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公开(公告)号:GB2320365A
公开(公告)日:1998-06-17
申请号:GB9723884
申请日:1997-11-12
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: YURI MASAAKI , UEDA TETSUZO , BABA TAKAAKI
IPC: H01L29/12 , H01L21/20 , H01L21/203 , H01L21/205 , H01S5/323 , C23C16/34 , C30B25/02 , C30B29/38 , C30B29/40 , H01L33/00
Abstract: A method of manufacturing a semiconductor device comprising a homogeneous and highly reproducible gallium nitride crystal, comprises the steps of forming a zinc oxide layer 2 on a monocrystalline substrate 1, e.g. sapphire, forming a first gallium nitride crystal 4 in a temperature range from 0{C to 900{C, and forming a second gallium nitride crystal 5 in a temperature range from 900{C to 2000{C. Both crystals 4 and 5 may be formed by VPE, or the crystal 4 may be formed by sputtering and the crystal 5 by VPE.
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公开(公告)号:DE60004722D1
公开(公告)日:2003-10-02
申请号:DE60004722
申请日:2000-04-13
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: YURI MASAAKI , IMAFUJI OSAMU , NAKAMURA SHINJI , ISHIDA MASAHIRO , ORITA KENJI
IPC: H01L21/20 , H01L21/205 , H01L31/18 , H01L33/00
Abstract: The present invention provides a method for producing a group III nitride compound semiconductor substrate including: (a) forming a first semiconductor film over a substrate, the first semiconductor film made of a first group III nitride compound semiconductor and provided with a step; (b) forming a second semiconductor film made of a second group III nitride compound semiconductor having a different thermal expansion coefficient from that of the first group III nitride compound semiconductor on the first semiconductor film; and (c) cooling the substrate and separating the second semiconductor film from the first semiconductor film. Thus, a large-area group III nitride compound semiconductor substrate can be produced in high yields and with high reproducibility.
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公开(公告)号:DE60004722T2
公开(公告)日:2004-06-17
申请号:DE60004722
申请日:2000-04-13
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: YURI MASAAKI , IMAFUJI OSAMU , NAKAMURA SHINJI , ISHIDA MASAHIRO , ORITA KENJI
IPC: H01L21/20 , H01L21/205 , H01L31/18 , H01L33/00
Abstract: The present invention provides a method for producing a group III nitride compound semiconductor substrate including: (a) forming a first semiconductor film over a substrate, the first semiconductor film made of a first group III nitride compound semiconductor and provided with a step; (b) forming a second semiconductor film made of a second group III nitride compound semiconductor having a different thermal expansion coefficient from that of the first group III nitride compound semiconductor on the first semiconductor film; and (c) cooling the substrate and separating the second semiconductor film from the first semiconductor film. Thus, a large-area group III nitride compound semiconductor substrate can be produced in high yields and with high reproducibility.
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公开(公告)号:DE19751294A1
公开(公告)日:1998-06-04
申请号:DE19751294
申请日:1997-11-19
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: YURI MASAAKI , UEDA TETSUZO , BABA TAKAAKI
IPC: H01L29/12 , H01L21/20 , H01L21/203 , H01L21/205 , H01S5/323
Abstract: To present a manufacturing method of semiconductor device capable of forming a homogeneous and highly reproducible gallium nitride crystal, comprising the steps of forming a zinc oxide layer on a monocrystalline substrate, forming a first gallium nitride crystal in a temperature range from 0 DEG C. to 900 DEG C., and forming a second gallium nitride crystal in a temperature range from 900 DEG C. to 2000 DEG C.
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公开(公告)号:GB2320365B
公开(公告)日:2002-01-02
申请号:GB9723884
申请日:1997-11-12
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: YURI MASAAKI , UEDA TETSUZO , BABA TAKAAKI
IPC: H01L29/12 , H01L21/20 , H01L21/203 , H01L21/205 , H01S5/323 , C23C16/34 , C30B25/02 , C30B29/38 , C30B29/40 , H01L33/00
Abstract: To present a manufacturing method of semiconductor device capable of forming a homogeneous and highly reproducible gallium nitride crystal, comprising the steps of forming a zinc oxide layer on a monocrystalline substrate, forming a first gallium nitride crystal in a temperature range from 0 DEG C. to 900 DEG C., and forming a second gallium nitride crystal in a temperature range from 900 DEG C. to 2000 DEG C.
