066836

    申请日:2021-06-21

    Abstract: A method of determining a correction strategy in a semiconductor manufacture process is disclosed. The method comprises obtaining functional indicator data relating to functional indicators associated with one or more process parameters of each of a plurality of different control regimes of the semiconductor manufacture process and/or a tool associated with said semiconductor manufacture process and using a trained model to determine for which of said control regimes should a correction be determined so as to at improve performance of said semiconductor manufacture process according to at least one quality metric being representative of a quality of the semiconductor manufacture process. The correction is then calculated for the determined control regime(s).

    METHOD FOR DECISION MAKING IN A SEMICONDUCTOR MANUFACTURING PROCESS

    公开(公告)号:EP3693795A1

    公开(公告)日:2020-08-12

    申请号:EP19155660.4

    申请日:2019-02-06

    Inventor: HUBAUX, Arnaud

    Abstract: Described is a method and associated computer program and apparatuses for method for making a decision within a manufacturing process. The method comprises obtaining scanner data relating to one or more parameters of a lithographic exposure step of the manufacturing process and applying a decision model. The decision model outputs a value for each of one or more categorical indicators based on the scanner data, each categorical indicator being indicative of a quality of the manufacturing process. An action is decided upon (e.g., to inspect a substrate as a candidate for rework) based on a value of the categorical indicator.

    SYSTEMS AND METHODS FOR ADJUSTING PREDICTION MODELS BETWEEN FACILITY LOCATIONS

    公开(公告)号:EP3742229A1

    公开(公告)日:2020-11-25

    申请号:EP19175717.8

    申请日:2019-05-21

    Abstract: Described herein is a method for adjusting a prediction model used for enhancing a lithography process. The method comprises providing (400) an initial prediction model (401) comprising a plurality of model parameters to one or more remote locations (404). The method comprises training (420) the initial prediction model with local data (406) at the one or more remote locations (404) such that at least one model parameter (W) is updated (450,454,454). The method comprises receiving (460) the at least one updated model parameter from each of the one or more remote locations where the initial prediction model was trained. The method comprises determining aggregated updated model parameters based on the at least one updated model parameter received from the one or more remote locations. The method comprises adjusting the initial prediction model based on the aggregated updated model parameters. The adjusted prediction model is operable to enhance the lithography process.

    CLASSIFYING PRODUCT UNITS
    9.
    发明公开

    公开(公告)号:EP4343472A1

    公开(公告)日:2024-03-27

    申请号:EP22196685.6

    申请日:2022-09-20

    Abstract: One embodiment relates to a method of classifying product units subject to a process performed by an apparatus, the method comprising: receiving KPI data, the KPI data associated with a plurality of components of the apparatus and comprising data associated with a plurality of KPIs; clustering the KPI data to identify a plurality of clusters; analyzing the plurality of clusters to identify a plurality of failure modes associated with the apparatus, for each identified failure mode assigning a threshold to each KPI associated with the failure mode; and for each of the plurality of product units: determining the likelihood of each of the plurality of failure modes based on KPI data of the product unit and the thresholds assigned to each KPI associated with one of the plurality of failure modes; and performing a classification based on the likelihoods of each of the plurality of failure modes.

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