Abstract:
A positive resist composition comprising: a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group, a repeating unit containing a first group selected from groups represented by the formulae (pI) to (pV) as defined herein and a repeating unit containing a second group selected from groups represented by the formulae (pI) to (pV) as defined herein which is different from the first group; a compound which generates an acid upon irradiation of an actinic ray or a radiation; and a solvent.
Abstract:
A positive resist composition comprising: a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group, a repeating unit containing a first group selected from groups represented by the formulae (pI) to (pV) as defined herein and a repeating unit containing a second group selected from groups represented by the formulae (pI) to (pV) as defined herein which is different from the first group; a compound which generates an acid upon irradiation of an actinic ray or a radiation; and a solvent.
Abstract:
A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d): Group (a): an alkylene glycol monoalkyl ether, Group (b): an alkylene glycol monoalkyl ether carboxylate, Group (c): a linear ketone, a branched chain ketone, a cyclic ketone, a lactone and an alkylene carbonate, and Group (d): a lactic acid ester, an acetic acid ester and an alkoxypropionic acid ester.
Abstract:
A pattern forming method includes: (a) forming a first film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition (I) containing a resin of which solubility in a developer containing an organic solvent decreases due to polarity increased by an action of an acid; (b) exposing the first film; (c) developing the exposed first film using a developer containing an organic solvent to form a first negative pattern; (e) forming a second film on the substrate using an actinic ray-sensitive or radiation-sensitive resin composition (II) containing a resin of which solubility in a developer containing an organic solvent decreases due to polarity increased by an action of an acid; (f) exposing the second film; and (g) developing the exposed second film using a developer containing an organic solvent to form a second negative pattern in this order.
Abstract:
A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D).
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray sensitive or radiation sensitive resin composition which can provide a pattern having improved uniformity of coating film thickness and excellent size uniformity in the wafer surface on which the pattern has been formed by liquid immersion exposure, and a pattern forming method using the composition.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition contains: (A) a resin which has a repeating unit represented by the following general formula (A1) and increases its dissolution rate in an alkali developer by an action of an acid; (B) a compound which generates an acid by irradiation with actinic rays or radiation; and (C) a resin which comprises a repeating unit having a lactone structure substituted by a group having a fluorine atom. (In the formula, Rrepresents a hydrogen atom, an alkyl group, a fluoroalkyl group, a halogen atom or CHOH; Rrepresents an alkylene group, a cycloalkylene group or a bivalent connecting group that is formed by combining them; n represents an integer of 0-5; if n is 2 or more, a plurality of Rmay be the same or different.)
Abstract:
PROBLEM TO BE SOLVED: To provide an active ray-sensitive or radiation-sensitive resin composition having an effect of improving a spread bottom profile of a resist pattern, with which a pattern having few pattern collapse defects is formed, and to provide a method for forming a pattern by using the composition. SOLUTION: The composition includes (A) a resin the solubility of which with an alkali developing solution is increased by an action of an acid, (B) a compound generating an acid by irradiation with active rays or radiation, and (C) a resin containing at least either a fluorine atom or a silicon atom and containing a polarity conversion group that is decomposed by an action of an alkali developing solution to increases the solubility with the alkali developing solution, wherein the resin component (A) contains a repeating unit obtained from an ester compound expressed by general formula (1). In general formula (1), A 1 represents a polymerizable functional group having a carbon-carbon double bond; A 2 represents a divalent group selected from furan-diyl, tetrahydrofuran-diyl and oxanorbornan-diyl; R 1 and R 2 each independently represent a 1C-10C straight-chain, branched or cyclic monovalent hydrocarbon group; or R 1 and R 2 may be bonded to form an aliphatic hydrocarbon ring together with carbon atoms bonding thereto; and R 3 represents a 1C-10C straight-chain, branched or cyclic monovalent hydrocarbon group which may include a hydrogen atom or a hetero atom. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation:要解决的问题:提供一种具有改善抗蚀剂图案的扩散底部轮廓的效果的活性射线敏感或辐射敏感性树脂组合物,由此形成具有很少图案塌陷缺陷的图案,并提供 通过使用该组合物形成图案的方法。 该组合物包含(A)通过酸的作用使其与碱性显影液的溶解度增加的树脂,(B)通过用活性射线或辐射照射产生酸的化合物和(C )含有至少一个氟原子或硅原子的树脂,并含有通过碱性显影液的作用分解的极性转换基团以增加与碱性显影液的溶解度,其中树脂组分(A)含有 由通式(1)表示的酯化合物得到的重复单元。 在通式(1)中,A 1 SP>表示具有碳 - 碳双键的聚合性官能团; A 2 SP>表示选自呋喃二基,四氢呋喃 - 二基和氧杂二甘醇二基的二价基团; R 1 SP>和R 2 SP>各自独立地表示1C-10C直链,支链或环状的一价烃基; 或R 1 SP>和R 2 SP>可与键合的碳原子一起形成脂族烃环; R 3表示可以包含氢原子或杂原子的1C-10C直链,支链或环状的一价烃基。 版权所有(C)2011,JPO&INPIT