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公开(公告)号:JP2000200946A
公开(公告)日:2000-07-18
申请号:JP30171299
申请日:1999-10-22
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: NAKAMURA SHINJI , YURI MASAAKI , ORITA KENJI
Abstract: PROBLEM TO BE SOLVED: To manufacture a highly precise waveguide structure with good control and thereby enable single transverse mode oscillation, by forming a second conductive type first semiconductor layer, whose Al composition ratio is smaller than that of a first conductive type etching stop layer on the etch stopping layer. SOLUTION: Since an etch stopping layer 17 whose Al composition ratio is larger than that of an n-type current blocking layer 12 is formed immediately below the n-type current blocking layer 12, etching of the n-type current blocking layer 12 can be blocked in the etch stopping layer 17. Therefore, it is possible to accurately and uniformly control the etching depth of the n-type current blocking layer 12 and to obtain a waveguide structure which is more precise than a conventional one. A first p-type clad layer 8 whose Al composition ratio is smaller than that of the etch stopping layer 17 is formed immediately below the etching stop layer 17. Since the lower the Al composition ratio is, the is larger the refractive index, therefore, light confinement can be carried out well in this structure.
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公开(公告)号:JP2000049410A
公开(公告)日:2000-02-18
申请号:JP9851799
申请日:1999-04-06
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: ITO KUNIO , YURI MASAAKI , ISHIDA MASAHIRO , HASHIMOTO TADAO
Abstract: PROBLEM TO BE SOLVED: To provide a nitride semiconductor laser device of a long service life provided with high reliability. SOLUTION: In this device 100, protective layers 20a and 20b provided on the laser end face of a nitride semiconductor laser diode 10 are composed of Al1-x-y-zGaxInyBzN (0
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公开(公告)号:JP2000031537A
公开(公告)日:2000-01-28
申请号:JP12214199
申请日:1999-04-28
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: ISHIDA MASAHIRO , KONDO OSAMU , YURI MASAAKI , ITO KUNIO
Abstract: PROBLEM TO BE SOLVED: To improve characteristic of a semiconductor device by reducing nitrogen vacancy in a semiconductor layer, in a semiconductor device using a semiconductor layer composed of nitride. SOLUTION: A semiconductor layer 8 composed of GaN containing arsenic is formed on a substrate 7, and a semiconductor element which is an active element such as a field effect transistor and a bipolar transistor, or a passive element such as a capacitor and a resistor is formed on the semiconductor layer 8. Concerning quantities of nitrogen and arsenic contained in compound forming the semiconductor layer 8, quantity of nitrogen is made greater than that of arsenic.
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公开(公告)号:JPH10341036A
公开(公告)日:1998-12-22
申请号:JP7529598
申请日:1998-03-24
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: HASHIMOTO TADAO , YURI MASAAKI , KONDO OSAMU , ISHIDA MASAHIRO
IPC: H01L21/20 , H01L21/338 , H01L29/812 , H01L33/12 , H01L33/32 , H01L33/34 , H01S5/00 , H01S5/323 , H01L33/00 , H01S3/18
Abstract: PROBLEM TO BE SOLVED: To greatly reduce dislocations which pierce a compd. semiconductor crystal layer formed on a substrate. SOLUTION: A substrate A for a light emitting diode comprises a sapphire substrate 10, an undoped GaN buffer layer 11 formed thereon, and an n-type compd. semiconductor crystal layer 12 formed thereon. A device structure B of the light emitting diode comprises a first n-type GaN clad layer 13 having p-type electrodes 17 thereon, an undoped In0.2 Ga0.8 N active layer 14 and a second p-type GaN clad layer 15 having n-type electrodes 16 thereon, formed in this order on the crystal layer 12. Trapezoidal recesses 18 are formed at regions facing the electrodes 16 on the substrate 10, and an upper part 10a of each recess 18 has a thickness which is not greater than that of the first clad layer 13.
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公开(公告)号:JPH10190126A
公开(公告)日:1998-07-21
申请号:JP34695196
申请日:1996-12-26
Applicant: MATSUSHITA ELECTRONICS CORP
Inventor: TAKAYAMA TORU , KONDO OSAMU , YURI MASAAKI , YOSHIKAWA AKIO
Abstract: PROBLEM TO BE SOLVED: To prevent a semiconductor laser device which has a small oscillation threshold current value and a small operating current value, can prevent the deterioration of its temperature characteristic, and does not produce high noise. SOLUTION: A semiconductor laser is constituted by successively forming a first light guide layer 5 composed of InV1 (Ga1- Y1 AlY1 )1- V1 P of a first conductivity, a second light guide layer 6 composed of Ga1- Y2 AlY2 As of the first conductivity, a current blocking layer 7 which has a current passing window 7a and is composed of Ga1- ZAlZAs of a second conductivity, and a third light guide layer 8 which is composed of Ga1- Y3 AlY3 As of the first conductivity and fills up the current passing window 7a of the current blocking layer 7 on an active layer 4 composed of InV(Ga1- XAlX)1- VP, where V, V1, X, Y1, Y2, Y3, and Z are respectively set to satisfy the following relations: 0.45
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