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    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS
    1.
    发明申请
    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS 审中-公开
    用于等离子体加工釜的等离子体配料环组件

    公开(公告)号：WO2012039744A3

    公开(公告)日：2012-08-23

    申请号：PCT/US2011001501

    申请日：2011-08-25

    Applicant: LAM RES CORP ,  DE LA LLERA ANTHONY ,  CARMAN DAVID ,  TAYLOR TRAVIS R ,  ULLAL SAURABH J ,  SINGH HARMEET

    Inventor： DE LA LLERA ANTHONY ,  CARMAN DAVID ,  TAYLOR TRAVIS R ,  ULLAL SAURABH J ,  SINGH HARMEET

    IPC: H01L21/3065

    CPC classification number: H01L21/67069

    Abstract: A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.

    Abstract translation: 可以使用具有单个可移动下环的等离子体约束环组件来控制电容耦合等离子体反应室中的晶片面积压力，其中晶片被支撑在下部电极组件上，并且处理气体通过上部喷头电极组件 。 组件包括上环，下环，吊架，衣架盖，间隔套和垫圈。 下环由吊架支撑，并且当在上下电极之间的间隙调节期间垫圈与下电极组件接触时，可以朝向上环移动。 衣架帽接合衣架的上端，并安装在上环的衣架孔的上部。 间隔套环绕悬挂架的下部并且安装在衣架孔的下部。 垫圈安装在衣架的扩大头部和下环的下表面之间。 间隔套的尺寸被设计成避免在提升下环期间摩擦挂钩孔的内表面。

    COMPONENTS FOR A PLASMA PROCESSING APPARATUS
    2.
    发明申请
    COMPONENTS FOR A PLASMA PROCESSING APPARATUS 审中-公开
    等离子体处理设备的组件

    公开(公告)号：WO2008063324A3

    公开(公告)日：2008-07-31

    申请号：PCT/US2007022027

    申请日：2007-10-16

    Applicant: LAM RES CORP ,  DE LA LLERA ANTHONY ,  ULLAL SAURABH J

    Inventor： DE LA LLERA ANTHONY ,  ULLAL SAURABH J

    IPC: H05H1/34

    CPC classification number: H01J37/32449 ,  H01J37/32009 ,  H01J37/32541 ,  H01J37/3255

    Abstract: Components for a plasma processing apparatus are provided, including fastener members adapted to accommodate the stresses generated during thermal cycling. The fasteners include deflectable spacers to accommodate forces generated by the difference in thermal expansion while minimizing generation of additional particulate contamination.

    Abstract translation: 提供了用于等离子体处理设备的部件，包括适于适应在热循环期间产生的应力的紧固件部件。 紧固件包括可偏转垫片以适应由热膨胀差异产生的力，同时最小化附加微粒污染的产生。

    HIGH PRESSURE WAFER-LESS AUTO CLEAN FOR ETCH APPLICATIONS
    3.
    发明申请
    HIGH PRESSURE WAFER-LESS AUTO CLEAN FOR ETCH APPLICATIONS 审中-公开
    高压无刷自动清洗用于蚀刻应用

    公开(公告)号：WO02091453A9

    公开(公告)日：2003-07-03

    申请号：PCT/US0214102

    申请日：2002-05-03

    Applicant: LAM RES CORP ,  SINGH HARMEET ,  DAUGHERTY JOHN E ,  ULLAL SAURABH J

    Inventor： SINGH HARMEET ,  DAUGHERTY JOHN E ,  ULLAL SAURABH J

    IPC: B08B7/00 ,  H01J37/32 ,  H01L21/3213

    CPC classification number: H01J37/32467 ,  B08B7/00 ,  H01J37/321 ,  H01J37/32862 ,  H01J37/32935

    Abstract: A method for cleaning a processing chamber is provided. The method initiates with introducing a fluorine containing gaseous mixture into a processing chamber. Then, a plasma is created from the fluorine containing gaseous mixture in the processing chamber. Next, a chamber pressure is established that corresponds to a threshold ion energy in which ions of the plasma clean inner surfaces of the processing chamber without leaving a residue. A method for substantially eliminating residual aluminum fluoride particles deposited by an in-situ cleaning process for a semiconductor processing chamber and a plasma processing system for executing an in-situ cleaning process are also provided.

    Abstract translation: 提供了一种用于清洁处理室的方法。 该方法通过将含氟气体混合物引入处理室来启动。 然后，从处理室中的含氟气体混合物产生等离子体。 接下来，建立对应于阈值离子能量的室压力，其中等离子体的离子清洁处理室的内表面而不留下残留物。 还提供了用于基本上消除通过用于半导体处理室的原位清洁工艺沉积的残余氟化铝颗粒的方法和用于执行原位清洁工艺的等离子体处理系统。

    QUARTZ GUARD RING
    4.
    发明专利
    QUARTZ GUARD RING 未知

    公开(公告)号：SG175648A1

    公开(公告)日：2011-11-28

    申请号：SG2011075967

    申请日：2007-10-16

    Applicant: LAM RES CORP

    Inventor： LARSON DEAN J ,  BROWN DANIEL ,  ULLAL SAURABH J

    Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper electrode, a backing member attachable to an upper surface of the upper electrode, and an outer ring. The outer ring surrounds an outer surface of the backing member and is located above the upper surface of the upper electrode.Figure 1

    COMPONENTS FOR A PLASMA PROCESSING APPARATUS
    6.
    发明专利
    COMPONENTS FOR A PLASMA PROCESSING APPARATUS 未知

    公开(公告)号：SG175637A1

    公开(公告)日：2011-11-28

    申请号：SG2011075496

    申请日：2007-10-16

    Applicant: LAM RES CORP

    Inventor： DE LA LLERA ANTHONY ,  ULLAL SAURABH J

    Abstract: COMPONENTS FOR A PLASMA PROCESSING APPARATUS AbstractComponents for a plasma processing apparatus are provided, including fastener members adapted to accommodate the stresses generated during thermal cycling. The fasteners include deflectable spacers to accommodate forces generated by the difference in thermal expansion while minimizing generation of additional particulate contamination.Figure 1

    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS
    7.
    发明专利
    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS 未知

    公开(公告)号：SG188600A1

    公开(公告)日：2013-04-30

    申请号：SG2013020268

    申请日：2011-08-25

    Applicant: LAM RES CORP

    Inventor： DE LA LLERA ANTHONY ,  CARMAN DAVID ,  TAYLOR TRAVIS R ,  ULLAL SAURABH J ,  SINGH HARMEET

    Abstract: A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.

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