A METHOD OF FABRICATING A GAS SENSOR

    公开(公告)号:MY185758A

    公开(公告)日:2021-06-04

    申请号:MYUI2012700426

    申请日:2012-07-02

    Applicant: MIMOS BERHAD

    Abstract: A method of fabricating a gas sensor with a conductive sensing element on a microhotplate (102) is provided, the method includes the steps of fabricating a microhotplate (102) on silicon, fabricating a nanostructured sensor on the microhotplate (102) by growing of conductive nanotubes (110) or nanowires with metal catalyst and functionalising the conductive nanotubes or nanowires, wherein step the nanotubes (110) or nanowires are functionalised with metal oxides selected from a group consisting and not limited to tin oxide (SnO2), tungsten oxide (WOx), tantalum pent-oxide (Ta2O5), aluminium oxide (Al2O3) copper oxide (CuO), iron oxide (Fe2O3), titanium oxide (TiO), Neodymium Oxide (Nd2O3) and zinc oxide (ZnO). (Figure 2)

    ISFET DEVICE WITH MEMBRANE
    6.
    发明专利

    公开(公告)号:MY178129A

    公开(公告)日:2020-10-05

    申请号:MYPI2010700079

    申请日:2010-10-29

    Applicant: MIMOS BERHAD

    Abstract: The present invention provides an ISFET sensor device and a method to fabricate the ISFET sensor device with nanostructured membrane which will improve the sensitivity and efficiency of the device. The nanostructures can be in unlimited shape or design, in the form of nanowires, nanorings or nanoparticles, fabricated with the function to increase the sensor sensitivity by increasing the surface area of the membrane exposed to the sample solution or electrolyte. The nanostructured membrane can be formed either by nanofabrication techniques which includes lithographic patterning, pattern transfer, thin film deposition and etching methods or by spin coating of nanomaterials and nanowires using various materials, not limited to, such as, Si3N4 [32], polysilicon [34] and metallic nanowires.

    VALVELESS MICROPUMP
    7.
    发明专利

    公开(公告)号:MY170998A

    公开(公告)日:2019-09-23

    申请号:MYPI20085246

    申请日:2008-12-23

    Applicant: MIMOS BERHAD

    Abstract: The present invention provides a valveless micropump (100) comprises an inlet (110) and. an outlet ( 112); a reservoir (120) positioned between the inlet ( 110) and the outlet (112), the reservoir (120) having a chamber (130) defined therein, and the inlet (110) and the outlet (112) having a fluid communication with the chamber (130) through a respective diffuser (106, 108) serving as the valveless feature; and a fluid driving means defines at the reservoir (120), the fluid driving means operably drives fluid from the inlet (100) to the outlet (112) through the diffuser (106), the chamber (130) and the diffuser (108) accordingly.

    CONTACT ETCH FOR AMS PRODUCTS
    9.
    发明专利

    公开(公告)号:MY162269A

    公开(公告)日:2017-05-31

    申请号:MYPI20072068

    申请日:2007-11-22

    Applicant: MIMOS BERHAD

    Abstract: THIS INVENTION PROVIDES A METHOD TO IMPROVE METAL STEP COVERAGE IN CONTACT HOLE FILLING BY UTILIZING TWO STEP CONTACT ETCH. THE CONTACT ETCH PROCESS PROVIDES A SEMI-ROUNDED PROFILE ON THE TOP HALF OF THE CONTACT HOLE AND A STRAIGHT PROFILE AT THE LOWER HALF. THE SEMI-ROUNDED CONTACT ETCH PROCESS IS ABLE TO REDUCE THE ASPECT RATIO TO 1.

    INSULATION METHOD FOR MICROMECHANICAL DEVICE
    10.
    发明申请
    INSULATION METHOD FOR MICROMECHANICAL DEVICE 审中-公开
    微机械装置的绝缘方法

    公开(公告)号:WO2009072860A3

    公开(公告)日:2009-08-20

    申请号:PCT/MY2008000175

    申请日:2008-12-05

    CPC classification number: F04B43/046 B81B7/0012 F04B53/08 H01L21/316

    Abstract: A method of insulating a micromechanical wafer with a dielectric layer over said micromechanical wafer using a spinning technique. The dielectric layer is then heated to remove water and cured the layer of the micromechanical device to provide a protective coating to the micromechanical device.

    Abstract translation: 一种使用旋转技术使具有介电层的微机械晶片在所述微机械晶片上绝缘的方法。 然后加热电介质层以去除水并固化微机械装置的层以向微机械装置提供保护涂层。

Patent Agency Ranking