公开(公告)号：KR20200142088A

公开(公告)日：2020-12-21

申请号：KR20207034799

申请日：2019-04-23

Applicant: LAM RES CORP

Inventor： LILL THORSTEN ,  FISCHER ANDREAS ,  BERRY III IVAN L ,  DRAEGER NERISSA SUE ,  GOTTSCHO RICHARD A

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/311 ,  H01L21/324

Abstract: 열적에칭반응의에칭은머신러닝모델을사용하여예측된다. 미리결정된열적에칭반응의하나이상의반응경로들의에칭프로세스및 연관된에너지들의화학적특성들이양자역학시뮬레이션을사용하여식별된다. 에칭특성들을나타내는라벨들이미리결정된열적에칭반응의화학적특성들및 연관된에너지들과연관될수도있다. 머신러닝모델은상이한타입들의많은상이한에칭반응들에걸쳐독립변수들로서화학적특성들및 연관된에너지들및 종속변수들로서라벨들을사용하여트레이닝될수 있다. 신규열적에칭반응에대한화학적특성들및 연관된에너지들이머신러닝모델의입력들로서제공될때, 머신러닝모델은출력들로서신규열적에칭반응의에칭특성들을정확하게예측할수 있다.

公开(公告)号：WO0203415A3

公开(公告)日：2002-05-23

申请号：PCT/US0118623

申请日：2001-06-08

Applicant: LAM RES CORP ,  GOTTSCHO RICHARD A ,  STEGER ROBERT J

Inventor： GOTTSCHO RICHARD A ,  STEGER ROBERT J

IPC: H05H1/46 ,  B01J4/00 ,  B01J19/08 ,  C23C16/50 ,  C23C16/52 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01J37/321 ,  H01J37/3244

Abstract: A component delivery mechanism for distributing a component inside a process chamber is disclosed. The component is used to process a work piece within the process chamber. The component delivery mechanism includes a plurality of component outputs for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switch coupled to the plurality of component outputs. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component outputs. The component delivery mechanism also includes a single component source coupled to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.

Abstract translation: 公开了一种用于在处理室内分配组件的组件传送机构。 该部件用于处理加工室内的工件。 部件输送机构包括用于将部件输出到处理室的期望区域的多个部件输出。 部件传送机构还包括耦合到多个部件输出的空间分配开关。 空间分布开关被布置用于将部件引导到多个分量输出中的至少一个。 组件传送机构还包括耦合到空间分配开关的单个组件源。 单组分源被安排用于将组分提供给空间分布开关。

公开(公告)号：EP1831807A4

公开(公告)日：2009-12-02

申请号：EP05789224

申请日：2005-08-19

Applicant: LAM RES CORP

Inventor： BENJAMIN NEIL ,  GOTTSCHO RICHARD A ,  BRIGHT NICOLAS ,  STEGER ROBERT

IPC: G06F19/00 ,  G05B19/418

CPC classification number: G01R31/3187 ,  G05B19/4184 ,  G05B2219/31362 ,  G05B2219/31463 ,  Y02P90/14 ,  Y02P90/86

公开(公告)号：JP2010282636A

公开(公告)日：2010-12-16

申请号：JP2010156714

申请日：2010-07-09

Applicant: Lam Res Corp ,  ラム リサーチ コーポレイション

Inventor： BARONE MARIA E ,  GOTTSCHO RICHARD A ,  VAHEDI VAHID

IPC: C23C14/54 ,  G06Q10/00 ,  C23C16/52 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01J37/32935

Abstract: PROBLEM TO BE SOLVED: To provide a method for predicting a processing surface profile predicting a process surface profile that a given plasma process will create on a process substrate. SOLUTION: In this method, test values of input variables are selected (200), plasma is modeled (210), results of a test process of the substrate surface profile are substantially predicted by using the result in 210 and substrate parameters given in 200 (220), initial values of the surface profile model related to the input variables and unknown coefficients are obtained (230), instructions for difference between the test surface profile and the substantial profile predicted value are generated, and optimum values of unknown coefficients for minimizing the instructions for difference are generated. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种预测处理表面轮廓的方法，该处理表面轮廓预测给定等离子体处理将在处理衬底上产生的工艺表面轮廓。

解决方案：在此方法中，选择输入变量的测试值（200），对等离子体进行建模（210），通过使用210中的结果和给定的衬底参数，基本上预测了衬底表面轮廓的测试过程的结果 在200（220）中，获得与输入变量和未知系数相关的表面轮廓模型的初始值（230），产生测试表面轮廓和实际轮廓预测值之间的差异指令，并且产生未知系数的最佳值 生成差异指令的最小化。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：SG10201705049VA

公开(公告)日：2018-01-30

申请号：SG10201705049V

申请日：2017-06-19

Applicant: LAM RES CORP

Inventor： SRIRAMAN SARAVANAPRIYAN ,  WISE RICHARD ,  SINGH HARMEET ,  PATERSON ALEX ,  BAILEY III ANDREW D ,  VAHEDI VAHID ,  GOTTSCHO RICHARD A

Abstract: Disclosed are methods of generating a proximity-corrected design layout for photoresist to be used in an etch operation. The methods may include identifying a feature in an initial design layout, and estimating one or more quantities characteristic of an in-feature plasma flux (IFPF) within the feature during the etch operation. The methods may further include estimating a quantity characteristic of an edge placement error (EPE) of the feature by comparing the one or more quantities characteristic of the IFPF to those in a look-up table (LUT, and/or through application of a multivariate model trained on the LUT, e.g., constructed through machine learning methods (MLM)) which associates values of the quantity characteristic of EPE with values of the one or more quantities characteristics of the IFPF. Thereafter, the initial design layout may be modified based on at the determined quantity characteristic of EPE.

公开(公告)号：AT293840T

公开(公告)日：2005-05-15

申请号：AT99907143

申请日：1999-02-18

Applicant: LAM RES CORP

Inventor： BARONE MARIA E ,  GOTTSCHO RICHARD A ,  VAHEDI VAHID

IPC: C23C14/54 ,  C23C16/52 ,  G06F19/00 ,  H01J37/32

Abstract: A method and apparatus for calibrating a semi-empirical process simulator used to determine process values in a plasma process for creating a desired surface profile on a process substrate includes providing a test model which captures all mechanisms responsible for profile evolution in terms of a set of unknown surface parameters. A set Sets of test conditions processes is are derived for which the profile evolution is governed by only a limited number of parameters. For each set of test conditions process, model test values are selected and a test substrate is substrates are actually subjected to a the test process processes defined by the test values, thereby creating a test surface profile profiles. The test values are used to generate an approximate profile prediction predictions and are adjusted to minimize the discrepancy between the test surface profile profiles and the approximate profile prediction predictions, thereby providing a final model of the profile evolution in terms of the process values.

公开(公告)号：AU6827501A

公开(公告)日：2002-01-14

申请号：AU6827501

申请日：2001-06-08

Applicant: LAM RES CORP

Inventor： GOTTSCHO RICHARD A ,  STEGER ROBERT J

IPC: H05H1/46 ,  B01J4/00 ,  B01J19/08 ,  C23C16/50 ,  C23C16/52 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  H01J37/00

Abstract: A component delivery mechanism for distributing a component inside a process chamber is disclosed. The component is used to process a work piece within the process chamber. The component delivery mechanism includes a plurality of component outputs for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switch coupled to the plurality of component outputs. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component outputs. The component delivery mechanism also includes a single component source coupled to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.