Abstract:
PROBLEM TO BE SOLVED: To improve the ESD protection of an electronic element. SOLUTION: This method and circuit structure is for reforming the effect of protection of an ESD in circuit structure made in a semiconductor substrate, covered with the epitaxial layer 3 which is equipped with at least one ESD protecting lateral bipolar transistor 5 formed at the surface of the epitaxial layer 3, and a circuit structure so as to form a well 4 which is isolated from a substrate 2 under the transistor 5. The bipolar transistor 5 is completely isolated from the substrate 2 by first (10) and second (11) n-type wells which extend downward from the epitaxial layer 3 to the embedded well 4 and in contact with it. COPYRIGHT: (C)1999,JPO
Abstract:
PURPOSE: To make a programming line voltage the function of the actual length of a memory cell by incorporating a circuit element to a voltage adjuster. CONSTITUTION: The voltage adjuster 3 is provided with a gain stage, which is provided with an input terminal connected to the voltage divider 6 of a programming voltage VPP and an output terminal U connected with he programming line 5 of at least one memory cell 2 and supplied with programming voltage VPP. In addition at least one circuit element capable of suiting a programming line voltage to the length of the memory cell 2 is provided. The circuit element is the voltage divider 6 of the programming voltage VPP and is provided with variable resistance values R1 to R3.
Abstract:
PURPOSE: To obtain a memory device endurable in a gain reduction. CONSTITUTION: Column and/or row address decode means RDEC, CDEC comprise at least one address mapping nonvolatile memory NVM. A read and write control logic part CL comprises identifying means TST designed so as to identify a cell fail in a column and/or a row of a matrix MAT of a memory device; and means WM for writing an address corresponding to a column and/or a row RID existing in the matrix MAT on the nonvolatile memory NVM during normal operations, and cell characteristics can readily and effectively be decided.
Abstract:
PURPOSE: To make the voltage drop of a circuit element the function of the actual length of a memory cell by incorporating the circuit element to a voltage adjuster. CONSTITUTION: The voltage adjuster 3 is provided with a gain stage, which is provided with an input terminal connected to the voltage divider 6 of a programming voltage VPP and an output terminal U connected with the programming line 5 of at least one memory cell 2 and supplied with programming voltage VPP. In addition at least one circuit element 4 compensating the fluctuation of a percentage by a programming line voltage for the length of the memory cell 2 is provided.
Abstract:
A method and a related circuit structure are described for improving the effectiveness of ESD protection in circuit structures realized in a semiconductor substrate overlaid with an epitaxial layer and including at least one ESD protection lateral bipolar transistor realized in the surface of the epitaxial layer. The method consists of forming under the transistor an isolating well that isolates the transistor from the substrate. Advantageously, the transistor can be fully isolated from the substrate by first and second N wells which extend from the surface of the epitaxial layer down to and in contact with the buried well.
Abstract:
A sealing method for electronic devices such as flash memory cells (4) and CMOS transistors (5) formed on a common semiconductor substrate (1) comprising the steps of:forming at least a first conductive layer (7,9) on a first portion of semiconductor substrate (1),forming a second conductive layer (11) on a second portion of semiconductor substrate (1),defining a first plurality of gate regions (4a) of the memory cells (4) in at least a first conductive layer (7),forming a first sealing layer (14) on the whole semiconductor substrate (1) to seal the first plurality of gate regions (4a),defining a second plurality of gate regions (5a) of the CMOS transistors (5) in the second conductive layer (11),forming a second sealing layer (16) on the whole semiconductor substrate (1) to seal the second plurality of gate regions (5a).
Abstract:
A voltage regulator for electrically programmable non-volatile semiconductor memory devices of the type comprising a gain stage (3), supplied by a programming voltage (Vpp) and having an input terminal connected to a divider (6) of said programming voltage (Vpp) and an output terminal (U) connected to a programming line (5) of at least one memory cell (2) comprises at least one circuit element (4) capable of adapting the line programming voltage (5) to the length (L) of the memory cell (2). This solution makes it possible to have on the bit line of the memory device a drain voltage varying according to the actual length of the memory cell.