公开(公告)号：KR20200142088A

公开(公告)日：2020-12-21

申请号：KR20207034799

申请日：2019-04-23

Applicant: LAM RES CORP

Inventor： LILL THORSTEN ,  FISCHER ANDREAS ,  BERRY III IVAN L ,  DRAEGER NERISSA SUE ,  GOTTSCHO RICHARD A

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/311 ,  H01L21/324

Abstract: 열적에칭반응의에칭은머신러닝모델을사용하여예측된다. 미리결정된열적에칭반응의하나이상의반응경로들의에칭프로세스및 연관된에너지들의화학적특성들이양자역학시뮬레이션을사용하여식별된다. 에칭특성들을나타내는라벨들이미리결정된열적에칭반응의화학적특성들및 연관된에너지들과연관될수도있다. 머신러닝모델은상이한타입들의많은상이한에칭반응들에걸쳐독립변수들로서화학적특성들및 연관된에너지들및 종속변수들로서라벨들을사용하여트레이닝될수 있다. 신규열적에칭반응에대한화학적특성들및 연관된에너지들이머신러닝모델의입력들로서제공될때, 머신러닝모델은출력들로서신규열적에칭반응의에칭특성들을정확하게예측할수 있다.

公开(公告)号：EP2329521A4

公开(公告)日：2012-12-26

申请号：EP09816793

申请日：2009-09-23

Applicant: LAM RES CORP

Inventor： POVOLNY HENRY S ,  FISCHER ANDREAS

IPC: H01L21/368 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H05H1/34

CPC classification number: H01L21/67103 ,  H01J37/32642 ,  H01J37/32715 ,  H01J37/32724 ,  H01J2237/2001 ,  H01L21/67069 ,  H01L21/6831 ,  Y10T279/23 ,  Y10T403/21

公开(公告)号：EP2380412A4

公开(公告)日：2015-03-18

申请号：EP09837887

申请日：2009-12-16

Applicant: LAM RES CORP

Inventor： FISCHER ANDREAS ,  HUDSON ERIC

IPC: H05H1/34 ,  C23C16/455 ,  C23C16/458 ,  C23C16/509 ,  H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/32449 ,  H01J37/32532 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32816 ,  H01J37/3299 ,  H01L21/3065

公开(公告)号：EP1474264A4

公开(公告)日：2008-08-13

申请号：EP03739797

申请日：2003-02-14

Applicant: LAM RES CORP

Inventor： FISCHER ANDREAS ,  TRUSSEL DAVE ,  KENNEDY BILL ,  LOEWENHARDT PETER

IPC: H05H1/46 ,  H01J37/32 ,  H01L21/3065 ,  B23K10/00

CPC classification number: H01J37/32082 ,  H01J37/32623 ,  H01J37/32642

Abstract: The present invention includes a system and method for confining plasma within a plasma processing chamber. The plasma processing apparatus comprises a first electrode (152), a power generator (154), a second electrode (156), at least one confinement ring (166), and a ground extension (160) surrounding the first electrode (152). The first electrode (152) is configured to receive a workpiece and has an associated first electrode area. The power generator (154) is operatively coupled to the first electrode (152), and the power generator (154) is configured to generate RF power that is communicated to the first electrode (152). The second electrode (156) is disposed at a distance from the first electrode (152). The second electrode (156) is configured to provide a complete electrical circuit for RF power communicated from the first electrode (152). Additionally, the second electrode (156) has a second electrode area that is greater than the first electrode area. At least one confinement ring (166) is configured to assist confine the plasma.

公开(公告)号：EP1989007A4

公开(公告)日：2010-09-22

申请号：EP07751017

申请日：2007-02-16

Applicant: LAM RES CORP

Inventor： DHINDSA RAJINDER ,  SRINIVASAN MUKUND ,  TAKESHITA KENJI ,  MARAKHTANOV ALEXEI ,  FISCHER ANDREAS

IPC: C23C16/00

CPC classification number: H01J37/32862 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32642

公开(公告)号：EP2380413A4

公开(公告)日：2015-12-02

申请号：EP09837888

申请日：2009-12-16

Applicant: LAM RES CORP

Inventor： FISCHER ANDREAS ,  HUDSON ERIC

IPC: H05H1/36 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32623 ,  H01J37/32091

Abstract: A plasma processing system for processing at least a substrate with plasma. The plasma processing chamber is capable of controlling ion energy distribution. The plasma processing system may include a first electrode. The plasma processing system also includes a second electrode that is different from the first electrode and is configured for bearing the substrate. The plasma processing system may also include a signal source coupled with the first electrode. The signal source may provide a non-sinusoidal signal through the first electrode to control ion energy distribution at the substrate when the substrate is processed in the plasma processing system, wherein the non-sinusoidal signal is periodic.

