System for non contact cleaning, lithography device, and device manufacturing method
    3.
    发明专利
    System for non contact cleaning, lithography device, and device manufacturing method 有权
    非接触式清洁系统,光刻设备和器件制造方法

    公开(公告)号:JP2010087505A

    公开(公告)日:2010-04-15

    申请号:JP2009213876

    申请日:2009-09-16

    CPC classification number: G03F7/70925

    Abstract: PROBLEM TO BE SOLVED: To provide a system for performing non contact cleaning of the surface of an object, a lithography device including the system, and a device manufacturing method. SOLUTION: The system may include: a He plasma source contained in a chamber; and a control unit configured so as to correct plasma parameters such as an electronic energy distribution of plasma when used, in order to increase formation of a He metastable atom without correcting operation parameters of the plasma source. The control unit may include an electrical bias unit configured so as to apply a positive bias voltage to the object to pull in a free electron from the plasma. The system is previously mixed with He, or may include a supply source of supplement gas to be supplied from a further gas source. The supplement gas may be selected based on previous knowledge of types of a particle to be expected to be present on the surface of the object. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于对物体的表面进行非接触清洁的系统,包括该系统的光刻设备和设备制造方法。 解决方案:系统可以包括:包含在腔室中的He等离子体源; 以及控制单元,被配置为校正等离子体参数,例如当使用时等离子体的电子能量分布,以便增加He亚稳态原子的形成,而不修正等离子体源的操作参数。 控制单元可以包括电偏置单元,其被配置为向对象施加正偏压以从等离子体中拉出自由电子。 该系统预先与He混合,或者可以包括从另外的气源供应的补充气体的供应源。 补充气体可以基于预期存在于物体表面上的颗粒的类型的先前知识来选择。 版权所有(C)2010,JPO&INPIT

    LITHOGRAPHIC APPARATUS AND METHOD

    公开(公告)号:SG186072A1

    公开(公告)日:2013-01-30

    申请号:SG2012086955

    申请日:2011-03-17

    Abstract: A lithographic apparatus includes a radiation source configured to produce a radiation beam, and a support configured to support a patterning device. The patterning device is configured to impart the radiation beam with a pattern to form a patterned radiation beam. A chamber is located between the radiation source and patterning device. The chamber contains at least one optical component configured to reflect the radiation beam, and is configured to permit radiation from the radiation source to pass therethrough. A membrane (44) is configured to permit the passage of the radiation beam, and to prevent the passage of contamination particles (54) through the membrane. A particle trapping structure (52) is configured to permit gas to flow along an indirect path from inside the chamber to outside the chamber. The indirect path is configured to substantially prevent the passage of contamination particles (58) from inside the chamber to outside the chamber.

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