Abstract:
A plasma electron flood system, comprising a housing configured to contain a gas, and comprising an elongated extraction slit, and a cathode and a plurality of anodes residing therein and wherein the elongated extraction slit is in direct communication with an ion implanter, wherein the cathode emits electrons that are drawn to the plurality of anodes through a potential difference therebetween, wherein the electrons are released through the elongated extraction slit as an electron band for use in neutralizing a ribbon ion beam traveling within the ion implanter.
Abstract:
A parallelizing component (439) of an ion implantation system (410) comprises two angled dipole magnets (439a, 439b) that mirror one another and serve to bend an ion beam (424) traversing therethrough to have a substantially "s" shape. This s bend serves to filter out contaminants of the beam, while the dipoles also parallelize the beam to facilitate uniform implant properties across the wafer (430), such as implant angle, for example. Additionally, a " deceleration stage (457) is included toward the end of the implantation system so that the energy of the beam can be kept relatively high throughout the beamlihe to mitigate beam blowup.
Abstract:
One embodiment of the invention relates to a method for adjusting the ribbon beam flux of a scanned ion beam. In this method, an ion beam is scanned at a scan rate, and a plurality of dynamic beam profiles are measured as the ion beam is scanned. A corrected scan rate is calculated based on the plurality of measured dynamic beam profiles of the scanned beam. The ion beam is scanned at the corrected scan rate to produce a corrected ribbon ion beam. Other methods and systems are also disclosed.
Abstract:
One or more aspects of the present invention pertain to a measurement component that facilitates determining a relative orientation between an ion beam and a workpiece. The measurement component is sensitive to ion radiation and allows a relative orientation between the measurement component and the ion beam to be accurately determined by moving the measurement component relative to the ion beam. The measurement component is oriented at a known relationship relative to the workpiece so that a relative orientation between the workpiece and beam can be established. Knowing the relative orientation between the ion beam and workpiece allows the workpiece to be oriented to a specific angle relative to the measured beam angle for more accurate and precise doping of the workpiece, which enhances semiconductor fabrication.
Abstract:
A modular ion source and extraction apparatus 200 comprises an ion source chamber 202 selectively electrically coupled to a voltage potential, wherein the ion source chamber comprises an extraction aperture 203. An extraction electrode 206 is positioned proximate to the extraction aperture of the ion source chamber, wherein the extraction electrode is configured to extract ions from the ion source chamber, and may be electrically grounded. One or more linkages 208 operably couple to the ion source chamber, and one or more insulators 210 couple the extraction electrode to the respective one or more linkages, wherein the one or more insulators electrically insulate the respective one or more linkages from the extraction electrode, therein electrically insulating the extraction electrode from the ion source chamber. One or more actuators 212; 218, 220 operably couple the one or more linkages to the ion source chamber, wherein the one or more actuators are configured to translate the one or more linkages with respect to the ion source chamber, therein translating the extraction electrode in one or more axes,
Abstract:
Some aspects of the present invention facilitate ion implantation by using a magnetic beam scanner (106, 300) that includes first and second magnetic elements having a beam path region therebetween. One or more magnetic flux compression elements (140a, b, 302, 304) are disposed proximate to the beam path region and between the first and second magnetic elements. During operation, the first and magnetic elements cooperatively generate an oscillatory time-varying magnetic field in the beam path region to scan an ion beam back and forth in time. The one or more magnetic flux compression elements compress the magnetic flux provided by the first and second magnetic elements, thereby reducing the amount of power required to magnetically scan the beam back and forth (relative to previous implementations). Other scanners, systems, and methods are also disclosed.
Abstract:
An ion beam angle detection apparatus (440), comprising a linear drive assembly (460) fixedly attached to a moveable profiler assembly (450), wherein the profiler assembly comprises, a profiler having a profiler aperture (454) formed within a profiler top plate (455) and a profiler sensor assembly, a moveable angle mask assembly (446) comprising a moveable angle mask with a mask aperture (448), wherein the angle mask assembly is non-fixedly attached to the profiler assembly, the mask aperture is movable relative to the profiler aperture by energizing an mask linear drive (464) fixedly attached to the profiler assembly and the profiler aperture is movable through a length greater than the elongated length of the ion beam (456).
Abstract:
A steering element is included in an ion implantation system to direct or "steer" an ion beam (624) to a scan vertex (651) of a scanning element (636) downstream of the steering element. In this manner, the scan vertex of the scanning element coincides with the focal point of a parallelizing element (630) downstream of the scanning element. This allows the beam to emerge from the parallelizing element at an expected angle so that ions can be implanted in a desired manner into a workpiece located downstream of the parallelizing element.
Abstract:
A plasma generator for space charge neutralization of an ion beam is disclosed and resides within an ion implantation system operable to generate an ion beam and direct the ion beam along a beamline path. The plasma generator comprises an electric field generation system operable to generate an electric field in a portion of the beamline path, and a magnetic field generation system operable to generate a magnetic field in the portion of the beamline path, wherein the magnetic field is perpendicular to the electric field. The plasma generator further comprises a gas source operable to introduce a gas in a region occupied by the electric field and the magnetic field. Electrons in the region move in the region due to the electric field and the magnetic field, respectively, and at least some of the electrons collide with the gas in the region to ionize a portion of the gas, thereby generating a plasma in the region.
Abstract:
A system and method are provided for implanting ions at low energies into a workpiece (109). An ion source configured to generate an ion beam is provided, wherein a mass resolving magnet (102) is configured to mass resolve the ion beam. The ion beam may be a ribbon beam or a scanned spot ion beam. A mass resolving aperture (103) positioned downstream of the mass resolving magnet filters undesirable species from the ion beam. A combined electrostatic lens (106) system is positioned downstream of the mass analyzer, wherein a path of the ion beam is deflected and contaminants are generally filtered out of the ion beam, while concurrently decelerating and parallelizing the ion beam. A workpiece scanning system is further positioned downstream of the combined electrostatic lens system, and is configured to selectively translate a workpiece in one or more directions through the ion beam, therein implanting ions into the workpiece.