公开(公告)号：EP2417626A4

公开(公告)日：2014-08-06

申请号：EP10762275

申请日：2010-04-06

Applicant: LAM RES CORP

Inventor： MARAKHTANOV ALEXEI ,  DHINDSA RAJINDER ,  KOSHIISHI AKIRA ,  FISCHER ANDREAS

IPC: H01L21/3065 ,  C23C16/509 ,  H01J37/32 ,  H05H1/34 ,  H05H1/36

CPC classification number: H01L21/2633 ,  C23C16/5096 ,  H01J37/32091 ,  H01J37/32165 ,  H01J37/32174 ,  H01J37/32532 ,  H01J37/32577

Abstract: A plasma processing system for use with a gas. The plasma processing system comprises a first electrode, a second electrode, a gas input port, a power source and a passive circuit. The gas input port is operable to provide the gas between the first electrode and the second electrode. The power source is operable to ignite plasma from the gas between the first electrode and the second electrode. The passive circuit is coupled to the second electrode and is configured to adjust one or more of an impedance, a voltage potential, and a DC bias potential of the second electrode. The passive radio frequency circuit comprises a capacitor arranged in parallel with an inductor.

公开(公告)号：EP1765541A4

公开(公告)日：2010-03-31

申请号：EP05761079

申请日：2005-06-14

Applicant: LAM RES CORP

Inventor： WIEPKING MARK ,  LYNDAKER BRADFORD J ,  KUTHI ANDRAS ,  FISCHER ANDREAS

IPC: B23K9/00 ,  B23K9/02

CPC classification number: H01J37/32009 ,  H01J37/32082 ,  H01J37/32706

公开(公告)号：EP1706898A4

公开(公告)日：2010-01-20

申请号：EP04818010

申请日：2004-12-10

Applicant: LAM RES CORP

Inventor： FISCHER ANDREAS ,  LOEWENHARDT PETER

IPC: H01L21/306 ,  B24B5/00 ,  B24B29/00 ,  B24B37/04 ,  B24B41/06 ,  C23F1/02 ,  H01J37/32 ,  H01L21/00 ,  H01L21/687

CPC classification number: H01L21/68735 ,  H01J37/32642 ,  H01L21/67069

公开(公告)号：JP2012043796A

公开(公告)日：2012-03-01

申请号：JP2011179198

申请日：2011-08-18

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： FISCHER ANDREAS ,  WILLIAM S KENNEDY ,  LOEWENHARDT PETER ,  TRUSSEL DAVID

IPC: H05H1/46 ,  C23C16/509 ,  C25B11/00 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  H01L21/31

CPC classification number: H01J37/32541 ,  H01J37/32009

Abstract: PROBLEM TO BE SOLVED: To provide a multi-part upper electrode for a semiconductor processing reactor with a replaceable portion and a method of replacing a portion of the electrode.SOLUTION: A replaceable electrode comprises: a ring shaped backing plate 116; a plurality of electrode segments 114 forming a ring shaped electrode; an electrically conductive elastomer securing the plurality of electrode segments 114 to the ring shaped backing plate 116, in which the plurality of electrode segments 114 form a ring having an inner diameter of about 12 inches (30.48 centimeter) and an inner edge 140 with an inclined surface, and the ring shaped backing plate 116 can be attached onto a top plate 118 in a plasma reaction chamber with a plurality of threaded screws 134, 136 extending into the ring shaped backing plate 116 from the back surface of the top pate 118.

Abstract translation: 要解决的问题：提供具有可替换部分的半导体处理反应器的多部分上电极以及替换部分电极的方法。 解决方案：可替换电极包括：环形背板116; 形成环形电极的多个电极段114; 将多个电极段114固定到环形背板116的导电弹性体，其中多个电极段114形成具有约12英寸（30.48厘米）的内径的环和具有倾斜的内边缘140 表面，并且环形背板116可以被附接到等离子体反应室中的顶板118上，其中多个螺纹螺钉134,136从顶板118的后表面延伸到环形背板116中。 P>版权所有（C）2012，JPO＆INPIT